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11. 发明申请

US20110282477A1 ENDPOINT CONTROL OF MULTIPLE SUBSTRATES WITH MULTIPLE ZONES ON THE SAME PLATEN IN CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：在化学机械抛光中在同一板上具有多个区域的多个基板的端点控制
公开(公告)号：US20110282477A1
公开(公告)日：2011-11-17
申请号：US12781654
申请日：2010-05-17
申请人： Harry Q. Lee , Jimin Zhang , Jeffrey Drue David , Boguslaw A. Swedek
发明人： Harry Q. Lee , Jimin Zhang , Jeffrey Drue David , Boguslaw A. Swedek
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B37/042
摘要： A plurality of substrates are polished simultaneously on the same polishing pad. A sequence of spectra is measured from each zone of each substrate, and for each measured spectrum in the sequence of spectra for each zone of each substrate, a best matching reference spectrum is determined from a library of reference spectra. For each zone of each substrate, a linear function is fit to a sequence of index values associated with the best matching reference spectra. For at least one zone, a projected time at which the zone will reach a target index value is determined based on the linear function, and the polishing parameter for at least one zone on at least one substrate is adjusted such that the at least one zone of the at least one substrate has closer to the target index at the projected time than without such adjustment.
摘要翻译：多个基板在同一抛光垫上同时被抛光。从每个底物的每个区域测量光谱序列，并且对于每个底物的每个区域的光谱序列中的每个测量的光谱，从参考光谱库确定最佳匹配的参考光谱。对于每个衬底的每个区域，线性函数适合于与最佳匹配参考光谱相关联的索引值序列。对于至少一个区域，基于线性函数确定区域将达到目标指标值的预计时间，并且调整至少一个基底上的至少一个区域的抛光参数，使得至少一个区域的至少一个基板在投影时间比没有这种调整更接近于目标指标。

12. 发明申请

US20120034845A1 TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开
标题翻译：将测量光谱匹配到用于现场光学监测的参考光谱的技术
公开(公告)号：US20120034845A1
公开(公告)日：2012-02-09
申请号：US13198635
申请日：2011-08-04
申请人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
发明人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/042 , B24B37/107 , B24B37/205 , B24B49/045 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
摘要翻译：控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考光谱。

13. 发明申请

US20120034844A1 SPECTROGRAPHIC MONITORING USING INDEX TRACKING AFTER DETECTION OF LAYER CLEARING 审中-公开
标题翻译：检测层清除后使用索引跟踪进行光谱监测
公开(公告)号：US20120034844A1
公开(公告)日：2012-02-09
申请号：US12851467
申请日：2010-08-05
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： B24B49/12
CPC分类号： B24B37/042 , B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, polishing a substrate having a second layer overlying a first layer, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, detecting exposure of the first layer, fitting a function to a portion of the sequence of index values corresponding to spectra measured after detection of exposure of the first layer, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译：控制抛光的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关索引值，抛光具有覆盖第一层的第二层的衬底，测量第对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考序列确定每个最佳匹配光谱的相关索引值光谱以产生索引值序列，检测第一层的曝光，将功能拟合到对应于在检测到第一层的曝光之后测量的光谱的索引值序列的一部分，以及确定抛光终点中的至少一个或基于该功能的抛光速率的调整。

14. 发明授权

US07768659B2 Determining copper concentration in spectra 有权
标题翻译：测定光谱中的铜浓度
公开(公告)号：US07768659B2
公开(公告)日：2010-08-03
申请号：US11868911
申请日：2007-10-08
申请人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek , Jimin Zhang , Harry Q. Lee
发明人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek , Jimin Zhang , Harry Q. Lee
IPC分类号： G01B9/08 , G01B11/28
CPC分类号： G01B11/0683 , G01N21/55
摘要： Methods of subtracting the copper contribution to spectra obtained from a substrate during chemical mechanical polishing are described.
摘要翻译：描述了在化学机械抛光期间减去从基板获得的光谱对铜的贡献的方法。

