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    • 11. 发明授权
    • Structure of a mask ROM device
    • 掩模ROM器件的结构
    • US06713821B2
    • 2004-03-30
    • US10155619
    • 2002-05-24
    • Tso-Hung FanMu-Yi LiuKwang-Yang ChanYen-Hung YehTao-Cheng Lu
    • Tso-Hung FanMu-Yi LiuKwang-Yang ChanYen-Hung YehTao-Cheng Lu
    • H01L31062
    • H01L27/1126H01L27/112
    • A mask ROM device is described. The mask ROM device includes a substrate, a gate, a double diffused source/drain region that comprises a first doped region and a second doped region, a channel region, a coding region, a dielectric layer and a word line. The gate is disposed on the substrate. The double diffused source/drain region is positioned beside the sides of the gate in the substrate, wherein the second doped region is located at the periphery of the first doped region in the substrate. The channel region is located between the double diffused source/drain region in the substrate. The coding region is disposed in the substrate at the intersection between the sides of the channel region and the double diffused source/drain region. The dielectric layer is disposed above the double diffused source/drain region, while the word line is disposed above the dielectric layer and the gate.
    • 描述掩模ROM设备。 掩模ROM器件包括衬底,栅极,包括第一掺杂区域和第二掺杂区域的双扩散源极/漏极区域,沟道区域,编码区域,电介质层和字线。 栅极设置在基板上。 双扩散源极/漏极区域位于衬底中的栅极的侧面旁边,其中第二掺杂区域位于衬底中的第一掺杂区域的外围。 沟道区位于衬底中的双扩散源极/漏极区之间。 编码区域设置在沟道区域和双扩散源极/漏极区域的相交处的衬底中。 电介质层设置在双扩散源极/漏极区域的上方,而字线设置在电介质层和栅极之上。
    • 12. 发明授权
    • 2-bit mask ROM device and fabrication method thereof
    • 2位掩模ROM器件及其制造方法
    • US06590266B1
    • 2003-07-08
    • US10064906
    • 2002-08-28
    • Mu-Yi LiuTso-Hung FanKwang-Yang ChanYen-Hung YehTao-Cheng Lu
    • Mu-Yi LiuTso-Hung FanKwang-Yang ChanYen-Hung YehTao-Cheng Lu
    • H01L2994
    • H01L27/11266H01L27/112
    • A 2-bit mask ROM device and a fabrication method thereof are described. The 2-bit mask ROM device includes a substrate; a gate structure, disposed on a part of the substrate; a 2-bit code region, configured in the substrate beside both sides of the gate structure; at least one spacer, disposed on both sides of the gate structure; a buried drain region, configured in the substrate beside both sides of the spacer; a doped region, configured in the substrate between the buried drain region and the 2-bit code region, wherein the dopant type of the doped region is different from that for the 2-bit code region and the dopant concentration in the doped region is higher than that in the 2-bit code region; an insulation layer, disposed above the buried drain region; and a word line disposed on the gate structures along a same row.
