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11. 发明授权

US07314766B2 Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatus 失效
标题翻译：半导体晶片处理方法，半导体晶片检查方法，半导体器件显影方法和半导体晶片处理装置
公开(公告)号：US07314766B2
公开(公告)日：2008-01-01
申请号：US10706090
申请日：2003-11-13
申请人： Junji Sugamoto , Norihiko Tsuchiya , Yukihiro Ushiku , Katsujiro Tanzawa
发明人： Junji Sugamoto , Norihiko Tsuchiya , Yukihiro Ushiku , Katsujiro Tanzawa
IPC分类号： H01L21/00
CPC分类号： H01L22/24 , H01L2924/0002 , H01L2924/00
摘要： A treatment method of a semiconductor wafer includes treating the semiconductor wafer in a first solution having at least one kind of an oxidative acid and an oxidizing agent and treating the semiconductor wafer in a second solution having at least one of HF and NH4F.
摘要翻译：半导体晶片的处理方法包括在具有至少一种氧化酸和氧化剂的第一溶液中处理半导体晶片，并且在具有HF和NH 4中的至少一种的第二溶液中处理半导体晶片 F。

12. 发明申请

US20060131696A1 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them 失效
公开(公告)号：US20060131696A1
公开(公告)日：2006-06-22
申请号：US11350027
申请日：2006-02-09
申请人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
发明人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
IPC分类号： H01L29/06 , H01L23/02
CPC分类号： H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54433 , H01L2223/54493 , H01L2924/0002 , Y10S438/974 , H01L2924/00
摘要： A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.

13. 发明授权

US07057259B2 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them 失效
公开(公告)号：US07057259B2
公开(公告)日：2006-06-06
申请号：US10101337
申请日：2002-03-20
申请人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
发明人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
IPC分类号： H01L29/06
CPC分类号： H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54433 , H01L2223/54493 , H01L2924/0002 , Y10S438/974 , H01L2924/00
摘要： A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.

14. 发明申请

US20050194590A1 System and method for controlling manufacturing apparatuses 失效
标题翻译：用于控制制造装置的系统和方法
公开(公告)号：US20050194590A1
公开(公告)日：2005-09-08
申请号：US11068778
申请日：2005-03-02
申请人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
发明人： Hiroshi Matsushita , Tomonobu Noda , Kenichi Kadota , Junji Sugamoto , Yukihiro Ushiku
IPC分类号： H01L21/66 , G01R31/26 , H01L21/02 , H01L23/58
CPC分类号： H01L22/20 , G01R31/2894 , G05B23/0248 , G05B2219/31357 , Y02P90/14
摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.
摘要翻译：一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

15. 发明申请

US20080004823A1 Defect detection system, defect detection method, and defect detection program 失效
标题翻译：缺陷检测系统，缺陷检测方法和缺陷检测程序
公开(公告)号：US20080004823A1
公开(公告)日：2008-01-03
申请号：US11812398
申请日：2007-06-19
申请人： Hiroshi Matsushita , Yasutaka Arakawa , Junji Sugamoto
发明人： Hiroshi Matsushita , Yasutaka Arakawa , Junji Sugamoto
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G01N21/9501 , G05B2219/32221 , G05B2219/32222 , Y02P90/04 , Y02P90/22
摘要： A defect detection system includes a data acquiring section that acquires time series data of device parameter of each manufacturing device including an exposure device, and information on defect distribution in an area with a size smaller than a chip area size, a pattern classifying section that assembles the information on the defect distribution in units of shot or chip areas, and classifies the distributions to a defect pattern, a feature quantity calculating section that processes the time series data and calculates a feature quantity, a significant difference test section that calculates occurrence frequency distributions of the shot or chip area wherein the defect pattern to the feature quantity exists and does not exist, respectively, and determines the presence/absence of significant difference between the frequency distributions, and a defect detecting section that detects the device parameter corresponding to the feature quantity as the cause of defect of the defect pattern.
摘要翻译：缺陷检测系统包括数据获取部分，其获取包括曝光装置的每个制造装置的装置参数的时间序列数据以及尺寸小于芯片面积尺寸的区域中的缺陷分布的信息;模式分类部，关于以镜头或码片区域为单位的缺陷分布的信息，并将分布分类为缺陷图案，处理时间序列数据并计算特征量的特征量计算部分，计算出现频率分布的显着差异测试部分分别存在特征量的缺陷图案并且不存在的拍摄或切片区域，并且确定频率分布之间存在/不存在显着差异;以及缺陷检测部分，其检测与特征对应的设备参数数量作为缺陷模式缺陷的原因。

