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11. 发明申请

US20120145211A1 THERMOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：热电装置及其制造方法
公开(公告)号：US20120145211A1
公开(公告)日：2012-06-14
申请号：US13305251
申请日：2011-11-28
申请人： Sung Ho LEE , Dong Hyeok Choi , Yong Suk Kim
发明人： Sung Ho LEE , Dong Hyeok Choi , Yong Suk Kim
IPC分类号： H01L35/28 , H01L35/34
CPC分类号： H01L35/32 , H01L35/34
摘要： The present invention provides a thermoelectric device including: thermoelectric sheets made of a thermoelectric semiconductor and laminated in multi-layers; and a metal sheet interposed between the thermoelectric sheets, and a method of manufacturing the same.
摘要翻译：本发明提供一种热电装置，包括：由热电半导体制成的层叠多层的热电片; 以及置于热电板之间的金属片及其制造方法。

12. 发明申请

US20130087179A1 THERMOELECTRIC MODULE 审中-公开
标题翻译：热电模块
公开(公告)号：US20130087179A1
公开(公告)日：2013-04-11
申请号：US13365194
申请日：2012-02-02
申请人： Dong Hyeok Choi , Yong Suk Kim , Sung Ho Lee
发明人： Dong Hyeok Choi , Yong Suk Kim , Sung Ho Lee
IPC分类号： H01L35/32
CPC分类号： H01L35/32
摘要： Provided is a thermoelectric module applied to an energy storage device cooling system to increase the cooling efficiency. The thermoelectric module includes P-type thermoelectric elements and N-type thermoelectric elements disposed alternately, a metal electrode provided between each P-type thermoelectric element and each N-type thermoelectric element, a heat absorbing plate connected to a bottom side of the metal electrode located between the P-type thermoelectric element and the N-type thermoelectric element, and a heat emitting plate connected to a top side of the metal electrode located between the N-type thermoelectric element and the P-type thermoelectric element.
摘要翻译：提供了一种应用于能量存储装置冷却系统的热电模块，以提高冷却效率。热电模块包括交替布置的P型热电元件和N型热电元件，设置在每个P型热电元件和每个N型热电元件之间的金属电极，连接到金属电极的底侧的吸热板位于P型热电元件和N型热电元件之间，并且发热板连接到位于N型热电元件和P型热电元件之间的金属电极的顶侧。

13. 发明申请

US20120279544A1 THERMOELECTRIC MODULE 审中-公开
标题翻译：热电模块
公开(公告)号：US20120279544A1
公开(公告)日：2012-11-08
申请号：US13412126
申请日：2012-03-05
申请人： Dong Hyeok CHOI , Yong Suk Kim , Sung Ho Lee
发明人： Dong Hyeok CHOI , Yong Suk Kim , Sung Ho Lee
IPC分类号： H01L35/32
CPC分类号： H01L35/32
摘要： Disclosed herein is a thermoelectric module using a thermoelectric element capable of showing a spin Seebeck effect. The present invention provides a new thermoelectric module including: an upper substrate on which a plurality of upper metal electrodes are arranged; a lower substrate on which a plurality of lower metal electrodes are arranged; p-type semiconductor devices and n-type semiconductor devices that are disposed between the upper substrate and the lower substrate and are electrically bonded alternately to each other by the plurality of upper metal electrodes and the plurality of lower metal electrodes; and ferrite elements that are disposed between the p-type semiconductor devices and the n-type semiconductor devices, top ends and bottom ends of the ferrite elements being bonded to the upper metal electrodes and the lower metal electrodes.
摘要翻译：本文公开了一种使用能够显示旋转塞贝克效应的热电元件的热电模块。本发明提供一种新的热电模块，包括：上基板，多个上金属电极布置在其上; 其上布置有多个下部金属电极的下部基板; p型半导体器件和n型半导体器件，其设置在上基板和下基板之间，并且通过多个上金属电极和多个下金属电极彼此交替电接合; 以及设置在p型半导体器件和n型半导体器件之间的铁氧体元件，铁氧体元件的顶端和底端被接合到上金属电极和下金属电极。

