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11. 发明申请

US20060081857A1 Light emitting device having circuit protection unit 有权
标题翻译：具有电路保护单元的发光装置
公开(公告)号：US20060081857A1
公开(公告)日：2006-04-20
申请号：US11222922
申请日：2005-09-08
申请人： Steve Hong , Jen-Shui Wang , Tzu-Feng Tseng , Ching-San Tao , Wen-Huang Liu , Min-Hsun Hsieh
发明人： Steve Hong , Jen-Shui Wang , Tzu-Feng Tseng , Ching-San Tao , Wen-Huang Liu , Min-Hsun Hsieh
IPC分类号： H01L33/00
CPC分类号： H01L33/40 , H01L27/15 , H01L33/32 , H01L33/38 , H01L2224/16145 , H01L2224/48145 , H01S5/0421 , H01S5/06825
摘要： A light emitting device having a circuit protection unit is provided. The circuit protection unit has a low-resistance layer and a potential barrier layer, wherein a barrier potential exists at the interface between the low-resistance layer and the potential barrier layer. The circuit protection unit is electrically connected with the light emitting device. When an electrostatic discharge or excessive forward current is occurred in the light emitting device, the circuit protection unit provides a rectifying function for preventing damages caused by static electricity or excessive forward current to the light emitting device.
摘要翻译：提供具有电路保护单元的发光装置。电路保护单元具有低电阻层和势垒层，其中势垒电位存在于低电阻层和势垒层之间的界面处。电路保护单元与发光装置电连接。当在发光装置中发生静电放电或过大的正向电流时，电路保护单元提供整流功能，用于防止由静电引起的损坏或向发光器件产生过大的正向电流。

12. 发明授权

US07095765B2 Light emitter with a voltage dependent resistor layer 有权
标题翻译：具有电压依赖电阻层的发光体
公开(公告)号：US07095765B2
公开(公告)日：2006-08-22
申请号：US10249804
申请日：2003-05-09
申请人： Wen-Huang Liu , Po-Chun Liu , Min-Hsun Hsieh , Tzu-Feng Tseng , Chen Ou
发明人： Wen-Huang Liu , Po-Chun Liu , Min-Hsun Hsieh , Tzu-Feng Tseng , Chen Ou
IPC分类号： H01S3/00 , H01L27/15
CPC分类号： H01L27/15 , H01L25/167 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/14 , H01L2924/0002 , H01L2924/00 , H01L2924/00014
摘要： A light emitter includes an emitting stack, a first electrode, a second electrode and a voltage dependent resistor layer. The emitter stack has a first surface area and a second surface area. The first electrode is formed on the first surface area of the emitting stack. The second electrode is formed on the second surface area of the emitting stack. The voltage dependent resistor layer is connected to the first and second electrodes, and is formed during the formation of the light emitter thus improving the yield of the light emitter.
摘要翻译：光发射器包括发射堆叠，第一电极，第二电极和电压依赖电阻层。发射极堆叠具有第一表面区域和第二表面区域。第一电极形成在发射堆叠的第一表面区域上。第二电极形成在发射堆叠的第二表面区域上。电压依赖电阻层连接到第一和第二电极，并且在形成发光体期间形成，从而提高发光体的产量。

13. 发明申请

US20050194587A1 ORGANIC ADHESIVE LIGHT-EMITTING DEVICE WITH OHMIC METAL BULGE 有权
标题翻译：有机粘合剂发光装置与OHMIC金属大片
公开(公告)号：US20050194587A1
公开(公告)日：2005-09-08
申请号：US10905697
申请日：2005-01-18
申请人： Min-Hsun Hsieh , Wen-Huang Liu , Tzu-Feng Tseng , Ya-Lan Yang
发明人： Min-Hsun Hsieh , Wen-Huang Liu , Tzu-Feng Tseng , Ya-Lan Yang
IPC分类号： H01L29/08 , H01L33/36 , H01L33/60 , H04N1/04
CPC分类号： H01L33/40 , H01L33/387
摘要： Organic adhesive light-emitting device with ohmic metal bulge. The organic adhesive light-emitting device includes a conductive substrate, a light-emitting stack layer, a metal layer formed over the conductive substrate, a reflective layer formed over the light-emitting stack layer, and an organic adhesive layer having an ohmic metal bulge and an adhesive material around the ohmic metal bulge. The adhesive material bonds the metal layer and the reflective layer together, while the ohmic metal bulge forms ohmic contacts with the metal layer and the reflective layer. The configuration can simplify a light-emitting diode.
摘要翻译：有机粘合剂发光装置，欧姆金属凸起。有机粘合发光装置包括导电性基板，发光层叠层，形成在导电性基板上的金属层，形成在发光层叠层上的反射层和具有欧姆金属凸起的有机粘合层以及围绕欧姆金属凸起的粘合剂材料。粘合剂材料将金属层和反射层粘合在一起，而欧姆金属凸起与金属层和反射层形成欧姆接触。该配置可以简化发光二极管。

