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11. 发明申请

US20080223604A1 PROCESS FOR PREPARING AN ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE 审中-公开
标题翻译：制备电性稳定的铜填充电导体粘合剂的方法
公开(公告)号：US20080223604A1
公开(公告)日：2008-09-18
申请号：US12032644
申请日：2008-02-16
申请人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
发明人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
IPC分类号： H05K1/09 , H01B1/12
CPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , H05K1/095 , H05K3/321 , H05K3/4069 , H05K2203/122 , Y10T156/10 , Y10T428/24917
摘要： A process for preparing an electrically conductive adhesive (ECA) with low and stable contact resistance by mixing at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
摘要翻译：一种通过将至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂，至少一种有机物酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。

12. 发明申请

US20070236890A1 OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHANCED THERMAL PERFORMANCE AND RELIABILITY OF FLIP CHIP ORGANIC PACKAGES 失效
标题翻译：优化的导热板和附件方法，用于提高散热片有机包装的热性能和可靠性
公开(公告)号：US20070236890A1
公开(公告)日：2007-10-11
申请号：US11758128
申请日：2007-06-05
申请人： Jeffrey Coffin , Michael Gaynes , David Questad , Kamal Sikka , Hilton Toy , Jamil Wakil
发明人： Jeffrey Coffin , Michael Gaynes , David Questad , Kamal Sikka , Hilton Toy , Jamil Wakil
IPC分类号： H05K7/20 , B21D53/02
CPC分类号： H01L23/34 , H01L23/3735 , H01L23/42 , H01L2224/73204 , H01L2224/73253 , H01L2924/3511 , Y10T29/49004 , Y10T29/49083 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49135 , Y10T29/4935
摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.
摘要翻译：披露的是导热板。每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙经。另外，本公开提供了形成板并将板结合到发热结构的相关方法。在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

13. 发明申请

US20060104031A1 FLUIDIC COOLING SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS 有权
标题翻译：流体冷却系统和电子元件的方法
公开(公告)号：US20060104031A1
公开(公告)日：2006-05-18
申请号：US10904555
申请日：2004-11-16
申请人： Evan Colgan , Frank Pompeo , Glenn Daves , Hilton Toy , Bruce Furman , David Edwards , Michael Gaynes , Mukta Farooq , Sung Kang , Steven Ostrander , Jaimal Williamson , Da-Yuan Shih , Donald Henderson
发明人： Evan Colgan , Frank Pompeo , Glenn Daves , Hilton Toy , Bruce Furman , David Edwards , Michael Gaynes , Mukta Farooq , Sung Kang , Steven Ostrander , Jaimal Williamson , Da-Yuan Shih , Donald Henderson
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要： A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.
摘要翻译：提供了一种用于组件载体上的电子部件的冷却系统。该系统包括框架，喷雾歧管和密封构件。框架具有开口并且可连接到部件载体，使得在开口和电子部件之间限定环形区域。喷雾歧管被密封在开口上以限定电子部件的后表面上方的喷射区域。喷雾歧管在后表面喷洒冷却液。密封构件密封环形区域，使得部件载体上的输入/输出连接器与冷却流体隔离。

14. 发明申请

US20050062154A1 Electronically grounded heat spreader 失效
标题翻译：电子接地散热器
公开(公告)号：US20050062154A1
公开(公告)日：2005-03-24
申请号：US10665997
申请日：2003-09-18
申请人： Eric Duchesne , Michael Gaynes
发明人： Eric Duchesne , Michael Gaynes
IPC分类号： H01L23/373 , H01L23/48
CPC分类号： H01L23/3737 , H01L24/32 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/07802 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： Electronically grounded heat spreaders are employed in connection with the dissipation of heat, which is generated by electronic devices, such as semiconductor chips. Also provided is a novel method for the adhesive fastening of metallic heat spreaders to semiconductor chips through the combined use of electrically conductive and non-conductive adhesive materials.
摘要翻译：电子接地的散热器与由诸如半导体芯片的电子设备产生的热耗散结合使用。还提供了一种用于通过组合使用导电和非导电粘合剂材料将金属散热器粘合到半导体芯片上的新颖方法。

