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11. 发明申请

US20120133268A1 AIRTIGHT MULTI-LAYER ARRAY TYPE LED 有权
标题翻译： AIRTIGHT多层阵列LED
公开(公告)号：US20120133268A1
公开(公告)日：2012-05-31
申请号：US12957378
申请日：2010-11-30
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01J1/62
CPC分类号： F21V31/00 , F21K9/64 , F21V29/507 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/507 , H01L33/56 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： An airtight multi-layer array type LED is disclosed, which comprises a metal substrate with an airtight metal frame formed thereon, and the metal substrate is integrally formed with the airtight metal frame, and an airtight sealing frame slot is formed around the upper surface of the airtight metal frame, the airtight metal frame is installed with two sets of sealing through hole pairs accommodating the lead frames. The interior of the airtight metal frame can be installed with packaging materials or optical components. The sealing holes are sealed with a glass or ceramic material. A fluorescent layer is formed on a silica gel layer, wherein the fluorescent layer can also be installed inside a silica glass package cover. The silica glass package cover is installed on the top surface of the airtight metal frame, and the silica glass package cover is engaged and sealed to a sealing rack. Nitrogen is filled in a space defined between the silica glass package cover and the fluorescent layer, so that moisture is prevented from permeating through the airtight metal frame and a dice protection layer. As such, a sealed-type LED packaging structure is formed and is suitable to be used in extreme or severe environments.
摘要翻译：公开了一种气密的多层阵列型LED，其包括形成有气密金属框架的金属基板，并且金属基板与气密金属框架一体形成，并且气密密封框槽形成在气密金属框架，气密金属框架安装有两组容纳引线框架的密封通孔对。气密金属框架的内部可以安装包装材料或光学元件。密封孔用玻璃或陶瓷材料密封。在硅胶层上形成荧光层，其中荧光层也可以安装在石英玻璃封装盖的内部。石英玻璃封装盖安装在气密金属框架的顶表面上，石英玻璃封装盖接合并密封到密封架上。氮气填充在石英玻璃封装盖和荧光层之间的空间中，防止水分渗入气密金属框架和骰子保护层。因此，形成密封型LED封装结构，适用于极端或恶劣环境。

12. 发明申请

US20110227105A1 Multi-Layer LED Array Engine 有权
标题翻译：多层LED阵列引擎
公开(公告)号：US20110227105A1
公开(公告)日：2011-09-22
申请号：US12725462
申请日：2010-03-17
申请人： Jon-Fwu Hwu , Yung-Fu Wu
发明人： Jon-Fwu Hwu , Yung-Fu Wu
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/507 , H01L33/58 , H01L2224/48137
摘要： A multi-layer LED array engine is provided. The multi-layer LED array engine includes a base plate frame, a molded platform, two lead frames, a lighting element, a dome, a protection layer, and a phosphorous layer. The molded platform is disposed on and secured to the base plate frame. The two lead frames are combined with two lead frame grooves of the base plate frame. The lighting element is disposed on a lighting area of the base plate frame. The protection layer is provided on the lighting element, and the phosphorous layer is provided on the protection layer. The dome is secured to the molded platform for covering the molded platform and the lighting element.
摘要翻译：提供了多层LED阵列引擎。多层LED阵列引擎包括基板框架，模制平台，两个引线框架，照明元件，圆顶，保护层和磷层。模制平台设置在底板框架上并固定到底板框架上。两个引线框架与基板框架的两个引线框架槽结合。照明元件设置在基板框架的照明区域上。保护层设置在照明元件上，磷层设置在保护层上。圆顶被固定到模制平台上，用于覆盖模制平台和照明元件。

