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    • 13. 发明申请
    • SHEET PEELING APPARATUS AND SHEET PEELING METHOD
    • 薄膜剥离装置和薄膜剥离方法
    • US20110036477A1
    • 2011-02-17
    • US12936850
    • 2009-03-16
    • Hideaki Kato
    • Hideaki Kato
    • B32B38/10
    • B65H35/0013B65G2207/02B65H29/54B65H2301/44335H01L21/67132
    • A sheet peeling apparatus 10 includes: a sticking means 14 for sticking a peeling tape PT by pressing the peeling tape PT onto an adhesive sheet S; a moving means 15 for moving the peeling tape PT stuck to the adhesive sheet S and a holding means 11 for holding a wafer W relative to each other to peel the adhesive sheet S; a detecting means 17 for detecting the position of the outer periphery of the adhesive sheet S, and outputting a signal thereof; an input means 18 for inputting a correction value; a controlling means 19 for determining a pressing position of the peeling tape PT to the adhesive sheet S based on the output signal from the detecting means 17 and the correction value, and controlling the moving means 15 so as to stick the adhesive sheet S at the pressing position.
    • 片材剥离装置10包括:粘贴装置14,用于通过将剥离带PT压在粘合片S上来粘贴剥离带PT; 用于移动粘贴在粘合片S上的剥离带PT的移动装置15和用于保持晶片W相对于彼此剥离粘合片S的保持装置11; 检测装置17,用于检测粘合片S的外周的位置,并输出其信号; 用于输入校正值的输入装置18; 控制装置19,用于根据来自检测装置17的输出信号和修正值确定剥离带PT到粘合片S的按压位置,以及控制移动装置15以将粘合片S粘贴在 按压位置。
    • 16. 发明授权
    • Light emitting device
    • 发光装置
    • US06834977B2
    • 2004-12-28
    • US09871699
    • 2001-06-04
    • Yoshinobu SuehiroYuji TakahashiHideaki KatoKoichi KagaKiyotaka TeshimaShunsuke Ohtsuka
    • Yoshinobu SuehiroYuji TakahashiHideaki KatoKoichi KagaKiyotaka TeshimaShunsuke Ohtsuka
    • F21L400
    • G02B6/0068G02B6/0018G02B6/0028G02B6/0051H01L2224/48465Y10S362/80
    • Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is release therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.
    • 在基板的上表面和下表面上提供单独的引线和公共引线。 多个LED元件以阵列方式设置在基板的上表面上的公共引线上。 设置在基板的上表面上的公共引线通过通孔电镀连接到设置在基板的下表面上的公共引线。 从多个LED元件产生的热量通过设置在基板的上表面上的公共引线和通孔电镀传递到设置在基板的下表面上的公共引线,并将其从空气中释放。 通过这种结构,可以实现散热特性均匀化,散热效率提高,并且获得紧凑结构的发光装置,从而提高了色平衡,并且降低了不利的现象 避免了发光元件的输出和使用寿命的缩短。
    • 19. 发明授权
    • Semiconductor device having transmission control circuit
    • 具有传输控制电路的半导体器件
    • US07869289B2
    • 2011-01-11
    • US12367986
    • 2009-02-09
    • Keisuke FujishiroHideaki Kato
    • Keisuke FujishiroHideaki Kato
    • G11C7/00
    • G11C29/02G11C7/04G11C7/1051G11C7/1066G11C7/22G11C7/222G11C11/4076G11C11/4093G11C29/028G11C29/50012G11C2029/0409H03L7/00
    • A semiconductor device has a transmission control circuit comprising a signal transmission circuit, an output control circuit, a replica circuit and a detection circuit. The single transmission circuit receives a predetermined signal in synchronization with a first control signal, and transmits and outputs the signal through a signal bus in synchronization with a second control signal. The output control circuit supplies the second control signal and controls an output timing thereof. The replica circuit transmits and outputs a replica signal (having level shifted in response to the input timing of the predetermined signal) through a replica signal bus having the same transmission characteristics as the signal bus. The detection circuit detects shifting of the replica signal and supplies a feedback signal to the output control circuit whose output timing is controlled in accordance with the shifting timing of the replica signal based on the feedback signal.
    • 半导体器件具有包括信号传输电路,输出控制电路,复制电路和检测电路的传输控制电路。 单个发送电路与第一控制信号同步地接收预定信号,并且通过信号总线与第二控制信号同步地发送和输出信号。 输出控制电路提供第二控制信号并控制其输出定时。 复制电路通过具有与信号总线相同的传输特性的复制信号总线发送并输出复制信号(响应于预定信号的输入定时而具有电平移位)。 检测电路检测复制信号的移位,并将反馈信号提供给根据反馈信号根据复制信号的移位定时来控制其输出定时的输出控制电路。