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11. 发明授权

US5626484A Connector employing liquid conductor for electrical contact 失效
标题翻译：连接器采用液体导体进行电接触
公开(公告)号：US5626484A
公开(公告)日：1997-05-06
申请号：US261926
申请日：1994-06-17
申请人： Takeshi Okuyama , Kouji Watanabe , Tatsuo Chiyonobu , Kaoru Hashimoto , Kyoichiro Kawano
发明人： Takeshi Okuyama , Kouji Watanabe , Tatsuo Chiyonobu , Kaoru Hashimoto , Kyoichiro Kawano
IPC分类号： H01L23/32 , H01R3/08 , H01R13/03 , H01R24/00 , H01R33/76 , H01R107/00
CPC分类号： H01R13/03 , H01R12/523 , H01R12/58 , H01R3/08
摘要： A first contact member comprises a liquid conductor which comes into contact with a second contact member so as to establish the electric connection between the two contact members. A container contains the first contact member therein. The second contact member is pin-shaped. The container is tube-shaped and has a containing portion, which is filled with the liquid conductor, and has an opening through which the second contact member is inserted. An area contraction portion for contracting the cross sectional area of the container is formed at a position between the containing portion and the opening. The container is installed in a through hole provided in a base member. The container includes a pipe member of an electric conductor which comes into direct contact with the liquid conductor and a plug member to be inserted into the hole, before the pipe member is inserted, for preventing the liquid conductor from escaping from the container. The container is formed of elastic material. The portion of the container near to the opening is split into segments and portions of the segments are positioned away from each other as the portions are near to the opening so that the outer diameter of the segments is larger than the inner diameter of the hole before the container is installed into the hole, the segments approaching each other as the container is being inserted into the hole against the elastic force of the segments.
摘要翻译：第一接触构件包括与第二接触构件接触以便建立两个接触构件之间的电连接的液体导体。容器中包含第一接触构件。第二接触构件是针形。容器是管状的，并且具有填充有液体导体的容纳部分，并且具有插入第二接触构件的开口。用于收缩容器的横截面积的区域收缩部分形成在容纳部分和开口之间的位置处。容器安装在设置在基座构件中的通孔中。容器包括在插入管构件之前与液体导体直接接触的电导体的管构件和插入孔中的插塞构件，以防止液体导体从容器中逸出。容器由弹性材料形成。容器的靠近开口的部分被分割成段，并且部分的部分彼此远离彼此，因为部分靠近开口，使得段的外径大于孔的内径容器被安装到孔中，当容器相对于段的弹力被插入到孔中时，段彼此接近。

12. 发明授权

US5616164A Methods for making metal particle spherical and removing oxide film solder paste and soldering method 失效
标题翻译：制造金属颗粒球形和去除氧化膜焊膏的方法和焊接方法
公开(公告)号：US5616164A
公开(公告)日：1997-04-01
申请号：US367775
申请日：1995-01-03
申请人： Masayuki Ochiai , Kaoru Hashimoto , Toshimi Kawahara , Mayumi Osumi
发明人： Masayuki Ochiai , Kaoru Hashimoto , Toshimi Kawahara , Mayumi Osumi
IPC分类号： B22F1/00 , B23K1/20 , B23K35/02 , B23K35/26 , B23K35/30 , B23K35/36 , C23G5/032 , H05K3/34 , C23G5/00
CPC分类号： B22F1/0048 , B23K1/20 , B23K35/0244 , B23K35/36 , C23G5/032 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/268 , B23K35/3006 , H05K3/3431 , H05K3/3484 , H05K3/3494
摘要： Metal such as solder is immersed in a heating medium containing a rosin or derivative thereof and an organic solvent and heated to a temperature above the melting point of the metal, to remove the oxide film of the metal and make the metal spherical. If a hardened caster oil or high softening point rosin or derivative thereof is further added as a thickener to the heating medium, the size increase of the metal particle can be prevented. By heating at a temperature lower than the melting point of the metal, the oxide film can be removed without making the particles spherical. Using thus obtained solder particles, fluxless soldering can be done. Also, a fluxless soldering method is provided.
摘要翻译：将诸如焊料的金属浸入含有松香或其衍生物和有机溶剂的加热介质中，并加热至高于金属熔点的温度，以除去金属的氧化物膜并使金属球形。如果进一步将加硬的脚轮油或高软化点松香或其衍生物作为增稠剂加入到加热介质中，则可以防止金属颗粒的尺寸增加。通过在比金属的熔点低的温度下加热，可以除去氧化膜而不使颗粒成球形。使用如此获得的焊料颗粒，可以进行无焊剂焊接。另外，提供无焊剂焊接方法。