13. 发明申请

US20080170381A1 Lighting module for use in a keypad device 有权
标题翻译：用于键盘设备的照明模块
公开(公告)号：US20080170381A1
公开(公告)日：2008-07-17
申请号：US11984855
申请日：2007-11-23
申请人： Li-Kun Chou , Pai-Chen Chieh , Yung-Fu Wu , Yu-Nan Liu
发明人： Li-Kun Chou , Pai-Chen Chieh , Yung-Fu Wu , Yu-Nan Liu
IPC分类号： G01D11/28
CPC分类号： H01H13/83 , G02B6/0021 , G02B6/0031 , G02B6/0083 , H01H2209/06 , H01H2209/082 , H01H2219/044 , H01H2219/06 , H01H2219/062 , H01H2227/006 , H01H2227/036 , H04M1/22
摘要： A lighting module adapted for use in a keypad device includes a circuit substrate board, a transparent light guide plate stacked on the circuit substrate board, and at least one light emitting diode embedded in the light guide plate and connected electrically to the circuit substrate board. By having the light emitting diode embedded in the light guide plate, the overall thickness of the lighting module can be reduced to permit miniaturization.
摘要翻译：适于在键盘装置中使用的照明模块包括电路基板，堆叠在电路基板上的透明导光板和嵌入在导光板中并与电路基板电连接的至少一个发光二极管。通过将发光二极管嵌入到导光板中，可以减小照明模块的整体厚度以允许小型化。

14. 发明授权

US06995050B2 Thin film transistor and fabrication method for same 有权
标题翻译：薄膜晶体管及其制造方法相同
公开(公告)号：US06995050B2
公开(公告)日：2006-02-07
申请号：US10975470
申请日：2004-10-29
申请人： Chen-Ming Chen , Yung-Fu Wu
发明人： Chen-Ming Chen , Yung-Fu Wu
IPC分类号： H01L21/00
CPC分类号： H01L27/1288 , H01L27/124 , H01L29/41733 , H01L29/66757
摘要： A thin film transistor and a method for fabricating the same. The thin film transistor comprises a substrate and a patterned semiconductive layer formed on the substrate, wherein the semiconductive layer comprises a channel region and doped regions adjacent to the channel region. A gate insulating layer is formed on the above structure. A gate electrode is located on the gate insulating layer above the channel region. Source and drain electrodes are located on the gate insulating layer adjacent to the semiconductive layer. A dielectric layer having contact holes is formed on the above structure and a patterned conductive layer is formed on predetermined parts of the dielectric layer electrically connecting the doped regions to the source and drain electrode through the contact holes.
摘要翻译：一种薄膜晶体管及其制造方法。薄膜晶体管包括衬底和形成在衬底上的图案化半导体层，其中半导体层包括沟道区和与沟道区相邻的掺杂区。在上述结构上形成栅极绝缘层。栅极电极位于沟道区域上方的栅极绝缘层上。源极和漏极位于与半导体层相邻的栅极绝缘层上。在上述结构上形成具有接触孔的电介质层，并且在介电层的预定部分上形成图案化导电层，该电介质层通过接触孔将掺杂区域电连接到源电极和漏电极。

15. 发明申请

US20050269589A1 Power LED package module 有权
标题翻译：电源LED封装模块
公开(公告)号：US20050269589A1
公开(公告)日：2005-12-08
申请号：US11141023
申请日：2005-06-01
申请人： Yung-Fu Wu
发明人： Yung-Fu Wu
IPC分类号： H01L23/04 , H01L23/34 , H01L33/48 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L33/486 , H01L33/483 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/00012 , H01L2924/00014
摘要： A power LED package module includes a frame, a chip heat-conductive support, a light-emitting chip and a package body. The frame has a conductive pin, and a support separated from the conductive pin and connecting to the chip heat-conductive support. The light-emitting chip is arranged on the chip heat-conducting support and electrically connected to the conductive pin. The frame, the chip heat-conducting support and the light-emitting chip are packaged via the package body. The chip heat-conducting support is partially exposed out of the package body for connecting to a heat-dissipating element for increasing the efficiency of heat dissipation of the power LED package module. The power LED package module thus provides electrical conduction and heat conduction in a split manner.
摘要翻译：功率LED封装模块包括框架，芯片导热支架，发光芯片和封装体。框架具有导电引脚和与导电引脚分离并连接到芯片导热支撑件的支撑件。发光芯片布置在芯片导热支架上并电连接到导电引脚。框架，芯片导热支架和发光芯片经封装主体封装。芯片导热支撑件部分地暴露在封装主体外部，用于连接到散热元件，以提高功率LED封装模块的散热效率。因此，功率LED封装模块以分开的方式提供导电和热传导。