14. 发明授权

US08237182B2 Organic adhesive light-emitting device with ohmic metal bulge 有权
标题翻译：有机粘合剂发光装置，欧姆金属凸起
公开(公告)号：US08237182B2
公开(公告)日：2012-08-07
申请号：US10905697
申请日：2005-01-18
申请人： Min-Hsun Hsieh , Wen-Huang Liu , Tzu-Feng Tseng , Ya-Lan Yang
发明人： Min-Hsun Hsieh , Wen-Huang Liu , Tzu-Feng Tseng , Ya-Lan Yang
IPC分类号： H01L33/00
CPC分类号： H01L33/40 , H01L33/387
摘要： Organic adhesive light-emitting device with ohmic metal bulge. The organic adhesive light-emitting device includes a conductive substrate, a light-emitting stack layer, a metal layer formed over the conductive substrate, a reflective layer formed over the light-emitting stack layer, and an organic adhesive layer having an ohmic metal bulge and an adhesive material around the ohmic metal bulge. The adhesive material bonds the metal layer and the reflective layer together, while the ohmic metal bulge forms ohmic contacts with the metal layer and the reflective layer. The configuration can simplify a light-emitting diode.
摘要翻译：有机粘合剂发光装置，欧姆金属凸起。有机粘合发光装置包括导电性基板，发光层叠层，形成在导电性基板上的金属层，形成在发光层叠层上的反射层和具有欧姆金属凸起的有机粘合层以及围绕欧姆金属凸起的粘合剂材料。粘合剂材料将金属层和反射层粘合在一起，而欧姆金属凸起与金属层和反射层形成欧姆接触。该配置可以简化发光二极管。

15. 发明授权

US07205573B2 Light-emitting device having a compound substrate 有权
标题翻译：具有复合基板的发光装置
公开(公告)号：US07205573B2
公开(公告)日：2007-04-17
申请号：US10708047
申请日：2004-02-05
申请人： Wen-Huang Liu , Jen-Shui Wang , Min-Hsun Hsieh
发明人： Wen-Huang Liu , Jen-Shui Wang , Min-Hsun Hsieh
IPC分类号： H01L27/15
CPC分类号： H01L33/641 , H01L33/46
摘要： A light-emitting device includes a compound substrate including a high thermal conductive layer and a substrate disposed around the high thermal conductive layer, an adhesive layer formed on the compound substrate, and a light-emitting stack layer formed on the adhesive layer. Therefore, problems in cutting a metal layer in a grain cutting process are solved.
摘要翻译：发光装置包括具有高导热层的复合基板和设置在高导热层周围的基板，形成在复合基板上的粘合层和形成在粘合剂层上的发光堆叠层。因此，解决了在切割工序中切割金属层的问题。

16. 发明申请

US20050017249A1 LIGHT-EMITTING DEVICE HAVING A COMPOUND SUBSTRATE 有权
标题翻译：具有复合基板的发光装置
公开(公告)号：US20050017249A1
公开(公告)日：2005-01-27
申请号：US10708047
申请日：2004-02-05
申请人： Wen-Huang Liu , Jen-Shui Wang , Min-Hsun Hsieh
发明人： Wen-Huang Liu , Jen-Shui Wang , Min-Hsun Hsieh
IPC分类号： H01L27/15 , H01L33/46 , H01L33/64
CPC分类号： H01L33/641 , H01L33/46
摘要： A light-emitting device includes a compound substrate including a high thermal conductive layer and a substrate disposed around the high thermal conductive layer, an adhesive layer formed on the compound substrate, and a light-emitting stack layer formed on the adhesive layer. Therefore, problems in cutting a metal layer in a grain cutting process are solved.
摘要翻译：发光装置包括具有高导热层的复合基板和设置在高导热层周围的基板，形成在复合基板上的粘合层和形成在粘合剂层上的发光堆叠层。因此，解决了在切割工序中切割金属层的问题。