15. 发明申请

US20080130000A1 DETERMINING COPPER CONCENTRATION IN SPECTRA 有权
标题翻译：确定光谱中的铜浓度
公开(公告)号：US20080130000A1
公开(公告)日：2008-06-05
申请号：US11868911
申请日：2007-10-08
申请人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek , Jimin Zhang , Harry Q. Lee
发明人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek , Jimin Zhang , Harry Q. Lee
IPC分类号： G01J3/46 , G06F19/00
CPC分类号： G01B11/0683 , G01N21/55
摘要： Methods of subtracting the copper contribution to spectra obtained from a substrate during chemical mechanical polishing are described.
摘要翻译：描述了在化学机械抛光期间减去从基板获得的光谱对铜的贡献的方法。

16. 发明授权

US08860932B2 Detection of layer clearing using spectral monitoring 有权
标题翻译：使用光谱监测检测层清除
公开(公告)号：US08860932B2
公开(公告)日：2014-10-14
申请号：US13189277
申请日：2011-07-22
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： G01N21/00 , G01J3/00 , B24B37/04 , H01L21/66 , B24B37/013 , G01B11/06 , H01L21/321
CPC分类号： B24B37/013 , B24B37/042 , G01B11/0633 , G01B11/0683 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A method of polishing includes polishing a substrate having a second layer overlying a first layer, measuring a sequence of groups of spectra of light from the substrate while the substrate is being polished, each group of the groups of spectra including spectra from different locations on the substrate, for each group, calculating a value for a dispersion parameter of the spectra in the group to generate a sequence of dispersion values, and detecting exposure of the first layer based on the sequence of dispersion values.
摘要翻译：抛光方法包括抛光具有覆盖在第一层上的第二层的衬底，在衬底被抛光时测量来自衬底的光的光谱组序列，每组光谱组包括来自不同位置的光谱基板，对于每个组，计算组中的光谱的色散参数的值以产生色散值序列，并且基于色散值序列来检测第一层的曝光。

17. 发明申请

US20140024291A1 Endpoint Detection During Polishing Using Integrated Differential Intensity 有权
标题翻译：使用积分微分强度进行抛光时的端点检测
公开(公告)号：US20140024291A1
公开(公告)日：2014-01-23
申请号：US13552317
申请日：2012-07-18
申请人： Jimin Zhang , Harry Q. Lee , Zhihong Wang , Wen-Chiang Tu
发明人： Jimin Zhang , Harry Q. Lee , Zhihong Wang , Wen-Chiang Tu
IPC分类号： B24B49/12 , B24B7/00
CPC分类号： B24B37/013 , B24B37/042 , B24B37/105 , B24B49/12 , H01L22/12 , H01L22/26
摘要： A method of controlling a polishing operation includes polishing a substrate, during polishing obtaining a sequence over time of measured spectra from the substrate with an in-situ optical monitoring system, for each measured spectrum from the sequence of measured spectra determining a difference between the measured spectrum and an immediate previous spectrum from the sequence, accumulating the difference for each measured spectrum to generate a total difference, comparing the total difference to a threshold, and detecting a polishing endpoint based on the comparison of the total difference to the threshold.
摘要翻译：一种控制抛光操作的方法包括：在抛光过程中，利用原位光学监测系统从基板测量的光谱中获得随时间变化的序列，从测量光谱序列测得的每个测量光谱，从而确定基板的测量值频谱和来自序列的立即上一个频谱，累积每个测量频谱的差以产生总差，将总差与阈值进行比较，以及基于总差与阈值的比较来检测抛光端点。

