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11. 发明授权

US08008600B2 Fiber laser apparatus 有权
标题翻译：光纤激光设备
公开(公告)号：US08008600B2
公开(公告)日：2011-08-30
申请号：US11808927
申请日：2007-06-13
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
IPC分类号： B23K26/06 , H01S3/067 , H04B10/12 , G02B6/036
CPC分类号： G02B6/4296 , G02B6/03633 , H01S3/06758 , H01S3/0809 , H01S3/094007 , H01S3/2308
摘要： The fiber laser apparatus comprises an amplifying section for amplifying seed light by cladding-pumping, and has a structure for further using a residual component of pumping light for cladding-pumping in order to heat the object. A guiding optical fiber is provided between an amplifying optical fiber of the amplifying section and an output optical system converging the single-mode amplified seed light on the object, the guiding optical fiber serving to increase the degree of freedom in arranging the output optical system. The guiding optical fiber has a structure enabling the single-mode propagation of the amplified seed light outputted from the amplifying optical fiber and multimode propagation of the residual pumping light. Because the object is irradiated with the converged amplified seed light, while being heated with the residual pumping light outputted from the output optical system, even an object with a complex shape can be subjected to efficient laser processing.
摘要翻译：光纤激光装置包括用于通过包层泵浦放大种子光的放大部分，并且具有进一步使用用于包层抽吸的泵浦光的残余分量以加热物体的结构。引导光纤设置在放大部分的放大光纤与将单模放大种子光会聚在物体上的输出光学系统之间，该引导光纤用于增加输出光学系统的布置自由度。引导光纤具有使得能够从放大光纤输出的放大的种子光的单模传播和残余泵浦光的多模传播的结构。由于物体被会聚的放大的种子光照射，所以在从输出光学系统输出的剩余泵浦光被加热的同时，即使具有复杂形状的物体也能进行有效的激光加工。

12. 发明申请

US20090242523A1 LASER PROCESSING METHOD 审中-公开
标题翻译：激光加工方法
公开(公告)号：US20090242523A1
公开(公告)日：2009-10-01
申请号：US12412086
申请日：2009-03-26
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
IPC分类号： B23K26/20
CPC分类号： B23K26/324 , B23K26/0006 , B23K26/0604 , B23K26/0608 , B23K2103/05 , B23K2103/18 , B23K2103/42
摘要： The present invention relates to a laser processing method that makes it possible to effectively suppress the generation of surface irregularities on the surface of a plastic member where a metal member and a plastic member are joined together. In the laser processing method, a plurality of laser beams are irradiated from different directions so as to focus on the vicinity of an interface between the metal member and the plastic member, which are in contact with one another. The power densities of the respective laser beams at this time are set to a level not more than a level, at which the exposed surface of the plastic member on the side opposite to the interface between the metal member and the plastic member, does not melt. As a result of this, air bubbles or the like are not generated in the vicinity of the exposed surface of the plastic member, and the generation of surface roughness on the exposed surface of the plastic member is effectively suppressed.
摘要翻译：激光加工方法技术领域本发明涉及能够有效地抑制金属构件和塑料构件接合在一起的塑料构件的表面上的表面凹凸的产生的激光加工方法。在激光加工方法中，从不同方向照射多个激光束，以聚焦在彼此接触的金属构件和塑料构件之间的界面附近。此时的各激光束的功率密度被设定为不超过与金属构件和塑料构件之间的界面相反一侧的塑料构件的暴露表面不熔化的水平的水平。其结果是，在塑料部件的露出面附近不产生气泡等，有效地抑制塑料部件露出面的表面粗糙度的产生。