16. 发明申请

US20130223061A1 MULTI-LAYER ARRAY TYPE LED DEVICE HAVING A MULTI-LAYER HEAT DISSIPATION STRUCTURE 审中-公开
标题翻译：具有多层散热结构的多层阵列型LED装置
公开(公告)号：US20130223061A1
公开(公告)日：2013-08-29
申请号：US13409095
申请日：2012-02-29
申请人： JON-FWU HWU , Yung-Fu Wu , Kui-Chiang Liu
发明人： JON-FWU HWU , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： F21V11/00 , F21V29/00
CPC分类号： F21V29/89 , F21K9/232 , F21K9/238 , F21V3/00 , F21V23/006 , F21V29/74 , F21V29/75 , F21V29/773 , F21V29/83 , F21Y2115/10
摘要： A multi-layer array type LED device having a multi-layer heat dissipation structure includes a heat dissipation seat, an optical module, a housing, a power supply module, a wireless transmission module, a diffusion cover and a lamp head. In the present invention, the heat-generating components include the optical module, the power supply module and the wireless transmission module, and the heat-generating components are separately installed so that the heat accumulation effect can be decreased. In the present invention, the heat dissipation seat is used together with the housing having a plurality of the heat dissipation holes. The heat dissipation seat having excellent heat conductivity is used for rapidly absorbing heat and transferring it to the surrounding environment, and the surrounding air can be introduced into the housing via the heat dissipation holes for further increasing the heat dissipation efficiency.
摘要翻译：具有多层散热结构的多层阵列型LED器件包括散热座，光学模块，外壳，电源模块，无线传输模块，漫射罩和灯头。在本发明中，发热部件包括光学模块，电源模块和无线传输模块，并且分别安装发热部件，从而能够降低热积聚效果。在本发明中，散热座与具有多个散热孔的壳体一起使用。具有优良导热性的散热座用于快速吸收热量并将其转移到周围环境，并且可以通过散热孔将周围的空气引入壳体中，以进一步提高散热效率。

17. 发明授权

US08338923B1 Package structure of multi-layer array type LED device 有权
标题翻译：多层阵列式LED器件的封装结构
公开(公告)号：US08338923B1
公开(公告)日：2012-12-25
申请号：US13224330
申请日：2011-09-02
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01L23/495
CPC分类号： H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： A package structure of multi-layer array type LED device is disclosed, wherein a peripheral area of a substrate and a surface of lead frame are respectively installed with a convex/concave surface structure. The convex/concave surface structure increases the surface roughness of the peripheral area of the substrate and the surface of the lead frame, so a liquid package material can be filled in cavities and concave parts; thus a package member formed through the package material being solidified can be firmly combined with the substrate and the lead frame as one piece. In addition, the bottom of a lens is provided with a binder for increasing the sealing level of the lens. Moreover, the present invention adopted a soldering paste added with material having good heat conductivity, so heat generated by LED dices can be rapidly dissipated to the exterior.
摘要翻译：公开了一种多层阵列型LED器件的封装结构，其中基片的周边区域和引线框架的表面分别安装有凸/凹表面结构。凸/凹表面结构增加了基板周边区域和引线框架表面的表面粗糙度，因此液体封装材料可以填充在空腔和凹部中; 因此通过固化的封装材料形成的封装构件可以与衬底和引线框架一体地牢固地组合。此外，透镜的底部设置有用于增加透镜的密封水平的粘合剂。此外，本发明采用添加了具有良好导热性的材料的焊膏，因此可以将由LED芯片产生的热迅速地散发到外部。

18. 发明授权

US08247969B2 Optical lens having fluorescent layer adapted for LED packaging structure 有权
标题翻译：具有适用于LED封装结构的荧光层的光学透镜
公开(公告)号：US08247969B2
公开(公告)日：2012-08-21
申请号：US12892893
申请日：2010-09-28
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H05B33/04 , H01L33/10
CPC分类号： G02B27/0955 , G02B19/0028 , G02B19/0066 , H01L33/507 , H01L33/58 , H01L2224/48137 , H01L2224/48247
摘要： An optical lens having a fluorescent layer is provided. The optical lens is adapted for being employed in an LED packaging structure. The optical lens includes a substrate, at least one lens body, a lens shade, and a packaging member. The substrate is positioned at a bottommost side of the packaging structure, and the lens shade is positioned at a topmost side of the packaging structure. The lens body is positioned over the substrate and beneath the lens shade. A plurality of light emitting units are disposed on the substrate. The packaging member is adapted for packaging the substrate and the lens shade. The lens body is secured by the packing member so as to be positioned over the light emitting units. The lens body includes a fluorescent layer buried inside the lens body, and the lens body is positioned apart from the light emitting units for a certain distance.
摘要翻译：提供具有荧光层的光学透镜。光学透镜适用于LED封装结构。光学透镜包括基板，至少一个透镜体，透镜遮光板和包装部件。基板位于包装结构的最底侧，透镜遮光板位于包装结构的最上侧。透镜主体位于基板上方，并位于透镜遮光板下方。多个发光单元设置在基板上。包装构件适于包装基底和透镜遮蔽物。透镜体由密封构件固定，以便定位在发光单元之上。透镜体包括埋在透镜体内的荧光层，并且透镜体与发光单元隔开一定距离。