13. 发明授权

US5417362A Electrical connecting method 失效
标题翻译：电气连接方式
公开(公告)号：US5417362A
公开(公告)日：1995-05-23
申请号：US205766
申请日：1994-03-04
申请人： Tatsuo Chiyonobu , Kaoru Hashimoto
发明人： Tatsuo Chiyonobu , Kaoru Hashimoto
IPC分类号： B23K35/26 , H01L23/48 , H01R4/00 , H01R13/03 , H05K3/34 , B23K31/02
CPC分类号： H05K3/3463 , B23K35/26 , B32B15/01 , H01L23/48 , H01R13/03 , H01R4/00 , H01L2924/0002 , H05K2201/10704 , Y10T428/12681
摘要： An electrical connecting method connects a first contact of a first object to a second contact of a second object. The electrical connecting method includes the steps of coating a Ga system liquid metal on at least one of the first and second contacts, where the Ga system liquid metal includes a predetermined weight percent of Bi, and contacting the first contact to the second contact via the Ga system liquid metal. The predetermined weight percent of Bi is selected such that the liquid state of the Ga system liquid metal is maintained when the first and second contacts make contact via the Ga system liquid metal.
摘要翻译：电连接方法将第一物体的第一接触件连接到第二物体的第二接触件。电连接方法包括以下步骤：在第一和第二触点中的至少一个上涂覆Ga系液态金属，其中Ga系液态金属包含预定重量百分比的Bi，并通过第一触点与第二触点接触 Ga系液态金属。选择Bi的预定重量百分比，使得当第一和第二触点经由Ga系液态金属接触时，保持Ga系液态金属的液态。

14. 发明授权

US4772914A Electrophotographic copying apparatus 失效
标题翻译：电子照相复印设备
公开(公告)号：US4772914A
公开(公告)日：1988-09-20
申请号：US136506
申请日：1987-12-28
申请人： Naoyoshi Kinoshita , Kaoru Hashimoto
发明人： Naoyoshi Kinoshita , Kaoru Hashimoto
IPC分类号： G03G21/00 , G03G15/00 , G03G21/14 , G01G15/00
CPC分类号： G03G15/5004 , G03G15/80
摘要： An electrophotographic copying apparatus which is so arranged that control of its copying functions has been simplified for efficient copying operation by reducing the number of signals for controlling the copying functions, whereby respective devices for corona charging, transferring, separating and developing may be controlled by a single signal, while the number of high voltage sources for supplying power to the corona charger, transfer charger, separating charger and developing sleeve, etc. has also been reduced for simplification.
摘要翻译：一种电子照相复印装置，其设置为通过减少用于控制复印功能的信号的数量来简化其复印功能的控制以实现有效的复印操作，由此用于电晕充电，转印，分离和显影的各个装置可以通过单个信号，而为了简化，还减少了向电晕充电器，转印充电器，分离充电器和显影套筒等供电的高电压源的数量。

15. 发明授权

US5603981A Electrical connecting device and method for making same 失效
标题翻译：电气连接装置及其制造方法
公开(公告)号：US5603981A
公开(公告)日：1997-02-18
申请号：US419543
申请日：1995-04-10
申请人： Kaoru Hashimoto , Tatsuo Chiyonobu , Kyoichiro Kawano , Kouji Watanabe
发明人： Kaoru Hashimoto , Tatsuo Chiyonobu , Kyoichiro Kawano , Kouji Watanabe
IPC分类号： H01R13/03 , H01L21/48 , H01L23/498 , H01R24/00 , H01R43/00 , H01R43/16 , H05K3/34 , B05D5/12 , B23K31/02 , H01R43/02
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/49811 , H01L23/49866 , H05K3/3436 , H05K3/3463 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K2201/0373 , H05K2201/09863 , H05K2203/0594 , H05K2203/1105 , Y02P70/613 , Y10T29/49126 , Y10T29/49204 , Y10T29/49215
摘要： An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.
摘要翻译：一种电连接装置，包括在其上设置有输入/输出端子的第一电路板，每个端子具有涂覆有镓的尖端表面和在其上设置有接触端子的第二电路板，每个端子具有涂覆有铟的尖端表面或锡。当第一电路板的输入/输出端子与第二电路板的各个端子接触并且彼此电连接时，通过镓和铟或锡之间的相互作用形成低熔点合金层。第二金属层包括大致垂直于端子表面延伸的多个线状金属支撑体和由线状金属支撑体保持的低熔点金属。