13. 发明授权

US08628715B2 Laser processing method and laser processing device 有权
标题翻译：激光加工方法和激光加工装置
公开(公告)号：US08628715B2
公开(公告)日：2014-01-14
申请号：US13059592
申请日：2009-10-23
申请人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
发明人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
IPC分类号： B29C35/08
CPC分类号： H05K3/0035 , B23K26/0622 , B23K26/082 , B23K26/389 , B23K26/40 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H01S3/067
摘要： The present invention relates to a laser processing method and the like which use no wavelength conversion technique by nonlinear optical crystals when selectively removing an insulating layer of a printed board, while employing only one wavelength throughout the entire removal processing. A laser processing apparatus (1), preferably used in the laser processing method, has a MOPA structure and comprises a seed light source (100), a YbDF (110), a bandpass filter (120), a YbDF (130), a bandpass filter (140), a YbDF (150), a YbDF (160), and so forth. The laser processing method according to the present invention is a laser processing method of removing an insulating layer comprised of a resin laminated on a conductor layer by irradiating it with pulsed laser light outputted from the laser processing apparatus (1) and uses laser light having a wavelength at which the light absorbed by the conductor layer is less than 10%, and sets the fluence per one pulse to a fracture damage threshold of the insulating layer or higher.
摘要翻译：本发明涉及在选择性地去除印刷电路板的绝缘层时采用非线性光学晶体的波长转换技术的激光加工方法等，而在整个去除处理中仅使用一个波长。优选用于激光加工方法的激光加工装置（1）具有MOPA结构，包括种子光源（100），YbDF（110），带通滤光器（120），YbDF（130），带通滤波器（140），YbDF（150），YbDF（160）等。根据本发明的激光加工方法是通过用激光加工装置（1）输出的脉冲激光照射层叠在导体层上的由树脂构成的绝缘层的激光加工方法，并使用具有由导体层吸收的光的波长小于10％，并且将每个脉冲的注量设定为绝缘层的断裂损伤阈值或更高。

14. 发明授权

US08581949B2 Laser marking method 有权
标题翻译：激光打标法
公开(公告)号：US08581949B2
公开(公告)日：2013-11-12
申请号：US12536780
申请日：2009-08-06
申请人： Yasuomi Kaneuchi , Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
发明人： Yasuomi Kaneuchi , Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
IPC分类号： B41J2/435
CPC分类号： B41J2/471 , B41J2/442 , B41M5/24 , H01S3/0064 , H01S3/0078 , H01S3/06708 , H01S3/06758 , H01S3/094003 , H01S3/094007 , H01S3/09408 , H01S3/09415 , H01S3/1618
摘要： The present invention relates to a laser marking method which is capable of changing the grey level of a marking even in the case of a high processing speed. The laser marking method forms a marking pattern on a marking object by irradiating the marking object with pulsed light oscillated from a pulsed light source of a MOPA structure in which a semiconductor laser outputting directly-modulated pulsed light is used as a seed light source. At this time, the pulse duration of the pulsed light is changed in order to change a gray level of the marking pattern to be formed. In this way, a peak power of the pulsed light is changed by changing the pulse duration, so that it is possible to positively change the gray level of the marking pattern without changing the processing speed.
摘要翻译：本发明涉及即使在高处理速度的情况下也能够改变标记的灰度级的激光打标方法。激光标记方法通过用从其中输出直接调制的脉冲光的半导体激光器用作种子光源的MOPA结构的脉冲光源振荡的脉冲光照射标记物体来在标记物体上形成标记图案。此时，改变脉冲光的脉冲持续时间以改变要形成的标记图案的灰度级。以这种方式，通过改变脉冲持续时间来改变脉冲光的峰值功率，从而可以在不改变处理速度的情况下肯定地改变标记图案的灰度级。

15. 发明授权

US08183509B2 Laser processing apparatus and laser processing method 有权
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US08183509B2
公开(公告)日：2012-05-22
申请号：US13193038
申请日：2011-07-28
申请人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
发明人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
IPC分类号： G01J1/32
CPC分类号： B23K26/03 , B23K26/082 , B23K2101/32 , B23K2101/36
摘要： The present invention relates to a laser processing apparatus and the like having a structure for implementing at the same time both an efficient laser processing in the place where a laser beam is difficult to reach and a laser processing without damages in the place where the laser beam is easy to reach. This laser processing apparatus comprises a laser light source, an irradiation optical system applying a laser beam to an object while scanning the laser beam, a photo-detector detecting the laser beam applied from the irradiation optical system, and a control section of making switching between a continuous oscillation and a pulse oscillation of the laser beam at the laser light source. In particular, the control section makes a continuous oscillation of the laser beam with respect to the laser light source in the case in which the laser beam applied from the irradiation optical system is detected at the photo-detector; while it makes a pulse oscillation of the laser beam with respect to the laser light source in the case in which no laser beam applied from the irradiation optical system is detected at the photo-detector.
摘要翻译：激光加工装置本发明涉及一种激光加工装置等，其结构是同时实现在激光束难以到达的地方进行有效的激光加工，激光加工在激光加工的地方很容易到达。该激光加工装置包括：激光光源，在扫描激光束的同时向物体施加激光的照射光学系统;检测从照射光学系统施加的激光束的光检测器;以及控制部，在激光光源处的激光束的连续振荡和脉冲振荡。特别地，在从光检测器检测到从照射光学系统施加的激光束的情况下，控制部分使激光束相对于激光光源连续振荡; 而在光检测器未检测到从照射光学系统施加的激光束的情况下，激光束相对于激光光源的脉冲振荡。