19. 发明申请

US20120074837A1 OPTICAL LENS HAVING FLUORESCENT LAYER ADAPTED FOR LED PACKAGING STRUCTURE 有权
标题翻译：具有适用于LED封装结构的荧光层的光学透镜
公开(公告)号：US20120074837A1
公开(公告)日：2012-03-29
申请号：US12892893
申请日：2010-09-28
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01J1/66
CPC分类号： G02B27/0955 , G02B19/0028 , G02B19/0066 , H01L33/507 , H01L33/58 , H01L2224/48137 , H01L2224/48247
摘要： An optical lens having a fluorescent layer is provided. The optical lens is adapted for being employed in an LED packaging structure. The optical lens includes a substrate, at least one lens body, a lens shade, and a packaging member. The substrate is positioned at a bottommost side of the packaging structure, and the lens shade is positioned at a topmost side of the packaging structure. The lens body is positioned over the substrate and beneath the lens shade. A plurality of light emitting units are disposed on the substrate. The packaging member is adapted for packaging the substrate and the lens shade. The lens body is secured by the packing member so as to be positioned over the light emitting units. The lens body includes a fluorescent layer buried inside the lens body, and the lens body is positioned apart from the light emitting units for a certain distance.
摘要翻译：提供具有荧光层的光学透镜。光学透镜适用于LED封装结构。光学透镜包括基板，至少一个透镜体，透镜遮光板和包装部件。基板位于包装结构的最底侧，透镜遮光板位于包装结构的最上侧。透镜主体位于基板上方，并位于透镜遮光板下方。多个发光单元设置在基板上。包装构件适于包装基底和透镜遮蔽物。透镜体由密封构件固定，以便定位在发光单元之上。透镜体包括埋在透镜体内的荧光层，并且透镜体与发光单元隔开一定距离。

20. 发明授权

US07211371B2 Method of manufacturing a TFT array panel for a LCD 有权
标题翻译：制造液晶显示器用TFT阵列面板的方法
公开(公告)号：US07211371B2
公开(公告)日：2007-05-01
申请号：US10673326
申请日：2003-09-30
申请人： Chi-Shen Lee , Yung-Fu Wu , Chi-Lin Chen , Cheng-Chung Chen
发明人： Chi-Shen Lee , Yung-Fu Wu , Chi-Lin Chen , Cheng-Chung Chen
IPC分类号： G03F7/00
CPC分类号： G02F1/1368 , G02F1/136213 , H01L27/1255 , H01L27/1288
摘要： A method of manufacturing a TFT array panel for a LCD disclosers that the gate electrode wiring, transparent conducting electrode, and the first electrode of the storage capacity are formed while the first mask is processing. Then, the selective deposition method is used to process the growth of the first metal wiring. This, therefore, can reduce the numbers of the mask processes. Further, the metal deposition with photo-resist lift-off step is used to implement the layout of the second metal wiring for the consequent transmission lines in the manufacturing process. Finally, the process of the passivation layer deposition is used to implement associated circuits of a TFT array panel for a LCD. The TFT array panel for a LCD for manufacturing circuits can simplify the manufacturing process and reduce the cost.
摘要翻译：制造LCD阵列面板的方法公开了在第一掩模处理期间形成栅电极布线，透明导电电极和存储容量的第一电极。然后，选择性沉积法用于处理第一金属布线的生长。因此，这可以减少掩模处理的数量。此外，利用光刻胶剥离工序进行金属蒸镀，以在制造工序中实现用于后续传输线的第二金属布线的布局。最后，钝化层沉积的过程用于实现用于LCD的TFT阵列面板的相关电路。用于制造电路的LCD的TFT阵列面板可以简化制造工艺并降低成本。

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