16. 发明授权

US5287620A Process of producing multiple-layer glass-ceramic circuit board 失效
标题翻译：生产多层玻璃陶瓷电路板的工艺
公开(公告)号：US5287620A
公开(公告)日：1994-02-22
申请号：US894984
申请日：1992-06-08
申请人： Hitoshi Suzuki , Wataru Yamagishi , Koichi Niwa , Kaoru Hashimoto , Nobuo Kamehara
发明人： Hitoshi Suzuki , Wataru Yamagishi , Koichi Niwa , Kaoru Hashimoto , Nobuo Kamehara
IPC分类号： H01L23/15 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/46 , H01K3/10
CPC分类号： H01L21/486 , H01L21/4867 , H05K3/4061 , H05K1/0306 , H05K1/092 , H05K2201/0266 , H05K2203/1126 , H05K2203/1476 , H05K3/1291 , H05K3/4611 , H05K3/4629 , Y10T29/49165
摘要： A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.
摘要翻译：一种制造具有铜导体的多层玻璃 - 陶瓷电路板的方法，包括以下步骤：在玻璃 - 陶瓷生片中形成通孔，该通孔将形成通孔接触点; 用与陶瓷粉末混合的铜粉末的粉末混合物填充通孔，所述铜粉末和陶瓷粉末具有提供与玻璃 - 陶瓷生片相当或更大的填充密度的粉末粒度，当填充在通孔在具有填充有粉末混合物的通孔的生片上印刷导体膏，以在生片上形成电路导体图案; 层叠形成有导体图案的多个生片，以形成层压体; 加热层压体，从而除去粘合剂，预热层压体; 并开火初烧机构。

17. 发明授权

US5284796A Process for flip chip connecting a semiconductor chip 失效
标题翻译：用于倒装芯片连接半导体芯片的工艺
公开(公告)号：US5284796A
公开(公告)日：1994-02-08
申请号：US939695
申请日：1992-09-02
申请人： Teru Nakanishi , Kazuaki Karasawa , Masayuki Ochiai , Kaoru Hashimoto
发明人： Teru Nakanishi , Kazuaki Karasawa , Masayuki Ochiai , Kaoru Hashimoto
IPC分类号： H01L21/60 , H05K3/30 , H05K3/34 , H01L21/283 , H01L21/58
CPC分类号： H01L24/81 , H01L2224/10135 , H01L2224/1134 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/45124 , H01L2224/45144 , H01L2224/81001 , H01L2224/81136 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12033 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/303 , H05K3/3431
摘要： A process for a flip chip connection of a semiconductor chip includes the steps of forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed, in the vicinity of the outer periphery thereof and on the outside of the solder bumps, providing a cut groove between a plurality of the solder bumps and the stud bumps, mating the solder bumps on the semiconductor chip and the corresponding solder bumps on the circuit board and heating for subsequent integration of the mating solder bumps, and breaking way the outer peripheral portion of the semiconductor chip along the cutting groove after a flip chip connection in order to remove the stud bumps.
摘要翻译：一种用于半导体芯片的倒装芯片连接的方法包括以下步骤：在半导体芯片的外周附近形成有多个焊料凸块的半导体芯片上形成多个凸块凸块，焊料凸起，在多个焊料凸块和凸块凸块之间提供切割槽，将半导体芯片上的焊料凸块与电路板上的相应焊料凸块配合，并加热用于随后的配合焊料凸块的集成，以及断开方式在倒装芯片连接之后沿着切割凹槽的半导体芯片的外周部分，以便去除凸块凸块。

