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    • 12. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US08022464B2
    • 2011-09-20
    • US12506566
    • 2009-07-21
    • Atsuhiro SatoFumitaka Arai
    • Atsuhiro SatoFumitaka Arai
    • H01L29/788
    • H01L29/7881H01L21/28273H01L21/764H01L27/11521H01L29/42336H01L29/66825
    • This semiconductor memory device comprises a semiconductor substrate, a plurality of tunnel insulator films formed on the semiconductor substrate along a first direction and a second direction orthogonal to the first direction with certain spaces in each directions, a plurality of charge accumulation layers formed on the plurality of tunnel insulator films, respectively, a plurality of element isolation regions formed on the semiconductor substrate, the plurality of element isolation regions including a plurality of trenches formed along the first direction between the plurality of tunnel insulator films, a plurality of element isolation films filled in the plurality of trenches, a plurality of inter poly insulator films formed over the plurality of element isolation regions and on the upper surface and side surfaces of the plurality of charge accumulation layer along the second direction in a stripe shape, a plurality of air gaps formed between the plurality of element isolation films filled in the plurality of trenches and the plurality of inter poly insulator films and a plurality of control gate electrodes formed on the plurality of inter poly insulator films.
    • 该半导体存储器件包括半导体衬底,沿着第一方向形成在半导体衬底上的多个隧道绝缘膜,和在每个方向上具有一定间隔的与第一方向正交的第二方向,多个电荷累积层形成在多个 分别形成在所述半导体衬底上的多个元件隔离区域,所述多个元件隔离区域包括在所述多个隧道绝缘膜之间沿着所述第一方向形成的多个沟槽,多个元件隔离膜填充 在所述多个沟槽中,形成在所述多个元件隔离区域上并且沿着所述第二方向的所述多个电荷蓄积层的上表面和侧表面处于条形状的多个多晶硅绝缘膜,多个气隙 形成在多个元件隔离膜之间 填充在所述多个沟槽和所述多个多晶硅绝缘膜中,以及形成在所述多个多晶硅绝缘膜上的多个控制栅电极。
    • 13. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US07982244B2
    • 2011-07-19
    • US12553496
    • 2009-09-03
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • H01L29/68H01L29/417H01L27/105
    • H01L27/11524H01L21/76816H01L27/11521
    • A semiconductor memory device includes a first block having first memory cells and first select transistors, a second block having second memory cells and second select transistors, and arranged adjacent to the first block in a first direction, the second select transistor being arranged to face the first select transistor and commonly having a diffusion region with the first select transistor, a first interconnection layer provided on the diffusion region between the first and second blocks and extending in a second direction, and a second interconnection layer having a first portion provided in contact with an upper portion of the first interconnection layer and extending to a portion outside the first interconnection layer, and a second portion extending in the second direction and connected to the first portion in a portion outside a portion on the first interconnection layer.
    • 半导体存储器件包括具有第一存储器单元和第一选择晶体管的第一块,具有第二存储单元和第二选择晶体管的第二块,并且沿第一方向布置成与第一块相邻,第二选择晶体管被布置为面对 第一选择晶体管,并且通常具有与第一选择晶体管的扩散区,第一互连层,设置在第一和第二块之间的扩散区上并沿第二方向延伸;第二互连层,具有设置成与第一选择晶体管接触的第一部分 第一互连层的上部并且延伸到第一互连层外部的部分,以及第二部分,其在第二方向上延伸并且在第一互连层上的部分外部的部分连接到第一部分。
    • 14. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR
    • 半导体存储器件及其制造方法
    • US20100176435A1
    • 2010-07-15
    • US12565181
    • 2009-09-23
    • Atsuhiro SatoFumitaka Arai
    • Atsuhiro SatoFumitaka Arai
    • H01L27/115H01L21/8247
    • H01L27/11519H01L27/11521H01L27/11529
    • First gate electrodes of memory cell transistors are formed in series with each other on a semiconductor substrate. A second gate electrode of a first selection transistor is formed adjacent to one end of the first electrodes. A third gate electrode of a second selection transistor is formed adjacent to the second electrode. A fourth gate electrode of a peripheral transistor is formed on the substrate. First, second, and third sidewall films are formed on side surfaces of the second, third, and fourth gate electrodes, respectively. A film thickness of the third sidewall film is larger than that of the first and second sidewall films. A space between the first electrode and the second electrode is larger than a space between the first electrodes, and a space between the second electrode and the third electrode is larger than a space between the first electrode and the second electrode.
    • 存储单元晶体管的第一栅电极在半导体衬底上彼此串联形成。 第一选择晶体管的第二栅电极与第一电极的一端相邻地形成。 第二选择晶体管的第三栅电极与第二电极相邻地形成。 在基板上形成周边晶体管的第四栅电极。 第一,第二和第三侧壁膜分别形成在第二,第三和第四栅电极的侧表面上。 第三侧壁膜的膜厚大于第一和第二侧壁膜的膜厚。 第一电极和第二电极之间的空间大于第一电极之间的空间,并且第二电极和第三电极之间的间隔大于第一电极和第二电极之间的间隔。
    • 18. 发明授权
    • Nonvolatile semiconductor memory and a fabrication method for the same
    • 非易失性半导体存储器及其制造方法
    • US07335938B2
    • 2008-02-26
    • US10971161
    • 2004-10-25
    • Makoto SakumaAtsuhiro Sato
    • Makoto SakumaAtsuhiro Sato
    • H01L29/72
    • H01L27/11524H01L27/115H01L27/11521H01L29/66825
    • A nonvolatile semiconductor memory includes a plurality of memory cell transistors configured with a first floating gate, a first control gate, and a first inter-gate insulating film each arranged between the first floating gate and the first control gate, respectively, and which are aligned along a bit line direction; device isolating regions disposed at a constant pitch along a word line direction making a striped pattern along the bit line direction; and select gate transistors disposed at each end of the alignment of the memory cell transistors, each configured with a second floating gate, a second control gate, a second inter-gate insulator film disposed between the second floating gate and the second control gate, and a sidewall gate electrically connected to the second floating gate and the second control gate.
    • 非易失性半导体存储器包括:多个存储单元晶体管,其配置有分别布置在第一浮置栅极和第一控制栅极之间的第一浮动栅极,第一控制栅极和第一栅极间绝缘膜,并且它们对准 沿着位线方向; 器件隔离区沿着字线方向以恒定的间距设置,沿着位线方向形成条纹图案; 并且选择栅极晶体管,其设置在存储单元晶体管的对准的每一端,每个配置有第二浮置栅极,第二控制栅极,设置在第二浮置栅极和第二控制栅极之间的第二栅极间绝缘膜,以及 电连接到第二浮动栅极和第二控制栅极的侧壁栅极。