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11. 发明申请

US20050230366A1 System for and method of manufacturing gravure printing plates 审中-公开
公开(公告)号：US20050230366A1
公开(公告)日：2005-10-20
申请号：US11062328
申请日：2005-02-18
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： B23K26/00 , B23K26/38 , B41C1/05 , B41N1/06 , B41N6/00 , G03F7/00
CPC分类号： B41C1/05
摘要： A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.

12. 发明申请

US20050217521A1 System for and method of manufacturing gravure printing plates 审中-公开
标题翻译：凹版印刷机的制造方法和制造方法
公开(公告)号：US20050217521A1
公开(公告)日：2005-10-06
申请号：US11062331
申请日：2005-02-18
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： B23K26/00 , B23K26/38 , B41C1/05 , B41N1/06 , B41N6/00 , G03F7/00
CPC分类号： B41C1/05
摘要： A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.
摘要翻译：操作激光钻孔系统以在不刻蚀或使用危险化学品的情况下制造凹版印刷版的方法包括激活激光钻孔系统，包括皮秒激光器，光阀和适于旋转凹版滚筒坯件的机构。光阀的操作包括将光阀设置成阻挡和/或允许从激光钻孔系统传播的激光能量的脉冲，该激光能量沿着凹版滚筒毛坯的基本上整个长度消融细胞的线性图案。细胞的钻孔包括瞄准凹版滚筒坯料上的激光钻孔系统，使得当子束沿着光路传播到目标区域并撞击凹版滚筒坯体时，材料的消融发生，其中目标区域内的特定单元格根据光阀的设置钻孔或不钻孔凹版滚筒坯料。

13. 发明授权

US06897405B2 Method of laser milling using constant tool path algorithm 有权
标题翻译：使用恒定刀具路径算法的激光铣削方法
公开(公告)号：US06897405B2
公开(公告)日：2005-05-24
申请号：US10266934
申请日：2002-10-08
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： B41J2/135 , B23K26/00 , B23K26/04 , B23K26/06 , B23K26/067 , B23K26/08 , B23K26/10 , B23K26/36 , B23K26/38 , B41J2/16 , G05B19/416 , H05K3/00 , B23K26/02
CPC分类号： B23K26/04 , B23K26/0608 , B23K26/0624 , B23K26/067 , B23K26/0676 , B23K26/08 , B23K26/082 , B23K26/10 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/389 , B23K26/40 , B23K2103/172 , B23K2103/42 , B23K2103/50 , B41J2/162 , B41J2/1634 , H05K3/0026
摘要： A method of creating a milled structure in a fixed material using a moving laser beam is disclosed, where a picosecond laser provides short pulses of light energy to produce required exposure steps, where a variable rate of laser beam movement conducts the milling upon the material, where the laser beam tool path directs the milling process to produce a milled hole of high quality and repeatability, and where the knowledge of how to measure these 3 quantities is returned as feedback into the laser system. The present invention is further embodied as a spiral milled tool path structured to achieve the customer specified tapered hole shape. The constant arc speed tool path is required to produce tapered holes to customer specification.
摘要翻译：公开了一种使用移动激光束在固定材料中产生铣削结构的方法，其中皮秒激光器提供短脉冲的光能以产生所需的曝光步骤，其中激光束移动的可变速率对材料进行研磨，其中激光束刀具路径引导铣削过程以产生高质量和重复性的铣孔，并且其中如何测量这3个量的知识作为反馈返回到激光系统中。本发明进一步体现为一种螺旋铣削刀具路径，其构造为实现客户指定的锥形孔形状。恒定电弧速度刀具路径需要根据客户要求生产锥形孔。

14. 发明授权

US06804574B2 Method of using a computer with a laser drilling system 失效
公开(公告)号：US06804574B2
公开(公告)日：2004-10-12
申请号：US10267007
申请日：2002-10-08
申请人： Xinbing Liu , Chen-Hsiung Cheng , John Cronin , Nancy Edwards , Christopher Rose
发明人： Xinbing Liu , Chen-Hsiung Cheng , John Cronin , Nancy Edwards , Christopher Rose
IPC分类号： G06F1900
CPC分类号： G05B19/4068 , B23K26/0624 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2103/42 , B23K2103/50 , B41J2/161 , B41J2/1634 , G05B2219/35304
摘要： A method of determining compatibility of user input parameters for use with a laser drilling system includes providing compatibility data characteristic of a plurality of laser drilling operations, receiving input parameters characteristic of a desired laser drilling operation, and comparing the input parameters to the compatibility data, thereby determining whether the input parameters are incompatible.

