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    • 12. 发明授权
    • Method and apparatus for cleaning the edge of a thin disc
    • 用于清洁薄盘边缘的方法和装置
    • US06345630B2
    • 2002-02-12
    • US09738797
    • 2000-12-15
    • Boris FishkinJianshe TangBrian J. Brown
    • Boris FishkinJianshe TangBrian J. Brown
    • B08B310
    • H01L21/67051H01L21/67046Y10S134/902
    • An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.
    • 提供了一种创新的边缘清洁装置,用于清洁边缘诸如半导体晶片的薄盘。 本发明的边缘清洁装置具有定位成在薄盘的边缘表面处引导液体射流的声波喷嘴。 优选地,声波喷嘴与薄盘的边缘径向间隔开,使得当由声波喷嘴清洁薄盘边缘时,可以在薄盘的主表面上同时进行洗涤,旋转漂洗或旋转清洁。 液体射流可以包括去离子水,NH 4 OH,KOH,TMAH,HF,柠檬酸,表面活性剂或其他类似的清洁溶液,并且当薄盘旋转时喷嘴可以保持静止,或者喷嘴可以扫描薄盘的圆周 以清洁薄片的整个边缘。
    • 13. 发明授权
    • Method and apparatus for cleaning the edge of a thin disc
    • 用于清洁薄盘边缘的方法和装置
    • US06276371B1
    • 2001-08-21
    • US09589463
    • 2000-06-07
    • Boris FishkinBrian J. BrownJianshe Tang
    • Boris FishkinBrian J. BrownJianshe Tang
    • B08B312
    • H01L21/67057Y10S134/902
    • A method and apparatus for cleaning wafer edges is provided. The inventive wafer cleaner employs a transducer equal in length to the diameter of a wafer to be cleaned, and positioned to direct sonic energy in line with the wafer's edge. Supporting and rotating mechanisms are positioned along the wafer's edge, outside of the transducer's high energy field, and preferably such that approximately 50 percent of the wafer is positioned between the wafer supports and the transducer. Therefore, minimal sonic energy is blocked from reaching the wafer's surface. The transducer dimensions relative to the wafer, and the positioning of the wafer supports relative to the transducer enable the system to achieve an approximately 50 percent edge cleaning duty cycle as the wafer is rotated.
    • 提供了一种用于清洁晶片边缘的方法和装置。 本发明的晶片清洁器采用与要清洁的晶片的直径相等的换能器,并定位成引导与晶片边缘一致的声能。 支撑和旋转机构沿着晶片的边缘定位在换能器的高能场外部,并且优选地使得大约50%的晶片位于晶片支架和换能器之间。 因此,最小的声能被阻止到达晶片的表面。 相对于晶片的换能器尺寸以及晶片支撑件相对于换能器的定位使得系统能够在晶片旋转时实现大约50%的边缘清洁占空比。
    • 14. 发明授权
    • Method and apparatus for cleaning the edge of a thin disc
    • 用于清洁薄盘边缘的方法和装置
    • US06202658B1
    • 2001-03-20
    • US09191061
    • 1998-11-11
    • Boris FishkinJianshe TangBrian J. Brown
    • Boris FishkinJianshe TangBrian J. Brown
    • B08B310
    • H01L21/67051H01L21/67046Y10S134/902
    • An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include de-ionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.
