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    • 12. 发明申请
    • Low frequency ball grid array resonator
    • 低频球栅阵列谐振器
    • US20090236134A1
    • 2009-09-24
    • US12381692
    • 2009-03-16
    • Thomas A. KnechtGlen Reeser
    • Thomas A. KnechtGlen Reeser
    • H05K1/16
    • H05K1/0243H01P7/082H01P7/084H05K3/3436H05K2201/10068
    • A ball grid array resonator for use as, for example, a high “Q” inductive element in the tank circuit of a voltage controlled oscillator. The resonator comprises a ceramic substrate including opposed top and bottom surfaces, each having a continuous strip of conductive material formed thereon and, in one embodiment, at least two conductive vias which extend through the substrate and electrically interconnect the respective strips of conductive material to define a continuous and elongate path or transmission line for an RF signal. The respective strips of conductive material may be spiral-shaped, hook-shaped, serpentine-shaped, or otherwise suitably shaped depending upon the desired application. Conductive balls/spheres on the bottom surface define RF signal input/output pads and ground pads adapted for electrical connection to the printed circuit board or substrate of, for example, a voltage controlled oscillator.
    • 一种球栅阵列谐振器,用作例如压控振荡器的电路中的高“Q”电感元件。 谐振器包括陶瓷衬底,其包括相对的顶表面和底表面,每个陶瓷衬底具有在其上形成的导电材料的连续条带,并且在一个实施例中,至少两个导电通孔延伸穿过衬底并电连接导电材料的各条带以限定 用于RF信号的连续且细长的路径或传输线。 相应的导电材料条可以是螺旋形的,钩形的,蛇形的,或者根据所需的应用适当地成形。 底表面上的导电球/球体限定RF信号输入/输出焊盘和适于与例如压控振荡器的印刷电路板或基板电连接的接地焊盘。
    • 13. 发明授权
    • Time division duplex front end module
    • 时分复用前端模块
    • US07855983B2
    • 2010-12-21
    • US12214129
    • 2008-06-17
    • Thomas A. KnechtGlen Reeser
    • Thomas A. KnechtGlen Reeser
    • H04L5/14H04B1/38
    • H04B1/18H04B1/48H05K1/0243H05K1/141H05K3/3442H05K2201/09181H05K2201/1006
    • An RF module adapted for direct surface mounting to the top surface of the front end of the motherboard of a wireless base station such as, for example, a femtocell. The module comprises a printed circuit board having a plurality of direct surface mounted electrical components defining respective signal transmit and receive sections for RF signals. The signal transmit section is defined by at least a power amplifier, a coupler, and a lowpass filter. The signal receive section is defined by at least a receive bandpass filter and a low-noise amplifier. A lid covers selected ones of the electrical components except for at least the power amplifier. An RF switch is located between and interconnects the respective transmit and receive sections to an antenna pin.
    • 适用于直接表面安装到无线基站(例如,毫微微小区)的母板的前端的顶表面的RF模块。 该模块包括印刷电路板,该印刷电路板具有多个直接表面安装的电气部件,其定义用于RF信号的各个信号发射和接收部分。 信号发射部分至少由功率放大器,耦合器和低通滤波器限定。 信号接收部分由至少接收带通滤波器和低噪声放大器限定。 盖子覆盖除了至少功率放大器之外的所选择的电气部件。 RF开关位于天线引脚之间并将相应的发射和接收部分互连到天线引脚。
    • 14. 发明申请
    • Time division duplex front end module
    • 时分复用前端模块
    • US20080316948A1
    • 2008-12-25
    • US12214129
    • 2008-06-17
    • Thomas A. KnechtGlen Reeser
    • Thomas A. KnechtGlen Reeser
    • H04L5/14
    • H04B1/18H04B1/48H05K1/0243H05K1/141H05K3/3442H05K2201/09181H05K2201/1006
    • An RF module adapted for direct surface mounting to the top surface of the front end of the motherboard of a wireless base station such as, for example, a femtocell. The module comprises a printed circuit board having a plurality of direct surface mounted electrical components defining respective signal transmit and receive sections for RF signals. The signal transmit section is defined by at least a power amplifier, a coupler, and a lowpass filter. The signal receive section is defined by at least a receive bandpass filter and a low-noise amplifier. A lid covers selected ones of the electrical components except for at least the power amplifier. An RF switch is located between and interconnects the respective transmit and receive sections to an antenna pin.
    • 适用于直接表面安装到无线基站(例如,毫微微小区)的母板的前端的顶表面的RF模块。 该模块包括印刷电路板,该印刷电路板具有多个直接表面安装的电气部件,其定义用于RF信号的各个信号发射和接收部分。 信号发射部分至少由功率放大器,耦合器和低通滤波器限定。 信号接收部分由至少接收带通滤波器和低噪声放大器限定。 盖子覆盖除了至少功率放大器之外的所选择的电气部件。 RF开关位于天线引脚之间并将相应的发射和接收部分互连到天线引脚。