15. 发明授权

US06749285B2 Method of milling repeatable exit holes in ink-jet nozzles 失效
标题翻译：喷墨喷嘴中可重复出口孔的铣削方法
公开(公告)号：US06749285B2
公开(公告)日：2004-06-15
申请号：US10267009
申请日：2002-10-08
申请人： Xinbing Liu , Chen-Hsiung Cheng , Dan Hogan , Nancy Edwards
发明人： Xinbing Liu , Chen-Hsiung Cheng , Dan Hogan , Nancy Edwards
IPC分类号： B41J214
CPC分类号： B41J2/1634 , B23K26/0624 , B23K26/389 , B41J2/162 , Y10T29/47
摘要： A method of laser milling an aperture in a workpiece for use with manufacturing ink-jet nozzles includes initially illuminating a surface of the workpiece with a laser beam at a point within an outer perimeter of a desired aperture and a distance away from the outer perimeter sufficient to substantially avoid initial ablation of the outer perimeter. The laser beam is driven substantially in the direction of the outer perimeter at a variable rate controlled to avoid deformation of the outer perimeter. Material of the workpiece is ablated in a pattern designed to substantially remove material within the outer perimeter, thereby forming the aperture.
摘要翻译：激光研磨工件中用于制造喷墨喷嘴的孔的方法包括：在期望孔的外周边内的点处，以及远离外周边的距离，初始地用激光束照射工件的表面足够的距离以基本上避免外周的初始消融。激光束基本上沿着外周边的方向以可控速率被控制，以避免外周的变形。工件的材料以设计成基本上去除外周边内的材料的图案被烧蚀，从而形成孔。

16. 发明授权

US06720519B2 System and method of laser drilling 失效
标题翻译：激光钻孔的系统和方法
公开(公告)号：US06720519B2
公开(公告)日：2004-04-13
申请号：US10252630
申请日：2002-09-23
申请人： Xinbing Liu , Chen-Hsiung Cheng
发明人： Xinbing Liu , Chen-Hsiung Cheng
IPC分类号： B23K2636
CPC分类号： B41J2/1634 , B23K26/04 , B23K26/0608 , B23K26/0624 , B23K26/067 , B23K26/073 , B23K26/3576 , B23K26/384 , B23K26/389 , B41J2/162
摘要： The present invention is a system for laser micromachining where a scan mirror and milling algorithm are used to produce high precision, controlled hole shapes in a workpiece. A picosecond laser that produces short pulses is used to reduce thermal effects to improve the quality and repeatability of the milled holes, and a Diffractive Optical Element (DOE) is used to split a single beam into a plurality of beams to allow parallel drilling of the workpiece. A method for operating a laser drilling system where high precision, controlled hole shapes in a workpiece are drilled includes using a scan mirror and milling algorithm, and using a picosecond laser in conjunction with a DOE, thus ensuring that spectral bandwidth issues and thermal issues are addressed to improve the quality and repeatability of the holes.
摘要翻译：本发明是用于激光微加工的系统，其中使用扫描镜和铣削算法来在工件中产生高精度，受控的孔形状。使用产生短脉冲的皮秒激光器来减少热效应以提高铣削孔的质量和重复性，并且使用衍射光学元件（DOE）将单个光束分成多个光束，以允许平行钻孔工件。一种用于操作激光钻孔系统的方法，其中钻出工件中的高精度，受控孔形状包括使用扫描镜和铣削算法，以及使用皮秒激光与DOE结合，从而确保光谱带宽问题和热问题是旨在提高孔的质量和重复性。

17. 发明申请

US20080291451A1 Composite Sheet Material Selection Method for Use in Ultra-Fast Laser Patterning 有权
标题翻译：用于超快速激光图案的复合片材选择方法
公开(公告)号：US20080291451A1
公开(公告)日：2008-11-27
申请号：US11579521
申请日：2005-05-10
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： G01N21/59 , B23K26/00
CPC分类号： B23K26/032 , B23K26/03 , B23K2103/30 , B23K2103/50 , B32B38/10 , B32B2310/0843
摘要： The present invention is a method of selecting composite sheet materials for use in ultra-fast laser patterning of layers of organic thin film material such as OLEDs. The material is selected to accomplish patterning of upper layers without damaging underlying layers by using an ultra-fast laser programmed with the appropriate laser processing parameters. These parameters are derived by examining each layer's absorption spectra, thermal, and chemical characteristics. The method of the present invention includes measuring each layer's absorption spectrum, examining each layer's thermal and chemical characteristics, determining if the layer is ablatable, determining the laser setup, patterning the layer through laser ablation processing, and determining if more layers need to be ablated. Further, the method includes a sub-method of selecting an alternate material if a layer's material characteristics are not favorable for ablation without damaging underlying layers.
摘要翻译：本发明是选择用于有机薄膜材料如OLED的超快速激光图案化的复合片材的方法。选择材料以通过使用用适当的激光加工参数编程的超快速激光来实现上层的图案化而不损坏下层。这些参数是通过检查每层的吸收光谱，热和化学特性得出的。本发明的方法包括测量每层的吸收光谱，检查每层的热和化学特性，确定层是否可消融，确定激光设置，通过激光烧蚀处理对层进行图案化，以及确定是否需要消除更多的层。此外，该方法包括如果层的材料特性不利于消融而不损坏下层，则选择替代材料的子方法。