    • 描述2位掩模ROM器件及其制造方法。 2位掩模ROM器件包括衬底; 栅极结构,设置在所述衬底的一部分上; 2位代码区,配置在栅极结构的两侧旁边的基板中; 设置在所述栅极结构的两侧的至少一个间隔物; 掩埋漏极区域,被构造在所述衬底旁边的所述间隔物的两侧; 掺杂区域,配置在掩埋漏极区域和2位码区域之间的衬底中,其中掺杂区域的掺杂剂类型与2位码区域的掺杂区域不同,并且掺杂区域中的掺杂剂浓度更高 比在2位代码区域; 绝缘层,设置在所述掩埋漏极区域的上方; 以及沿同一行设置在栅极结构上的字线。
    • 15. 发明授权
    • Electro-static discharge protection circuit for dual-polarity input/output pad
    • 用于双极输入/输出板的静电放电保护电路
    • US07012305B2
    • 2006-03-14
    • US10708171
    • 2004-02-12
    • Shin SuChun-Hsiang LaiChia-Ling LuYen-Hung YehTao-Cheng Lu
    • Shin SuChun-Hsiang LaiChia-Ling LuYen-Hung YehTao-Cheng Lu
    • H01L23/62
    • H01L27/0262H01L29/7436
    • An electro-static discharge (ESD) protection circuit for a dual polarity I/O pad is provided. The protection circuit includes a substrate of first type; a deep well region of second type disposed in the first type substrate; a well region of first type disposed in the second type deep well region; a first transistor disposed over the well region of first type, wherein the first transistor has a first source, a first gate and a first drain; a second transistor disposed over the substrate of first type, wherein the second transistor has a second source, a second gate and a second drain, and the second source is connected with the first drain, and both of them are disposed in a portion of the well region of first type, the deep well region of second type and the substrate of first type; a first doped region is disposed in the first type well region and laterally adjacent to the first source; a second doped region is disposed in the substrate of first type and laterally adjacent to the second drain.
    • 提供用于双极性I / O焊盘的静电放电(ESD)保护电路。 保护电路包括第一类型的衬底; 设置在所述第一类型基板中的第二类型的深阱区域; 设置在第二类型深井区域中的第一类型井区域; 第一晶体管设置在第一类型的阱区上,其中第一晶体管具有第一源极,第一栅极和第一漏极; 设置在第一类型的衬底上的第二晶体管,其中第二晶体管具有第二源极,第二栅极和第二漏极,并且第二源极与第一漏极连接,并且它们都被布置在 第一类井区,第二类深井区和第一类的基底; 第一掺杂区域设置在第一类型阱区域中并且横向邻近于第一源极; 第二掺杂区域设置在第一类型的衬底中并且横向邻近于第二漏极。
    • 17. 发明申请
    • [ELECTRO-STATIC DISCHARGE PROTECTION CIRCUIT FOR DUAL-POLARITY INPUT/OUTPUT PAD]
    • [双极输入/输出板电静电放电保护电路]
    • US20050133868A1
    • 2005-06-23
    • US10708171
    • 2004-02-12
    • Shin SuChun-Hsiang LaiChia-Ling LuYen-Hung YehTao-Cheng Lu
    • Shin SuChun-Hsiang LaiChia-Ling LuYen-Hung YehTao-Cheng Lu
    • H01L23/60H01L23/62H01L27/02H01L29/74
    • H01L27/0262H01L29/7436
    • An electro-static discharge (ESD) protection circuit for a dual polarity I/O pad is provided. The protection circuit includes a substrate of first type; a deep well region of second type disposed in the first type substrate; a well region of first type disposed in the second type deep well region; a first transistor disposed over the well region of first type, wherein the first transistor has a first source, a first gate and a first drain; a second transistor disposed over the substrate of first type, wherein the second transistor has a second source, a second gate and a second drain, and the second source is connected with the first drain, and both of them are disposed in a portion of the well region of first type, the deep well region of second type and the substrate of first type; a first doped region is disposed in the first type well region and laterally adjacent to the first source; a second doped region is disposed in the substrate of first type and laterally adjacent to the second drain.
    • 提供用于双极性I / O焊盘的静电放电(ESD)保护电路。 保护电路包括第一类型的衬底; 设置在所述第一类型基板中的第二类型的深阱区域; 设置在第二类型深井区域中的第一类型井区域; 第一晶体管设置在第一类型的阱区上,其中第一晶体管具有第一源极,第一栅极和第一漏极; 设置在第一类型的衬底上的第二晶体管,其中第二晶体管具有第二源极,第二栅极和第二漏极,并且第二源极与第一漏极连接,并且它们都被布置在 第一类井区,第二类深井区和第一类的基底; 第一掺杂区域设置在第一类型阱区域中并且横向邻近于第一源极; 第二掺杂区域设置在第一类型的衬底中并且横向邻近于第二漏极。