16. 发明授权

US08101885B2 Laser processing method and laser processing apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US08101885B2
公开(公告)日：2012-01-24
申请号：US11878693
申请日：2007-07-26
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
IPC分类号： B23K26/00
CPC分类号： B23K26/0869 , B23K2101/04
摘要： The present invention relates to a method and apparatus having a structure that enables laser processing of an object even when the object has a surface formed with irregularities. The laser processing method irradiates objects, each having a cylindrical form extending in a first direction, with laser light. Here, the objects are arranged on a first plane along a second direction orthogonal to the first direction. The arranged objects are irradiated with first and second laser light beams in irradiation directions different from each other to the first plane. At least during when the first and second irradiation light beams are respectively emitted, irradiation positions of the first and second laser light beams to the first plane are relatively moved.
摘要翻译：本发明涉及具有即使当物体具有形成有凹凸的表面时能够对物体进行激光加工的结构的方法和装置。激光加工方法用激光照射每个具有沿第一方向延伸的圆柱形形状的物体。这里，物体沿着与第一方向正交的第二方向布置在第一平面上。在与第一平面不同的照射方向上照射被布置的物体的第一和第二激光束。至少在分别发射第一和第二照射光束时，第一和第二激光束到第一平面的照射位置相对移动。

17. 发明授权

US08073025B2 Laser light source 有权
标题翻译：激光光源
公开(公告)号：US08073025B2
公开(公告)日：2011-12-06
申请号：US12702613
申请日：2010-02-09
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki , Yasuomi Kaneuchi
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki , Yasuomi Kaneuchi
IPC分类号： H01S3/10 , H01S3/08
CPC分类号： H01S3/067 , H01S3/0811 , H01S3/0812 , H01S3/09415 , H01S3/117 , H01S3/1618
摘要： The present invention relates to a laser light source having a structure for narrowing a wavelength bandwidth of output light. The laser light source comprises, at least, a laser resonator, a pumping light source, an optical path switch device, a diffraction grating, and a total reflection mirror. The laser resonator has a light amplifying fiber for output of emission light arranged on a resonance optical path thereof. The optical path switch device has a first port and a second port on the resonance optical path of the laser resonator. The diffraction grating spectrally separates the emission light outputted from the second port. The total reflection mirror reflects a specific wavelength component out of wavelength components spectrally separated by the diffraction grating, so as to feed the specific wavelength component back to the second port. Particularly, the optical path switch device controls a light transmittable state of the emission light outputted from the light amplifying fiber, at the second port.
摘要翻译：本发明涉及具有使输出光的波长带宽变窄的结构的激光光源。激光源至少包括激光谐振器，泵浦光源，光路开关器件，衍射光栅和全反射镜。激光谐振器具有用于输出布置在其共振光路上的发射光的光放大光纤。光路开关装置在激光谐振器的共振光路上具有第一端口和第二端口。衍射光栅将从第二端口输出的发射光谱分光。全反射镜反射由衍射光栅光谱分离的波长分量中的特定波长分量，以将特定波长分量反馈回第二端口。特别地，光路开关装置控制在第二端口处从光放大光纤输出的发射光的透光状态。

