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11. 发明授权

US08081444B2 Computer system with airflow guiding duct 有权
标题翻译：带导气管的电脑系统
公开(公告)号：US08081444B2
公开(公告)日：2011-12-20
申请号：US12697219
申请日：2010-01-30
申请人： Bo Xiao , Xiang-Kun Zeng , Zhi-Guo Zhang , Li-Fu Xu
发明人： Bo Xiao , Xiang-Kun Zeng , Zhi-Guo Zhang , Li-Fu Xu
IPC分类号： H05K5/00 , H05K7/20 , G06F1/20 , A47B81/00
CPC分类号： G06F1/20
摘要： A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.
摘要翻译：计算机系统包括底盘和气流引导导管。底盘包括机箱底壁，底盘前壁和底盘后壁。底盘前壁限定第一通风孔，底盘后壁限定第二通风孔。主机板固定在机箱前壁和底盘后墙之间的机箱底壁上。存储卡固定在主板上。气流引导管固定在底盘中，并包括入口部分。入口部分覆盖存储卡的一部分，以引导气流。气流通过第一个通气孔，存储卡上方流过底盘，然后通过第二个通风孔流出机箱。

12. 发明授权

US08625278B2 Electronic device with cooler 失效
标题翻译：带冷却器的电子设备
公开(公告)号：US08625278B2
公开(公告)日：2014-01-07
申请号：US13300735
申请日：2011-11-21
申请人： Rui Wang , Zhi-Jiang Yao , Li-Fu Xu
发明人： Rui Wang , Zhi-Jiang Yao , Li-Fu Xu
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.
摘要翻译：电子装置包括一个包括多个第一锁定件，一个限定多个第一和第二定位孔的背板和一个电路板的冷却器。背板通过与第二定位孔接合的第一锁定构件连接到冷却器。第一安装构件和第二安装构件适于容纳发热构件。第一安装构件限定多个锁定孔。第一定位孔位于第二定位孔之中。第二安装构件接收发热部件，电路板位于第二安装构件和背板之间，第一安装构件固定在电路板上; 当第一安装构件接收到发热部件时，电路板在第一安装构件和背板之间，第一安装构件固定在背板上。

13. 发明授权

US08593803B2 Mounting apparatus for data storage device 失效
标题翻译：数据存储装置用安装装置
公开(公告)号：US08593803B2
公开(公告)日：2013-11-26
申请号：US13176380
申请日：2011-07-05
申请人： Xue-Jiao Guo , Tai-Bao Wu , Shu-Qiu Wang , Li-Fu Xu
发明人： Xue-Jiao Guo , Tai-Bao Wu , Shu-Qiu Wang , Li-Fu Xu
IPC分类号： H05K7/00
CPC分类号： G06F1/187
摘要： A mounting apparatus for mounting a data storage device, includes a drive bracket and a slider mounted on the data storage device. The drive bracket includes a side piece in which a sliding groove is located. The sliding groove includes a first end and a second end. The second end is adjacent to an edge of the side piece. The first end is located on the side piece. A guiding surface is located at the first end. The guiding surface inclines from an inner surface of the side piece to an outer surface of the side piece. The slider slides in the sliding groove from the second end to the first end. The slider abuts the guiding surface. The guiding surface retains the slider at the first end.
摘要翻译：一种用于安装数据存储装置的安装装置，包括安装在数据存储装置上的驱动支架和滑块。驱动支架包括一个滑动槽所在的侧件。滑动槽包括第一端和第二端。第二端与侧件的边缘相邻。第一端位于侧面。引导表面位于第一端。引导表面从侧片的内表面倾斜到侧片的外表面。滑块在滑动槽中从第二端滑动到第一端。滑块抵靠导向面。引导表面在第一端保持滑块。