14. 发明申请

US20120060887A1 ASYMMETRIC THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：不对称热电模块及其制造方法
公开(公告)号：US20120060887A1
公开(公告)日：2012-03-15
申请号：US12963185
申请日：2010-12-08
申请人： Yong Suk Kim , Jeong Ho Yoon , Sung Ho Lee , Dong Hyeok Choi , Ji Hye Shim , Kyu Hwan Oh
发明人： Yong Suk Kim , Jeong Ho Yoon , Sung Ho Lee , Dong Hyeok Choi , Ji Hye Shim , Kyu Hwan Oh
IPC分类号： H01L35/30 , H01L21/04 , H01L35/34
CPC分类号： H01L35/32 , H01L35/34
摘要： Disclosed is an asymmetric thermoelectric module, which includes a plurality of first-type thermoelectric semiconductor elements, a plurality of second-type thermoelectric semiconductor elements, a plurality of pairs of assistant layers having different melting points and disposed on the upper and lower surfaces of the first-type and second-type thermoelectric semiconductor elements, and a pair of substrates.
摘要翻译：公开了一种不对称热电模块，其包括多个第一类型热电半导体元件，多个第二类型热电半导体元件，多对辅助层，其具有不同的熔点并且设置在该第一类型热电半导体元件的上表面和下表面上第一型和第二型热电半导体元件，以及一对基板。

15. 发明授权

US09236172B2 Conductor pattern and coil parts having the same 有权
标题翻译：导体图案和具有相同的线圈部件
公开(公告)号：US09236172B2
公开(公告)日：2016-01-12
申请号：US13420540
申请日：2012-03-14
申请人： Sang Moon Lee , Yong Suk Kim , Jeong Bok Kwak , Young Seuck Yoo , Sung Kwon Wi
发明人： Sang Moon Lee , Yong Suk Kim , Jeong Bok Kwak , Young Seuck Yoo , Sung Kwon Wi
IPC分类号： H01F5/00 , H01F27/28
CPC分类号： H01F5/003
摘要： A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion.
摘要翻译：在磁性基板上形成为螺旋状的线圈部的导体图案，其包括：主导体图案; 以及形成在主导体图案上的次级导体图案。主导体图案形成为具有电连接到第一水平部分的一个表面的端部的第一水平部分和第一垂直部分的纵向部分。次级导体图案形成为具有包括对应于第一水平部分的第二水平部分的纵向部分和与第二水平部分的一个表面的端部电连接的第二垂直部分。

16. 发明授权

US08704265B2 Light emitting device package and lighting apparatus using the same 有权
标题翻译：发光装置封装及使用其的照明装置
公开(公告)号：US08704265B2
公开(公告)日：2014-04-22
申请号：US12675582
申请日：2008-08-27
申请人： Bu Wan Seo , Sung Woo Kim , Hoon Hur , Yong Suk Kim
发明人： Bu Wan Seo , Sung Woo Kim , Hoon Hur , Yong Suk Kim
IPC分类号： H01L33/00 , H01L29/40 , H01L29/207 , H01L23/48
CPC分类号： H01L25/0753 , H01L33/50 , H01L2224/48137 , H01L2224/48227 , H05B33/0821 , H05B33/0857 , Y02B20/341 , H01L2224/48091 , H01L2924/00014
摘要： In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.
摘要翻译：在一个实施例中，发光器件封装包括封装主体，附接到封装体的电极以及电连接到电极的至少两个发光器件。每个发光装置发射与其他发光装置不同颜色的光。在至少两个发光器件上形成保护层，并且形成在保护层上方的荧光体层。其他实施例包括其他结构，例如每个发光器件上的各个荧光体层。并且，包括封装的光装置可以包括驱动封装的发光器件的单个驱动器。