15. 发明授权

US08288177B2 SER testing for an IC chip using hot underfill 有权
标题翻译： SER测试使用热底部填充的IC芯片
公开(公告)号：US08288177B2
公开(公告)日：2012-10-16
申请号：US12857864
申请日：2010-08-17
申请人： Michael Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth F. Latzko , Aparna Prabhakar
发明人： Michael Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth F. Latzko , Aparna Prabhakar
IPC分类号： G01R31/26 , G01R31/00 , H01L21/00 , H01L21/44 , H01L23/58 , H01L23/552
CPC分类号： H01L22/20 , G01R31/31816 , H01L21/563 , H01L22/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/014 , H01L2924/3511 , H01L2924/00
摘要： A method for detecting soft errors in an integrated circuit (IC) due to transient-particle emission, the IC comprising at least one chip and a substrate includes mixing an epoxy with a radioactive source to form a hot underfill (HUF); underfilling the chip with the HUF; sealing the underfilled chip; measuring a radioactivity of the HUF at an edge of the chip; measuring the radioactivity of the HUF on a test coupon; testing the IC for soft errors by determining a current radioactivity of the HUF at the time of testing based on the measured radioactivity; and after the expiration of a radioactive decay period of the radioactive source, using the IC in a computing device by a user.
摘要翻译：一种用于检测由于瞬态粒子发射引起的集成电路（IC）中的软错误的方法，包括至少一个芯片和基板的IC包括将环氧树脂与放射源混合以形成热底部填充物（HUF）; 用HUF填充芯片; 密封未充足的芯片; 测量芯片边缘处的HUF的放射性; 测量试样上HUF的放射性; 通过基于测量的放射性确定在测试时的HUF的当前放射性来测试IC的软错误; 并在放射源的放射性衰变期到期后，由用户在计算装置中使用IC。

16. 发明申请

US20070178625A1 COMPOSITE INTERCONNECT STRUCTURE USING INJECTION MOLDED SOLDER TECHNIQUE 有权
标题翻译：使用注射成型焊接技术的复合互连结构
公开(公告)号：US20070178625A1
公开(公告)日：2007-08-02
申请号：US11307291
申请日：2006-01-31
申请人： David Danovitch , Mukta Farooq , Michael Gaynes
发明人： David Danovitch , Mukta Farooq , Michael Gaynes
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/4853 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13147 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2224/05599
摘要： Composite interconnect structure forming methods using injection molded solder are disclosed. The methods provide a mold having at least one opening formed therein with each opening including a member of a material dissimilar to a solder to be used to fill the opening, and then fill the remainder of each opening with solder to form the composite interconnect structure. The resulting composite interconnect structure can be leveraged to achieve a much larger variety of composite structures than exhibited by the prior art. For example, the material may be chosen to be more electrically conductive than the solder portion, more electromigration-resistant than the solder portion and/or more fatigue-resistant than the solder portion. In one embodiment, the composite interconnect structure can include an optical structure, or plastic or ceramic material. The optical structure provides radiation propagation and/or amplification between waveguides in the substrate and device, and the plastic material provides fatigue-resistance.
摘要翻译：公开了使用注射成型焊料的复合互连结构形成方法。该方法提供了一种具有形成在其中的至少一个开口的模具，每个开口包括与用于填充开口的焊料不同的材料的构件，然后用焊料填充每个开口的剩余部分以形成复合互连结构。可以利用所得到的复合互连结构来实现比现有技术表现出的更大的复合结构。例如，材料可以被选择为比焊料部分更具导电性，比焊料部分更具有电迁移性和/或比焊料部分更耐疲劳性。在一个实施例中，复合互连结构可以包括光学结构，或塑料或陶瓷材料。该光学结构在衬底和器件中的波导之间提供辐射传播和/或放大，并且塑料材料提供耐疲劳性。

17. 发明申请

US20060197065A1 Electrically stable copper filled electrically conductive adhesive 有权
标题翻译：电稳定铜填充导电胶
公开(公告)号：US20060197065A1
公开(公告)日：2006-09-07
申请号：US11072193
申请日：2005-03-04
申请人： Michael Gaynes , Jeffrey Gelorme , Luis Matienzo , Rebecca Northey , Michael Vincent
发明人： Michael Gaynes , Jeffrey Gelorme , Luis Matienzo , Rebecca Northey , Michael Vincent
IPC分类号： B32B3/00
CPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , H05K1/095 , H05K3/321 , H05K3/4069 , H05K2203/122 , Y10T156/10 , Y10T428/24917
摘要： An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims. 37 CFR §1.72(b).
摘要翻译：具有低且稳定的接触电阻的导电粘合剂（ECA）包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，铜颗粒，至少一种固化剂和至少一种有机酸催化剂。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。要强调的是，该摘要被提供以符合要求抽象的规则，这将允许搜索者或其他读者快速地确定技术公开的主题。提交它的理解是，它不会用于解释或限制所附权利要求的范围或含义。 37 CFR§1.72（b）。