14. 发明授权

US08513908B2 Fan speed control circuit 失效
标题翻译：风扇转速控制电路
公开(公告)号：US08513908B2
公开(公告)日：2013-08-20
申请号：US13166364
申请日：2011-06-22
申请人： Xiang-Ji Huang , Jian Fu , Zhi-Jiang Yao , Li-Fu Xu
发明人： Xiang-Ji Huang , Jian Fu , Zhi-Jiang Yao , Li-Fu Xu
IPC分类号： H02P7/00
CPC分类号： F04D27/004
摘要： A fan speed control circuit includes a first fan, a second fan, a first temperature sensor, a second temperature sensor, a PWM regulator, and a driving module. The first temperature sensor senses a temperature of the first component to generate a first temperature signal. The second temperature sensor senses a temperature of a second component to generate a second temperature signal. The PWM regulator is connected to the first temperature sensor and the second temperature sensor. The PWM regulator generates a first PWM signal according to the first temperature signal and generates a second PWM signal according to the second temperature signal. The driving module is connected to the PWM regulator. The driving module generates a first driving voltage provided to the first fan according to the first PWM signal. The driving module also generates a second driving voltage provided to the second fan according to the second PWM signal.
摘要翻译：风扇速度控制电路包括第一风扇，第二风扇，第一温度传感器，第二温度传感器，PWM调节器和驱动模块。第一温度传感器感测第一部件的温度以产生第一温度信号。第二温度传感器感测第二部件的温度以产生第二温度信号。 PWM调节器连接到第一温度传感器和第二温度传感器。 PWM调节器根据第一温度信号产生第一PWM信号，并根据第二温度信号产生第二PWM信号。驱动模块连接到PWM调节器。驱动模块根据第一PWM信号产生提供给第一风扇的第一驱动电压。驱动模块还根据第二PWM信号产生提供给第二风扇的第二驱动电压。

15. 发明授权

US07193849B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07193849B2
公开(公告)日：2007-03-20
申请号：US10900864
申请日：2004-07-27
申请人： Li-Fu Xu , Chih-Hao Yang , Ching-Bai Hwang
发明人： Li-Fu Xu , Chih-Hao Yang , Ching-Bai Hwang
IPC分类号： H05K7/20
CPC分类号： F04D29/582 , H01L23/3733 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.
摘要翻译：散热装置适于从电子包装中去除热量。散热装置包括用于产生气流的风扇（1）和散热器（2）。散热器具有基座（21）和多个翅片（22）。一个腔室（25）被限定为围绕着用于接纳风扇的翅片。在基座中限定了至少一个通道（23），用于允许气流直接吹在散热器下面的电子封装上。

16. 发明授权

US08737070B2 Heat dissipation system 有权
标题翻译：散热系统
公开(公告)号：US08737070B2
公开(公告)日：2014-05-27
申请号：US13195004
申请日：2011-08-01
申请人： Chao-Jun Zhu , Xiang-Kun Zeng , Zhi-Jiang Yao , Li-Fu Xu
发明人： Chao-Jun Zhu , Xiang-Kun Zeng , Zhi-Jiang Yao , Li-Fu Xu
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.
摘要翻译：散热系统包括外壳，第一散热器，第二散热器和风扇。外壳包括底板，第一侧板和第二侧板。第一排气区位于第一侧板上。第二通气区域位于第二侧板上。第一发热装置和第二发热装置安装在底板上并且位于第一通气区域和第二通气区域之间。第一散热器安装在底板上并接触第一发热装置。第二散热器安装在底板上并接触第二发热装置。多个第二散热片位于第二散热器上。每个第二个鳍都是波浪的。风扇位于第一通气区域和第二通气区域之间。风扇适于驱动空气流过第一通气区域，第一散热器，多个第二散热片和第二通气区域。

17. 发明授权

US08512076B2 Input/output connector assembly 失效
标题翻译：输入/输出连接器组件
公开(公告)号：US08512076B2
公开(公告)日：2013-08-20
申请号：US13369389
申请日：2012-02-09
申请人： Xiang Zhang , Chao Geng , Li-Fu Xu
发明人： Xiang Zhang , Chao Geng , Li-Fu Xu
IPC分类号： H01R13/648
CPC分类号： H01R13/6596 , H01R13/518
摘要： An input/output (I/O) connector assembly includes an I/O connector module and a holder for accommodating the I/O connector module. The I/O connector module includes a plurality of I/O connectors and an Electro Magnetic Interference (EMI) shielding member located below each of the plurality of I/O connectors. The EMI shielding member includes a flat piece, a first resilient piece extending slantingly upwards from the flat piece, and a second resilient piece extending slantingly downward from the flat piece. A plurality of receiving holes is defined in the holder. The plurality of I/O connecters extends through and protrudes out from the plurality of receiving holes. The first resilient piece abuts a corresponding one of the plurality of I/O connectors. The second resilient piece abuts the holder.
摘要翻译：输入/输出（I / O）连接器组件包括I / O连接器模块和用于容纳I / O连接器模块的支架。 I / O连接器模块包括位于多个I / O连接器下方的多个I / O连接器和电磁干扰（EMI）屏蔽构件。 EMI屏蔽构件包括平片，从平片向上倾斜延伸的第一弹性件和从平件向下倾斜延伸的第二弹性件。在保持器中限定多个接收孔。多个I / O连接器延伸穿过并从多个接收孔中突出出来。第一弹性件邻接多个I / O连接器中相应的一个。第二弹性件邻接支架。