    • 提供了一种创新的边缘清洁装置,用于清洁边缘诸如半导体晶片的薄盘。 本发明的边缘清洁装置具有定位成在薄盘的边缘表面处引导液体射流的声波喷嘴。 优选地,声波喷嘴与薄盘的边缘径向间隔开,使得当由声波喷嘴清洁薄盘边缘时,可以在薄盘的主表面上同时进行洗涤,旋转漂洗或旋转清洁。 液体射流可以包括去离子水,NH 4 OH,KOH,TMAH,HF,柠檬酸,表面活性剂或其它类似的清洁溶液,并且当薄盘旋转时喷嘴可以保持静止,或者喷嘴可以扫描 薄光盘清洁光盘的整个边缘。
    • 15. 发明授权
    • Method and apparatus for cleaning the edge of a thin disc
    • 用于清洁薄盘边缘的方法和装置
    • US6119708A
    • 2000-09-19
    • US191057
    • 1998-11-11
    • Boris FishkinBrian J. BrownJianshe Tang
    • Boris FishkinBrian J. BrownJianshe Tang
    • H01L21/00B08B3/12
    • H01L21/67057Y10S134/902
    • A method and apparatus for cleaning wafer edges is provided. The inventive wafer cleaner employs a transducer equal in length to the diameter of a wafer to be cleaned, and positioned to direct sonic energy in line with the wafer's edge. Supporting and rotating mechanisms are positioned along the wafer's edge, outside of the transducer's high energy field, and preferably such that approximately 50 percent of the wafer is positioned between the wafer supports and the transducer. Therefore, minimal sonic energy is blocked from reaching the wafer's surface. The transducer dimensions relative to the wafer, and the positioning of the wafer supports relative to the transducer enable the system to achieve an approximately 50 percent edge cleaning duty cycle as the wafer is rotated.
    • 提供了一种用于清洁晶片边缘的方法和装置。 本发明的晶片清洁器采用与要清洁的晶片的直径相等的换能器,并定位成引导与晶片边缘一致的声能。 支撑和旋转机构沿着晶片的边缘定位在换能器的高能场外部,并且优选地使得大约50%的晶片位于晶片支架和换能器之间。 因此,最小的声能被阻止到达晶片的表面。 相对于晶片的换能器尺寸以及晶片支撑件相对于换能器的定位使得系统能够在晶片旋转时实现大约50%的边缘清洁占空比。
    • 17. 发明授权
    • Method for managing a fluid level associated with a substrate processing tank
    • 用于管理与衬底处理槽相关联的液面的方法
    • US06464799B1
    • 2002-10-15
    • US09580881
    • 2000-05-30
    • Alexander LernerBrian J. BrownBoris FishkinJonathan S. Frankel
    • Alexander LernerBrian J. BrownBoris FishkinJonathan S. Frankel
    • B08B310
    • B08B3/00B08B3/12G05D9/12G05D21/02G05D23/19G05D27/02H01L21/67253
    • An improved method and apparatus for adjusting chemistry concentrations and temperatures within a substrate processing tank is provided. A first aspect may include checking the fluid level within the tank, and, if the level is higher than a predetermined upper level, bleeding an amount of fluid from the tank; if the level is lower than a predetermined lower level, flowing an amount of fluid to the tank, and if the level is between the predetermined upper and lower levels, bleeding an amount of fluid from the tank and flowing an amount of fluid to the tank. A second aspect may include flowing water into the tank at a flow rate at least equivalent to the flow rate of water required to achieve a chemistry spike of a predetermined concentration and volume prior to beginning the flow of chemicals. A third aspect may include a method and apparatus for heating or cooling chemistry to a predetermined temperature as the chemistry is recirculated.
    • 提供了用于调整基板处理槽内的化学浓度和温度的改进方法和装置。 第一方面可以包括检查罐内的液位,并且如果液位高于预定的上限,则从罐中排出一定量的流体; 如果水平低于预定的较低水平,则将一定量的流体流向罐,并且如果水平在预定的上下水平之间,则从罐中排出一定量的流体并将一定量的流体流向罐 。 第二方面可以包括以至少等于在开始化学品流动之前实现预定浓度和体积的化学峰值所需的水的流速至少等于流量的水流入罐中。 第三方面可以包括当化学物质再循环时将化学物质加热或冷却至预定温度的方法和装置。
    • 18. 发明申请
    • APPARATUS FOR CLEANING AND DRYING SUBSTRATES
    • 用于清洁和干燥基板的装置
    • US20070272278A1
    • 2007-11-29
    • US11834657
    • 2007-08-06
    • Boris FishkinMichael Sherrard
    • Boris FishkinMichael Sherrard
    • B08B3/04
    • H01L21/67028Y10S134/902
    • A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni drying. Thus, a large portion of the substrate is simultaneously dried. A preferred apparatus employs a tank of cleaning and/or rinsing fluid. Above the tank fluid a source of rinsing fluid directs rinsing fluid to the surface of a substrate forming a meniscus on the substrate surface as the substrate is lifted from the cleaning fluid, and a drying vapor source directs drying vapor to the meniscus. The drying vapor lowers the surface tension of the meniscus, inducing a Marangoni flow of rinsing fluid from the substrate's surface, and thereby drying the substrate. The cleaning fluid tank has a substrate receiving and cleaning portion and a substrate rinsing portion. The rinsing fluid source and the drying vapor source are enclosed by a drying enclosure above the rinsing portion of the tank. Thus, substrate loading, cleaning, rinsing, drying and unloading are performed with at least partial overlap in time.