18. 发明申请

US20090272877A1 METHOD AND APPARATUS OF MEASURING BACKWARD LIGHT, AND LASER PROCESSING METHOD 有权
标题翻译：测量背光的方法和装置，以及激光加工方法
公开(公告)号：US20090272877A1
公开(公告)日：2009-11-05
申请号：US12392331
申请日：2009-02-25
申请人： Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
发明人： Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
IPC分类号： G01J1/20
CPC分类号： G01J1/20 , B23K26/705
摘要： The present invention relates to a method of measuring backward light, which is constructed for checking, prior to laser processing, backward light that propagates backward through an isolator included in a laser processing apparatus. The present invention also relates to a laser processing method and the like. A laser processing apparatus has an optical head provided with a laser light source part, light guide, and isolator. The optical head has an emitting optical system, irradiation optical system, and light collecting optical system. The method of measuring backward light uses a photodetector to detect, from reference light introduced from a measurement light source into the optical head, the power of an optical component that has passed through the isolator, while changing the position of the measurement light source. The laser processing method performs laser processing by using the laser processing apparatus that has the optical head in which the arrangement of optical components is adjusted beforehand on the basis of the result of detection or result of measurement.
摘要翻译：本发明涉及一种测量向后光的方法，其被构造用于在激光加工之前检查通过包括在激光加工设备中的隔离器向后传播的向后光。本发明还涉及一种激光加工方法等。激光加工设备具有设置有激光光源部分，光导和隔离器的光学头。光头具有发射光学系统，照射光学系统和聚光光学系统。逆向光的测量方法使用光检测器，在测量光源的位置改变的同时，从测量光源引入光头的参考光检测已经通过隔离器的光学部件的功率。激光加工方法通过使用具有基于检测结果或测量结果预先调整光学部件的布置的光头的激光加工装置进行激光加工。

19. 发明申请

US20080029499A1 Laser processing method and laser processing apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US20080029499A1
公开(公告)日：2008-02-07
申请号：US11878693
申请日：2007-07-26
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
IPC分类号： B23K26/00
CPC分类号： B23K26/0869 , B23K2101/04
摘要： The present invention relates to a method and apparatus having a structure that enables laser processing of an object even when the object has a surface formed with irregularities. The laser processing method irradiates objects, each having a cylindrical form extending in a first direction, with laser light. Here, the objects are arranged on a first plane along a second direction orthogonal to the first direction. The arranged objects are irradiated with first and second laser light beams in irradiation directions different from each other to the first plane. At least during when the first and second irradiation light beams are respectively emitted, irradiation positions of the first and second laser light beams to the first plane are relatively moved.
摘要翻译：本发明涉及具有即使当物体具有形成有凹凸的表面时能够对物体进行激光加工的结构的方法和装置。激光加工方法用激光照射每个具有沿第一方向延伸的圆柱形形状的物体。这里，物体沿着与第一方向正交的第二方向布置在第一平面上。在与第一平面不同的照射方向上照射被布置的物体的第一和第二激光束。至少在分别发射第一和第二照射光束时，第一和第二激光束到第一平面的照射位置相对移动。

20. 发明授权

US08283592B2 Laser welding method 有权
标题翻译：激光焊接方法
公开(公告)号：US08283592B2
公开(公告)日：2012-10-09
申请号：US12762084
申请日：2010-04-16
申请人： Kazuo Nakamae
发明人： Kazuo Nakamae
IPC分类号： B23K11/00
CPC分类号： H01R43/0221 , B23K26/009 , B23K2101/32 , B23K2101/38 , H01R9/05
摘要： The present invention relates to a laser welding method of welding an electrode and a cable core to each other satisfactory by irradiation of a laser beam, even when the core is thin and the area of the electrode is small. The laser welding method welds on a substrate the electrode and the core of a coaxial cable to each other by irradiation of the laser beam. The core is sandwiched between a pressing member and the electrode, while the electrode and the core are brought into contact with each other at a connection section. The pressing member is a member that is transparent to the processing laser beam. A part of the core is molten by radiating the laser beam from the pressing member side. As a result, the electrode and the core are connected with each other.
摘要翻译：本发明涉及通过激光束的照射使电极和电缆芯彼此焊接的激光焊接方法，即使当芯较薄并且电极的面积小时也是如此。激光焊接方法通过照射激光束将电极和同轴电缆的芯彼此焊接在基板上。在电连接部分将电极和芯彼此接触的同时夹在压件和电极之间。按压构件是对加工激光束透明的构件。通过从加压构件侧照射激光束，芯部的一部分熔融。结果，电极和芯彼此连接。

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