16. 发明授权

US07529631B2 Defect detection system, defect detection method, and defect detection program 失效
标题翻译：缺陷检测系统，缺陷检测方法和缺陷检测程序
公开(公告)号：US07529631B2
公开(公告)日：2009-05-05
申请号：US11812398
申请日：2007-06-19
申请人： Hiroshi Matsushita , Yasutaka Arakawa , Junji Sugamoto
发明人： Hiroshi Matsushita , Yasutaka Arakawa , Junji Sugamoto
IPC分类号： G01B5/30
CPC分类号： G05B19/41875 , G01N21/9501 , G05B2219/32221 , G05B2219/32222 , Y02P90/04 , Y02P90/22
摘要： A defect detection system includes a data acquiring section that acquires time series data of device parameter of each manufacturing device including an exposure device, and information on defect distribution in an area with a size smaller than a chip area size, a pattern classifying section that assembles the information on the defect distribution in units of shot or chip areas, and classifies the distributions to a defect pattern, a feature quantity calculating section that processes the time series data and calculates a feature quantity, a significant difference test section that calculates occurrence frequency distributions of the shot or chip area wherein the defect pattern to the feature quantity exists and does not exist, respectively, and determines the presence/absence of significant difference between the frequency distributions, and a defect detecting section that detects the device parameter corresponding to the feature quantity as the cause of defect of the defect pattern.
摘要翻译：缺陷检测系统包括数据获取部分，其获取包括曝光装置的每个制造装置的装置参数的时间序列数据以及尺寸小于芯片面积尺寸的区域中的缺陷分布的信息;模式分类部，关于以镜头或码片区域为单位的缺陷分布的信息，并将分布分类为缺陷图案，处理时间序列数据并计算特征量的特征量计算部分，计算出现频率分布的显着差异测试部分分别存在特征量的缺陷图案并且不存在的拍摄或切片区域，并且确定频率分布之间存在/不存在显着差异;以及缺陷检测部分，其检测与特征对应的设备参数数量作为缺陷模式缺陷的原因。

17. 发明申请

US20070254482A1 Method and system for manufacturing a semiconductor device 审中-公开
标题翻译：用于制造半导体器件的方法和系统
公开(公告)号：US20070254482A1
公开(公告)日：2007-11-01
申请号：US11790388
申请日：2007-04-25
申请人： Kenji Kawabata , Junji Sugamoto
发明人： Kenji Kawabata , Junji Sugamoto
IPC分类号： H01L21/66 , H01L23/58 , H01L21/44
CPC分类号： H01L22/20
摘要： A method for manufacturing a semiconductor device has measuring a finished state of a wafer in a completed process, estimating an in-surface tendency of the wafer based on a result of the measuring, estimating a surface characteristic of the wafer based on the estimated in-surface tendency, setting a process condition of a uncompleted process based on the estimated surface characteristic and controlling the uncompleted process based on the set process condition.
摘要翻译：一种制造半导体器件的方法，在完成的工艺中测量晶片的完成状态，基于测量结果估计晶片的表面内趋势，基于估计的晶体管内估计晶片的表面特性，表面趋势，基于估计的表面特性设定未完成处理的处理条件，并基于设定的处理条件来控制未完成的处理。

18. 发明授权

US07979154B2 Method and system for managing semiconductor manufacturing device 有权
公开(公告)号：US07979154B2
公开(公告)日：2011-07-12
申请号：US11959968
申请日：2007-12-19
申请人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00 , H01L21/02
CPC分类号： G05B19/41875 , G05B2219/32179 , G05B2219/32221 , G05B2219/45031 , Y02P90/22
摘要： A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.

19. 发明申请

US20080147226A1 METHOD AND SYSTEM FOR MANAGING SEMICONDUCTOR MANUFACTURING DEVICE 有权
标题翻译：用于管理半导体制造装置的方法和系统
公开(公告)号：US20080147226A1
公开(公告)日：2008-06-19
申请号：US11959968
申请日：2007-12-19
申请人： Hiroshi MATSUSHITA , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi MATSUSHITA , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32179 , G05B2219/32221 , G05B2219/45031 , Y02P90/22
摘要： A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.
摘要翻译：管理系统包括设定质量控制值变化的可变周期的可变周期设定部。然后，检索单元检索夹着可变周期的事件。这些事件可以是半导体制造装置的维护和/或校正值的改变。分析周期设定单元设定用于分析由检索单元检索的事件之间的质量控制值的变化原因的分析期间。

20. 发明申请

US20070276528A1 Management system of semiconductor fabrication apparatus, abnormality factor extraction method of semiconductor fabrication apparatus, and management method of the same 失效
标题翻译：半导体制造装置的管理系统，半导体制造装置的异常因子提取方法及其管理方法
公开(公告)号：US20070276528A1
公开(公告)日：2007-11-29
申请号：US11727824
申请日：2007-03-28
申请人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32075 , G05B2219/32222 , G05B2219/45031 , Y02P90/22
摘要： According to the present, there is proved a semiconductor fabrication apparatus management system having: a sensor which monitors and outputs a plurality of apparatus parameters of a semiconductor fabrication apparatus which fabricates a semiconductor device; a measurement unit which measures a dimensional value of the semiconductor device, and outputs the dimensional value as dimensional data; an apparatus parameter storage unit which stores the apparatus parameters; a dimensional data storage unit which stores the dimensional data; an apparatus parameter controller which calculates predicted dimensional data by extracting the dimensional data from the dimensional data storage unit, and controls at least one of the plurality of apparatus parameters on the basis of the predicted dimensional data; and an abnormality factor extraction unit which analyzes correlations between the controlled apparatus parameter and other apparatus parameters, and extracts an abnormal apparatus parameter on the basis of a calculated correlation coefficient.
摘要翻译：根据现在，已经证明了一种半导体制造装置管理系统，其具有：监视并输出制造半导体装置的半导体制造装置的多个装置参数的传感器; 测量单元，其测量半导体器件的尺寸值，并将该尺寸值作为尺寸数据输出; 装置参数存储单元，其存储所述装置参数; 存储尺寸数据的尺寸数据存储单元; 装置参数控制器，其通过从所述尺寸数据存储单元提取所述尺寸数据来计算预测尺寸数据，并且基于所述预测尺寸数据来控制所述多个装置参数中的至少一个; 以及异常因子提取单元，其分析受控设备参数和其他设备参数之间的相关性，并且基于计算的相关系数提取异常设备参数。

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