    • 提供了一种用于清洗,漂洗和马兰戈尼干燥基材的方法和设备。 沿着形成空气/流体界面线的基底表面喷射流体线,并且将一线干燥蒸气供应到界面线以实现马兰戈尼干燥。 因此,大部分基板被同时干燥。 优选的装置采用清洁和/或冲洗流体箱。 在罐体流体上方,当衬底从清洁流体提升时,漂洗流体源将冲洗流体引导到在衬底表面上形成弯液面的衬底的表面,并且干燥蒸汽源将干燥蒸气引导到弯液面。 干燥蒸汽降低了弯液面的表面张力,引起从基材表面冲洗流体的马兰戈尼流,从而干燥基材。 清洗液槽具有基板接收和清洁部分和基板漂洗部分。 冲洗流体源和干燥蒸气源由在罐的漂洗部分上方的干燥箱包围。 因此,在时间上至少部分重叠地执行基板装载,清洁,漂洗,干燥和卸载。
    • 19. 发明授权
    • Apparatus for cleaning and drying substrates
    • 用于清洁和干燥基材的设备
    • US06328814B1
    • 2001-12-11
    • US09280118
    • 1999-03-26
    • Boris FishkinMichael Sherrard
    • Boris FishkinMichael Sherrard
    • B08B304
    • H01L21/67028Y10S134/902
    • A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni drying. Thus, a large portion of the substrate is simultaneously dried. A preferred apparatus employs a tank of cleaning and/or rinsing fluid. Above the tank fluid a source of rinsing fluid directs rinsing fluid to the surface of a substrate forming a meniscus on the substrate surface as the substrate is lifted from the cleaning fluid, and a drying vapor source directs drying vapor to the meniscus. The drying vapor lowers the surface tension of the meniscus, inducing a Marangoni flow of rinsing fluid from the substrate's surface, and thereby drying the substrate. The cleaning fluid tank has a substrate receiving and cleaning portion and a substrate rinsing portion. The rinsing fluid source and the drying vapor source are enclosed by a drying enclosure above the rinsing portion of the tank. Thus, substrate loading, cleaning, rinsing, drying and unloading are performed with at least partial overlap in time.
    • 提供了一种用于清洗,漂洗和马兰戈尼干燥基材的方法和设备。 沿着形成空气/流体界面线的基底表面喷射流体线,并且将一线干燥蒸气供应到界面线以实现马兰戈尼干燥。 因此,大部分基板被同时干燥。 优选的装置采用清洁和/或冲洗流体箱。 在罐体流体上方,当衬底从清洁流体提升时,漂洗流体源将冲洗流体引导到在衬底表面上形成弯液面的衬底的表面,并且干燥蒸汽源将干燥蒸气引导到弯液面。 干燥蒸汽降低了弯液面的表面张力,引起从基材表面冲洗流体的马兰戈尼流,从而干燥基材。 清洗液槽具有基板接收和清洁部分和基板漂洗部分。 冲洗流体源和干燥蒸气源由在罐的漂洗部分上方的干燥箱包围。 因此,在时间上至少部分重叠地执行基板装载,清洁,漂洗,干燥和卸载。