18. 发明申请

US20060267211A1 Manufacturing method of composite sheet material using ultrafast laser pulses 审中-公开
标题翻译：使用超快激光脉冲的复合片材的制造方法
公开(公告)号：US20060267211A1
公开(公告)日：2006-11-30
申请号：US11501542
申请日：2006-08-09
申请人： Chen-Hsiung Cheng , Xinbing Liu , Atsushi Sogami , Kazuo Nishimura
发明人： Chen-Hsiung Cheng , Xinbing Liu , Atsushi Sogami , Kazuo Nishimura
IPC分类号： H01L23/48
CPC分类号： H01L51/0017 , H01L51/0009 , H01L51/56 , Y10S438/94
摘要： A patterned, multi-layered thin film structure is patterned using ultra-fast lasers and absorption spectroscopy without damaging underlying layers of the layered structure. The structure is made by selecting ablatable layers based on their thermal, strength and absorption spectra and by using an ultra-fast laser programmed with the appropriate wavelength (λ), pulse width (τ), spectral width (Δλ), spot size, bite size and fluence. The end structure may have features (such as vias, insulating areas, or inkjet printed areas) patterned in the last (top) layer applied or at deeper layers within the layered structure, and can be used as components of organic light emitting didoes (OLEDs) and organic thin film transistors (OTFTs). The method of the present invention includes determining the product's specifications, providing a substrate, selecting a layer, applying the layer, patterning the layer and determining if more layers need to be added to the multi-layered thin film structure.
摘要翻译：使用超快速激光和吸收光谱对图案化的多层薄膜结构进行图案化，而不会损坏层状结构的下层。该结构通过基于它们的热，强度和吸收光谱选择可烧蚀层并通过使用用适当波长（λ），脉冲宽度（τ），光谱宽度（Deltalambda），斑点大小，咬合而编程的超快激光大小和注量。端部结构可以具有在分层结构中施加的最后（顶部）层中或更深层上图案化的特征（例如通孔，绝缘区域或喷墨印刷区域），并且可以用作有机发光二极管（OLED））和有机薄膜晶体管（OTFT）。本发明的方法包括确定产品的规格，提供衬底，选择一层，施加该层，图案化层，以及确定是否需要将更多的层加入多层薄膜结构中。

19. 发明申请

US20050255715A1 Manufacturing method of composite sheet material using ultrafast laser pulses 有权
标题翻译：使用超快激光脉冲的复合片材的制造方法
公开(公告)号：US20050255715A1
公开(公告)日：2005-11-17
申请号：US10844608
申请日：2004-05-12
申请人： Chen-Hsiung Cheng , Xinbing Liu , Atsushi Sogami , Kazuo Nishimura
发明人： Chen-Hsiung Cheng , Xinbing Liu , Atsushi Sogami , Kazuo Nishimura
IPC分类号： H01L21/26 , H01L21/324 , H01L21/42 , H01L21/477 , H01L29/06 , H01L31/0328 , H01L31/0336 , H01L31/072 , H01L31/109 , H01L51/00 , H01L51/56
CPC分类号： H01L51/0017 , H01L51/0009 , H01L51/56 , Y10S438/94
摘要： A patterned, multi-layered thin film structure is patterned using ultra-fast lasers and absorption spectroscopy without damaging underlying layers of the layered structure. The structure is made by selecting ablatable layers based on their thermal, strength and absorption spectra and by using an ultra-fast laser programmed with the appropriate wavelength (λ), pulse width (τ), spectral width (Δλ), spot size, bite size and fluence. The end structure may have features (such as vias, insulating areas, or inkjet printed areas) patterned in the last (top) layer applied or at deeper layers within the layered structure, and can be used as components of organic light emitting didoes (OLEDs) and organic thin film transistors (OTFTs). The method of the present invention includes determining the product's specifications, providing a substrate, selecting a layer, applying the layer, patterning the layer and determining if more layers need to be added to the multi-layered thin film structure.
摘要翻译：使用超快速激光和吸收光谱对图案化的多层薄膜结构进行图案化，而不会损坏层状结构的下层。该结构通过基于它们的热，强度和吸收光谱选择可烧蚀层并通过使用用适当波长（λ），脉冲宽度（τ），光谱宽度（Deltalambda），斑点大小，咬合而编程的超快激光大小和注量。端部结构可以具有在分层结构中施加的最后（顶部）层中或更深层上图案化的特征（例如通孔，绝缘区域或喷墨印刷区域），并且可以用作有机发光二极管（OLED））和有机薄膜晶体管（OTFT）。本发明的方法包括确定产品的规格，提供衬底，选择一层，施加该层，图案化层，以及确定是否需要将更多的层加入多层薄膜结构中。

20. 发明申请

US20050230367A1 System for and method of manufacturing gravure printing plates 审中-公开
公开(公告)号：US20050230367A1
公开(公告)日：2005-10-20
申请号：US11062329
申请日：2005-02-18
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： B23K26/00 , B23K26/38 , B41C1/05 , B41N1/06 , B41N6/00 , G03F7/00
CPC分类号： B41C1/05
摘要： A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.

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