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    • 12. 发明申请
    • CONTACT HEATING ARRANGEMENT
    • 联系加热装置
    • US20090050620A1
    • 2009-02-26
    • US10585442
    • 2005-01-05
    • Per AnderssonGunnar Kylberg
    • Per AnderssonGunnar Kylberg
    • B01L7/00B04B15/02
    • B01L7/52B01L3/5085B01L9/527B01L2300/0803B01L2300/0819B01L2300/1827B01L2300/1844H05B3/26H05B2203/013H05B2203/014H05B2203/021H05B2203/032
    • A heating arrangement for heating one or more liquid-containing microcavities (102) that are present on a microdevice (101) in which there is a contact surface (Sdev) (108). The arrangement comprises a heating support (104,204) that has: a) a support contact surface (Ssup) (110) which is apposed to Sdev (108), when the microdevice (101) is placed on the heating support (104,204), and b) one or more heating elements (120,220) each of which are in thermal contact with Ssup (110), and also with at least one of said microcavities (102), when the microdevice (101) is placed according to (a) with said microcavities (102) matched to said heating elements (120,220), The characteristic feature of the arrangement is that it comprises a sub pressure system (113-119) that is capable of creating sub pressure between said support (104,204) and said microdevice (101) via the support when the microdevice (101) is placed on the support (104,204).
    • 一种用于加热存在于其中存在接触表面(Sdev)(108)的微器件(101)上的一个或多个含液体微腔(102)的加热装置。 该装置包括加热支撑件(104,204),其具有:a)当微型装置(101)放置在加热支架(104,204)上时,该支撑接触表面(Ssup)(110)安装在Sdev(108)上,以及 b)一个或多个加热元件(120,220),每个加热元件(120,220)与Ssup(110)热接触,并且还与至少一个所述微腔(102),当微型设备(101)根据(a)与 所述微腔(102)与所述加热元件(120,220)匹配。该装置的特征在于其包括能够在所述支撑件(104,204)和所述微型装置(104,204)之间产生副压力的副压力系统(113-119) 当微型装置(101)被放置在支撑件(104,204)上时通过支撑件。