18. 发明授权

US07078802B2 Method for bonding heat sinks to overmold material and resulting structure 失效
标题翻译：将散热片粘结到包覆成型材料和结构上的方法
公开(公告)号：US07078802B2
公开(公告)日：2006-07-18
申请号：US10983563
申请日：2004-11-08
申请人： Michael Gaynes , William R. Hill
发明人： Michael Gaynes , William R. Hill
IPC分类号： H01L23/34 , H05H1/00 , B29C65/00
CPC分类号： B29C59/14 , H01L21/56 , H01L2224/48472 , H01L2924/15311
摘要： A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).
摘要翻译：一种方法和产生的电子封装，其中散热器固定到封装的电介质材料（例如，包覆成型）上。电介质的表面被粗糙化（例如，使用研磨纸或垫）以增强随后的使用粘合剂的介电散热器接合。电介质材料的粗糙化的外表面通常含有作为这种包装中使用的许多介电材料的固有副产品的有机硅材料（例如，硅氧烷残余物），其能够仍然可靠地连接到散热器，尽管存在所述硅树脂。在另一个实施方案中，粗糙化表面增强了这种类型的介电材料的标记（例如使用油墨）。

19. 发明授权

US08293141B2 Electronic device comprising electrically stable copper filled electrically conductive adhesive 失效
标题翻译：电子器件包括电稳定的铜填充导电粘合剂
公开(公告)号：US08293141B2
公开(公告)日：2012-10-23
申请号：US12032645
申请日：2008-02-16
申请人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
发明人： Michael Gaynes , Jeffrey D. Gelorme , Luis J. Matienzo , Rebecca S. Northey , Michael B. Vincent
IPC分类号： H01B1/06 , H01B1/02
CPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , H05K1/095 , H05K3/321 , H05K3/4069 , H05K2203/122 , Y10T156/10 , Y10T428/24917
摘要： An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.
摘要翻译：一种电子设备，包括由导电粘合剂（ECA）形成的电子电路结构，其具有低且稳定的接触电阻，包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，至少一种固化剂，至少一种有机酸催化剂和铜颗粒。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。

20. 发明申请

US20120045853A1 SER Testing for an IC Chip Using Hot Underfill 有权
标题翻译：使用热底部填充的IC芯片的SER测试
公开(公告)号：US20120045853A1
公开(公告)日：2012-02-23
申请号：US12857864
申请日：2010-08-17
申请人： Michael Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth F. Latzko , Aparna Prabhakar
发明人： Michael Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth F. Latzko , Aparna Prabhakar
IPC分类号： H01L21/66 , H01L21/56
CPC分类号： H01L22/20 , G01R31/31816 , H01L21/563 , H01L22/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/014 , H01L2924/3511 , H01L2924/00
摘要： A method for detecting soft errors in an integrated circuit (IC) due to transient-particle emission, the IC comprising at least one chip and a substrate includes mixing an epoxy with a radioactive source to form a hot underfill (HUF); underfilling the chip with the HUF; sealing the underfilled chip; measuring a radioactivity of the HUF at an edge of the chip; measuring the radioactivity of the HUF on a test coupon; testing the IC for soft errors by determining a current radioactivity of the HUF at the time of testing based on the measured radioactivity; and after the expiration of a radioactive decay period of the radioactive source, using the IC in a computing device by a user.
摘要翻译：一种用于检测由于瞬态粒子发射引起的集成电路（IC）中的软错误的方法，包括至少一个芯片和基板的IC包括将环氧树脂与放射源混合以形成热底部填充物（HUF）; 用HUF填充芯片; 密封未充足的芯片; 测量芯片边缘处的HUF的放射性; 测量试样上HUF的放射性; 通过基于测量的放射性确定在测试时的HUF的当前放射性来测试IC的软错误; 并在放射源的放射性衰变期到期后，由用户在计算装置中使用IC。

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