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11. 发明授权

US07449903B2 Method and system for the optical inspection of contact faces at semiconductor devices with different appearances 有权
标题翻译：用于不同外观的半导体器件的接触面的光学检查方法和系统
公开(公告)号：US07449903B2
公开(公告)日：2008-11-11
申请号：US11399228
申请日：2006-04-06
申请人： Michael Huebner
发明人： Michael Huebner
IPC分类号： G01R31/02
CPC分类号： G01R31/311 , G06T7/001 , G06T2207/30148 , G06T2207/30152 , H01L2224/16
摘要： A system and method is provided that reliably determines the position of contact needle tips on a contact pad irrespective of the contact pad geometry and the character of the contact pad surface. For example, optical recognition of the surface of the contact pad is completed prior to contacting the contact pad by the contact element and generating a reference image. Optical recognition of the surface of the contact pad is completed after contacting of the contact pad by the contact element when generating the image to be analyzed. A difference between the reference image and the image to be analyzed is taken, and the resulting image is analyzed for recognized contrasts or impressions left by the contact element on the contact pad.
摘要翻译：提供了一种系统和方法，其可靠地确定接触针尖在接触垫上的位置，而与接触垫几何形状和接触垫表面的特性无关。例如，接触焊盘的表面的光学识别在接触触点接触元件之前完成，并产生参考图像。接触垫表面的光学识别在产生待分析图像时通过接触元件接触接触垫后完成。拍摄参考图像和要分析的图像之间的差异，并且分析所得到的图像以识别由接触元件在接触垫上留下的对比度或印象。

12. 发明申请

US20070236234A1 Method and system for the optical inspection of contact faces at semiconductor devices with different appearances 有权
标题翻译：用于不同外观的半导体器件的接触面的光学检查方法和系统
公开(公告)号：US20070236234A1
公开(公告)日：2007-10-11
申请号：US11399228
申请日：2006-04-06
申请人： Michael Huebner
发明人： Michael Huebner
IPC分类号： G01R31/02
CPC分类号： G01R31/311 , G06T7/001 , G06T2207/30148 , G06T2207/30152 , H01L2224/16
摘要： A system and method that reliably determines the position of contact needle tips on the contact pad irrespective of the contact pad geometry and the character of the contact pad surface is disclosed. A first image is taken of the surface of the contact pad prior to the contacting of the contact pad, a second image is taken after the contacting of the contact pad by a contact element, a third image is generated from the taking of a difference between the first and the second images, the third image being analyzed to determine at which position the contact needle has left an impression on the contact pad, i.e., at which position the contact needle has contacted the contact pad. Different contact pad geometries and shadings on the contact pad surface are compensated by means of the taking of a difference between the reference image and the image to be analyzed, and that the image information required for determining the position of the contact needle on the contact pad is extracted by the comparison of the second image with the first image. The third image resulting from the taking of a difference is thus absent of optical irritations that might impair the analysis.
摘要翻译：公开了一种系统和方法，其可靠地确定接触针头上的接触针尖的位置，而不管接触垫几何形状和接触垫表面的特性如何。在接触垫接触之前拍摄接触焊盘的表面的第一图像，在接触焊盘接触接触元件之后拍摄第二图像，从获取第二图像之间的差异产生第三图像第一图像和第二图像，第三图像被分析以确定接触针在接触垫处留下印象的位置，即接触针已经接触接触垫的位置。接触垫表面上的不同的接触垫几何形状和阴影通过获取参考图像和待分析图像之间的差异来补偿，并且确定接触针在接触垫上的位置所需的图像信息通过第二图像与第一图像的比较来提取。因此，由于获得差异而产生的第三图像不存在可能损害分析的光学刺激。

13. 发明授权

US07074072B2 Method of making contact with circuit units to be tested in a tester and contact-making apparatus for implementing the method 失效
标题翻译：在用于实施该方法的测试器和接触制造装置中与要测试的电路单元接触的方法
公开(公告)号：US07074072B2
公开(公告)日：2006-07-11
申请号：US10900664
申请日：2004-07-28
申请人： Michael Huebner
发明人： Michael Huebner
IPC分类号： H01R11/18
CPC分类号： G01R31/2889 , G01R1/0735
摘要： A contact-making apparatus for making contact with circuit units to be tested in a tester contains a printed circuit board device that has electrical connections to the tester, and a test module device. The test module device has first contact-making elements for making electrical contact between the test module device and the printed circuit board device, and second contact-making elements for making electrical contact between the test module device and the circuit unit to be tested. When the printed circuit board device and the circuit unit to be tested are pressed onto each other, a spring force of the first contact-making elements is lower than the spring force of the second contact-making elements under a low initial compression, and a spring force of the first contact-making elements are higher than the spring force of the second contact-making elements under a high final compression.
摘要翻译：用于在测试器中与要测试的电路单元接触的接触制造装置包含与测试器电连接的印刷电路板装置和测试模块装置。测试模块设备具有用于在测试模块设备和印刷电路板设备之间进行电接触的第一接触元件，以及用于在测试模块设备和要测试的电路单元之间进行电接触的第二接触元件。当印刷电路板装置和待测试的电路单元彼此压紧时，第一接触元件的弹簧力低于初始压缩低的第二接触元件的弹簧力，并且第一接触元件的弹簧力高于第二接触元件在高最终压缩下的弹簧力。

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