17. 发明申请

US20060091419A1 Light emitting diode 有权
标题翻译：发光二极管
公开(公告)号：US20060091419A1
公开(公告)日：2006-05-04
申请号：US11256400
申请日：2005-10-19
申请人： Chih-Chiang Lu , Ling-Chin Huang , Jen-Shui Wang , Wen-Huang Liu , Min-Hsun Hsieh
发明人： Chih-Chiang Lu , Ling-Chin Huang , Jen-Shui Wang , Wen-Huang Liu , Min-Hsun Hsieh
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/0079 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode (LED) utilizes an adhesive layer to adhere a light emitting layer to a substrate. The LED further comprises an electrode buffer layer to enhance the adhesion between the electrode and the light emitting diode, and thus to improve the yield rate of the LED.
摘要翻译：发光二极管（LED）利用粘合剂层将发光层粘附到基底上。 LED还包括电极缓冲层，以增强电极和发光二极管之间的粘附，从而提高LED的产率。

18. 发明授权

US07615796B2 Light emitting diode having an electrode buffer layer 有权
标题翻译：具有电极缓冲层的发光二极管
公开(公告)号：US07615796B2
公开(公告)日：2009-11-10
申请号：US11256400
申请日：2005-10-19
申请人： Chih-Chiang Lu , Ling-Chin Huang , Jen-Shul Wang , Wen-Huang Liu , Min-Hsun Hsieh
发明人： Chih-Chiang Lu , Ling-Chin Huang , Jen-Shul Wang , Wen-Huang Liu , Min-Hsun Hsieh
IPC分类号： H01L33/00 , H01L27/15
CPC分类号： H01L33/62 , H01L33/0079 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode (LED) utilizes an adhesive layer to adhere a light emitting layer to a substrate. The LED further comprises an electrode buffer layer to enhance the adhesion between the electrode and the light emitting diode, and thus to improve the yield rate of the LED.
摘要翻译：发光二极管（LED）利用粘合剂层将发光层粘附到基底上。 LED还包括电极缓冲层，以增强电极和发光二极管之间的粘附，从而提高LED的产率。

19. 发明授权

US07154121B2 Light emitting device with a micro-reflection structure carrier 有权
标题翻译：具有微反射结构载体的发光器件
公开(公告)号：US07154121B2
公开(公告)日：2006-12-26
申请号：US10605808
申请日：2003-10-29
申请人： Min-Hsun Hsieh , Wen-Huang Liu
发明人： Min-Hsun Hsieh , Wen-Huang Liu
IPC分类号： H01L29/06 , H01L29/09 , H01L27/15 , H01L33/00 , H01L31/00
CPC分类号： H01L33/46 , H01L2933/0091
摘要： A light emitting device includes a micro-reflection structure carrier, which is formed by performing etching process on a carrier, a reflection layer, a light emitting layer, and a transparent adhesive layer, wherein the reflection layer is formed over the micro-reflection structure carrier and adheres to the light emitting layer through the transparent adhesive layer.
摘要翻译：发光器件包括通过对载体，反射层，发光层和透明粘合剂层进行蚀刻工艺形成的微反射结构载体，其中反射层形成在微反射结构上并通过透明粘合剂层粘附到发光层。

20. 发明授权

US08405107B2 Light-emitting element 有权
标题翻译：发光元件
公开(公告)号：US08405107B2
公开(公告)日：2013-03-26
申请号：US12979281
申请日：2010-12-27
申请人： Chiu-Lin Yao , Min-Hsun Hsieh , Wen-Huang Liu
发明人： Chiu-Lin Yao , Min-Hsun Hsieh , Wen-Huang Liu
IPC分类号： H01L33/00
CPC分类号： H01L33/42 , F21K9/00 , H01L25/0753 , H01L27/153 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A light emitting element includes a carrier, a conductive connecting structure disposed on the carrier, an epitaxial stack structure including at least a first lighting stack and a second lighting stack disposed on the conductive connecting structure, an insulation section disposed between the epitaxial stack structure and the conductive connecting structure, and at least a metal line laid on the surface of the light emitting element, wherein the first light emitting stack further includes two electrodes having different polarity formed thereon; the second lighting stack is electrically connected to the conductive connecting structure at the bottom thereof and includes an electrode formed thereon. The insulation section is disposed below the first lighting stack to make the first lighting stack be insulated from the conductive connecting structure. The metal lines and the conductive connecting structure are electrically connected to each of the lighting stacks in parallel connection or series connection.
摘要翻译：发光元件包括载体，布置在载体上的导电连接结构，外延堆叠结构，至少包括设置在导电连接结构上的第一照明堆叠和第二照明堆叠;绝缘部分，设置在外延堆叠结构和所述导电连接结构和至少布置在所述发光元件表面上的金属线，其中所述第一发光层还包括形成在其上的具有不同极性的两个电极; 第二照明堆叠在其底部与导电连接结构电连接并且包括形成在其上的电极。绝缘部分设置在第一照明堆叠的下方，以使第一照明堆叠与导电连接结构绝缘。金属线和导电连接结构以并联或串联连接电连接到每个照明堆叠。

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