18. 发明授权

US5153645A Position indexing indicators for editing an image forming apparatus 失效
标题翻译：用于编辑图像形成装置的位置分度指示器
公开(公告)号：US5153645A
公开(公告)日：1992-10-06
申请号：US507129
申请日：1990-04-10
申请人： Hirofumi Hasegawa , Kaoru Hashimoto , Toshikazu Kawaguchi
发明人： Hirofumi Hasegawa , Kaoru Hashimoto , Toshikazu Kawaguchi
IPC分类号： G03B27/62 , G03G15/00 , G03G15/04 , G03G15/22 , G03G15/36 , H04N1/04 , H04N1/38
CPC分类号： G03G15/605 , G03G15/36 , H04N1/38
摘要： A document scanning device includes an index lever for indicating a boundary between a plurality of areas dividing a document on a platen and a photoelectric detector for detecting the position of the boundary. The index lever includes a marker which gives information about the boundary to the detector and a lever which moves the marker between a detectable position where the detector can detect the marker and a non-detectable position where the detector cannot detect the marker. The document scanning device is effective to be applied to a copying machine equipped with an editing function of the document.
摘要翻译：文件扫描装置包括用于指示分割压板上的原稿的多个区域与用于检测边界位置的光电检测器之间的边界的分度杆。索引杆包括标记，其向检测器提供关于边界的信息，以及将标记移动到检测器可以检测标记的可检测位置和检测器不能检测标记的不可检测位置的杠杆。文件扫描装置有效地应用于配备有文件的编辑功能的复印机。

19. 发明授权

US4831418A Exposure control device of copying machine 失效
标题翻译：复印机曝光控制装置
公开(公告)号：US4831418A
公开(公告)日：1989-05-16
申请号：US021776
申请日：1987-03-04
申请人： Kouji Ito , Kaoru Hashimoto
发明人： Kouji Ito , Kaoru Hashimoto
IPC分类号： G03B27/50 , G03B27/54 , G03B27/72 , G03G15/04 , G03G15/043 , G03G15/047
CPC分类号： G03G15/047 , G03G15/043 , G03G2215/0485
摘要： An exposure control device of a copying machine is provided with a white member at an end portion of an original document holding surface of a platen so as to prevent adhesion of toners to a top end portion of the copying paper. While a scanning optical system moves from the scan start point to the border between the original document and the white member, sufficient light quantity to prevent fogging of the image of the white member is supplied by the exposure lamp. The light quantity of the exposure lamp is changed to a suitable value corresponding to the original document in response to a signal for detecting the border.
摘要翻译：复印机的曝光控制装置在压板的原稿保持表面的端部设置有白色构件，以防止调色剂粘附到复印纸的顶端部分。当扫描光学系统从扫描起始点移动到原稿和白色构件之间的边界时，曝光灯提供足够的光量以防止白色构件的图像起雾。响应于用于检测边界的信号，曝光灯的光量被改变成对应于原稿的合适值。

20. 发明授权

US4313026A Multilayer circuit boards 失效
标题翻译：多层电路板
公开(公告)号：US4313026A
公开(公告)日：1982-01-26
申请号：US88467
申请日：1979-10-26
申请人： Seiichi Yamada , Nobuo Kamehara , Kaoru Hashimoto , Hiromitsu Yokoyama , Koichi Niwa , Kyohei Murakawa
发明人： Seiichi Yamada , Nobuo Kamehara , Kaoru Hashimoto , Hiromitsu Yokoyama , Koichi Niwa , Kyohei Murakawa
IPC分类号： B32B15/04 , H01L23/15 , H01L23/538 , H05K1/03 , H05K3/46
CPC分类号： H05K3/4664 , H01L23/15 , H01L23/5383 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011
摘要： A multilayer circuit board (10) for putting semiconductor devices thereon consists of conductor layers (6, 60, 61, 62, 63) made of a metal selected from the group consisting of Au, Ag, Cu and an alloy thereof, insulating material (2, 7) made of glass-ceramic and an alumina sintered plate (1). The glass-ceramic is comprised of borosilicate glass and alumina and has a low dielectric constant and a thermal expansion coefficient approaching that of the semiconductor devices. The alumina sintered plate (1) is placed between the ground and supply voltage conductor layers (62, 63) and the signal conductor layers (60).
摘要翻译：用于将半导体器件放置在其上的多层电路板（10）由选自Au，Ag，Cu及其合金的金属制成的导体层（6,60,61,62,63），绝缘材料（ 2，7）由玻璃陶瓷和氧化铝烧结板（1）制成。玻璃陶瓷由硼硅酸盐玻璃和氧化铝组成，并且具有接近半导体器件的低介电常数和热膨胀系数。氧化铝烧结板（1）放置在接地电源电压导体层（62,63）和信号导体层（60）之间。

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