18. 发明授权

US08272514B2 Packing apparatus 失效
标题翻译：包装设备
公开(公告)号：US08272514B2
公开(公告)日：2012-09-25
申请号：US13217502
申请日：2011-08-25
申请人： Biao Zeng , Miao He , Zhi-Guo Zhang , Li-Fu Xu
发明人： Biao Zeng , Miao He , Zhi-Guo Zhang , Li-Fu Xu
IPC分类号： B65D81/02
CPC分类号： B65D81/057 , B65D5/328 , B65D81/107
摘要： A packing apparatus includes a case for receiving a plurality of electronic devices and a plurality of mounting members placed in the case. Each mounting member defines a receiving space. A shock-absorbing member is located in the receiving space and divides the receiving space into two mounting spaces. A shock-absorbing block is located in each mounting space. A slot is defined between the shock-absorbing block and the shock-absorbing member. A side of the shock-absorbing block towards the shock-absorbing member defines an oblique plane as a cushioning surface, and the oblique plane abuts the shock-absorbing member when the shock-absorbing member is bent.
摘要翻译：包装设备包括用于接收多个电子设备的壳体和放置在壳体中的多个安装构件。每个安装构件限定接收空间。吸收元件位于接收空间中，并将接收空间分成两个安装空间。减震块位于每个安装空间中。在减震块和减震构件之间限定有槽。减震块朝向减震构件的一侧限定了作为缓冲表面的倾斜平面，并且当减震构件弯曲时，倾斜平面邻接减震构件。

19. 发明授权

US08120909B2 Computer system with airflow guiding duct 失效
标题翻译：带导气管的电脑系统
公开(公告)号：US08120909B2
公开(公告)日：2012-02-21
申请号：US12697304
申请日：2010-02-01
申请人： Jian Fu , Xiao-Su Zhu , Zhi-Jiang Yao , Li-Fu Xu
发明人： Jian Fu , Xiao-Su Zhu , Zhi-Jiang Yao , Li-Fu Xu
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： A computer system includes a chassis, a motherboard, a heat sink and an airflow guiding duct. The chassis includes a chassis bottom wall, a first chassis sidewall, and a second chassis sidewall. The first chassis sidewall defines a first ventilation hole. The second chassis sidewall defines a second ventilation hole. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The airflow guiding duct is configured to guide airflow flowing from the second ventilation to the first ventilation hole. A fan is received inside the airflow guiding duct.
摘要翻译：计算机系统包括底盘，母板，散热器和气流引导导管。底盘包括底盘底壁，第一底盘侧壁和第二底盘侧壁。第一底盘侧壁限定第一通风孔。第二底盘侧壁限定第二通风孔。具有芯片的主板固定在机箱底壁上。散热片固定在主板上以冷却芯片。气流引导管被构造成引导从第二通风流向第一通风孔的气流。风扇被容纳在气流引导管内。

20. 发明授权

US07672135B2 Heat sink 失效
标题翻译：散热器
公开(公告)号：US07672135B2
公开(公告)日：2010-03-02
申请号：US12124791
申请日：2008-05-21
申请人： Li-Fu Xu , Zhi-Guo Zhang , Ning-Yu Wang
发明人： Li-Fu Xu , Zhi-Guo Zhang , Ning-Yu Wang
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/367 , G06F1/20 , H01L23/427 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a plurality of fins parallel to each other. The fins include a top portion having a flange. The opposite ends of each flange are rounded. Two rounded corners are located below the plane defined by the flange.
摘要翻译：散热器包括彼此平行的多个翅片。翅片包括具有凸缘的顶部部分。每个法兰的相对端是圆形的。两个圆角位于由法兰限定的平面下方。

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