17. 发明授权

US08568014B2 Back-light unit 有权
标题翻译：背光单元
公开(公告)号：US08568014B2
公开(公告)日：2013-10-29
申请号：US13003056
申请日：2008-11-18
申请人： Yong Suk Kim
发明人： Yong Suk Kim
IPC分类号： G09F13/10
CPC分类号： G02F1/133608 , G02F2201/54
摘要： A back-light unit is disclosed. An object of the present invention is to provide a back-light unit that is able to improve structural stability and mass-production efficiency. The back-light unit includes a circuit substrate comprising a plurality of light sources arranged thereon, an optical sheet positioned on the circuit substrate, a plurality of supporting parts arranged between the circuit substrate and the optical sheet to support the optical sheet, which are installed to the circuit substrate by using surface-mount technology (SMT).
摘要翻译：公开了背光单元。本发明的目的是提供能够提高结构稳定性和批量生产效率的背光单元。背光单元包括：电路基板，包括布置在其上的多个光源;位于电路基板上的光学片;布置在电路基板和光学片之间的多个支撑部件，用于支撑光学片，通过使用表面贴装技术（SMT）到电路基板。

18. 发明申请

US20130169399A1 THIN FILM-TYPE COIL COMPONENT AND METHOD OF FABRICATING THE SAME 有权
公开(公告)号：US20130169399A1
公开(公告)日：2013-07-04
申请号：US13417832
申请日：2012-03-12
申请人： Young Seuck YOO , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
发明人： Young Seuck YOO , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
IPC分类号： H01F27/28 , B05D5/12
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/29 , H01F41/042 , H01F2027/2809
摘要： There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.

19. 发明授权

US08106306B2 Ceramic multi-layer circuit substrate and manufacturing method thereof 有权
标题翻译：陶瓷多层电路基板及其制造方法
公开(公告)号：US08106306B2
公开(公告)日：2012-01-31
申请号：US12405729
申请日：2009-03-17
申请人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yong Suk Kim
发明人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yong Suk Kim
IPC分类号： H05K1/00
CPC分类号： H05K3/4629 , B32B18/00 , C04B37/005 , C04B2237/04 , C04B2237/32 , C04B2237/52 , C04B2237/562 , C04B2237/565 , C04B2237/595 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/708 , H05K1/0306 , H05K3/1291 , H05K3/4617 , H05K2201/0195 , H05K2201/096 , H05K2201/10378 , H05K2203/1126 , H05K2203/1476
摘要： Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.
摘要翻译：提供一种制造陶瓷多层电路基板的方法。形成多个陶瓷块，每个陶瓷块中的一个或多个具有通孔电极的陶瓷生片分别彼此层叠，然后烧制。烧制的陶瓷块彼此对准。制备一个或多个接合生片，每个接合生片具有与陶瓷块的通孔电极对应的位置的接合电极。每个接合生片被插入在彼此相对的一对陶瓷块之间。陶瓷块和接合生片结合，然后烧制。

20. 发明申请

US20110148447A1 MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME 审中-公开
标题翻译：多层陶瓷基板和探针板使用支柱导体及其制作方法
公开(公告)号：US20110148447A1
公开(公告)日：2011-06-23
申请号：US12836955
申请日：2010-07-15
申请人： Won Hee YOO , Byeung Gyu Chang , Yong Suk Kim
发明人： Won Hee YOO , Byeung Gyu Chang , Yong Suk Kim
IPC分类号： G01R1/067 , C04B35/74 , H05K1/11
CPC分类号： B32B18/00 , C04B35/63436 , C04B35/63456 , C04B37/026 , C04B2237/04 , C04B2237/12 , C04B2237/32 , C04B2237/40 , C04B2237/52 , C04B2237/592 , C04B2237/62 , C04B2237/68 , C04B2237/72 , G01R1/06711 , G01R3/00 , H05K3/4007 , H05K3/4046 , H05K3/4061 , H05K3/4629 , H05K2201/0367 , H05K2203/025
摘要： There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided.
摘要翻译：提供了一种多层陶瓷基板和使用柱状导体形成的探针板，所述柱状导体通过包括制备具有至少一个通孔的陶瓷片而形成; 用导电材料填充通孔的内部; 烧制陶瓷片，使得导电材料被烧制以形成柱状导体; 并且去除陶瓷片以使柱状导体残留，并且制造其方法。多层陶瓷基板和探针板使用可以填充陶瓷烧结体内形成的未填充区域的柱状导体，使得其电特性和表面平坦性得到改善。此外，提供了通过使用具有改善的陶瓷烧结体和连接焊盘之间的粘合性和电特性的柱状导体形成的多层陶瓷基板和探针板及其制造方法。

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