18. 发明申请

US20120026492A1 DETECTION OF LAYER CLEARING USING SPECTRAL MONITORING 有权
标题翻译：使用光谱监测检测层清除
公开(公告)号：US20120026492A1
公开(公告)日：2012-02-02
申请号：US13189277
申请日：2011-07-22
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： G01J3/00
CPC分类号： B24B37/013 , B24B37/042 , G01B11/0633 , G01B11/0683 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A method of polishing includes polishing a substrate having a second layer overlying a first layer, measuring a sequence of groups of spectra of light from the substrate while the substrate is being polished, each group of the groups of spectra including spectra from different locations on the substrate, for each group, calculating a value for a dispersion parameter of the spectra in the group to generate a sequence of dispersion values, and detecting exposure of the first layer based on the sequence of dispersion values.
摘要翻译：抛光方法包括抛光具有覆盖在第一层上的第二层的衬底，在衬底被抛光时测量来自衬底的光的光谱组序列，每组光谱组包括来自不同位置的光谱基板，对于每个组，计算组中的光谱的色散参数的值以产生色散值序列，并且基于色散值序列来检测第一层的曝光。

19. 发明授权

US09005999B2 Temperature control of chemical mechanical polishing 有权
标题翻译：化学机械抛光温度控制
公开(公告)号：US09005999B2
公开(公告)日：2015-04-14
申请号：US13539344
申请日：2012-06-30
申请人： Kun Xu , Jimin Zhang , David H. Mai , Stephen Jew , Shih-Haur Walters Shen , Zhihong Wang , Thomas H. Osterheld , Wen-Chiang Tu , Gary Ka Ho Lam , Tomohiko Kitajima
发明人： Kun Xu , Jimin Zhang , David H. Mai , Stephen Jew , Shih-Haur Walters Shen , Zhihong Wang , Thomas H. Osterheld , Wen-Chiang Tu , Gary Ka Ho Lam , Tomohiko Kitajima
IPC分类号： H01L21/00 , H01L21/302 , H01L21/304
CPC分类号： H01L21/302 , B24B37/015 , H01L21/304
摘要： Methods for chemical mechanical polishing (CMP) of semiconductor substrates, and more particularly to temperature control during such chemical mechanical polishing are provided. In one aspect, the method comprises polishing the substrate with a polishing surface during a polishing process to remove a portion of the conductive material, repeatedly monitoring a temperature of the polishing surface during the polishing process, and exposing the polishing surface to a rate quench process in response to the monitored temperature so as to achieve a target value for the monitored temperature during the polishing process.
摘要翻译：提供半导体衬底的化学机械抛光（CMP）的方法，更具体地说，涉及这种化学机械抛光时的温度控制。一方面，该方法包括在抛光过程中用抛光表面抛光衬底以去除导电材料的一部分，在抛光过程中反复监测抛光表面的温度，并将抛光表面暴露于速率骤冷过程响应于所监测的温度，以便在抛光过程中达到监测温度的目标值。

20. 发明申请

US20100081360A1 USE OF PAD CONDITIONING IN TEMPERATURE CONTROLLED CMP 有权
标题翻译：在温度控制CMP中使用焊盘调节
公开(公告)号：US20100081360A1
公开(公告)日：2010-04-01
申请号：US12240615
申请日：2008-09-29
申请人： Kun Xu , Thomas H. Osterheld , Jimin Zhang , Stephen Jew
发明人： Kun Xu , Thomas H. Osterheld , Jimin Zhang , Stephen Jew
IPC分类号： B24B49/14 , B24B1/00 , B24B49/16
CPC分类号： B24B37/042 , B24B37/015 , B24B49/16
摘要： A method and apparatus for temperature control for a chemical mechanical polishing process is provided. In one embodiment, the method comprises polishing the substrate with a surface of a polishing pad assembly, measuring a real-time temperature of the surface of the polishing pad assembly, determining whether the real-time temperature of the surface of the polishing pad assembly is within a predetermined processing temperature range, and contacting the surface of the polishing pad assembly with a pad conditioner to adjust the temperature of the surface of the polishing pad assembly to fall within the predetermined temperature range.
摘要翻译：提供了一种用于化学机械抛光工艺的温度控制方法和装置。在一个实施例中，该方法包括用抛光垫组件的表面抛光衬底，测量抛光垫组件的表面的实时温度，确定抛光垫组件的表面的实时温度是否为在预定的处理温度范围内，并且将抛光垫组件的表面与衬垫调节器接触，以调节抛光垫组件的表面的温度落在预定温度范围内。

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