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    • 12. 发明申请
    • COMBUSTION PRESSURE DATA COLLECTION SYSTEM FOR MULTI-CYLINDER ENGINE
    • 多缸发动机燃烧压力数据采集系统
    • US20050061296A1
    • 2005-03-24
    • US10943570
    • 2004-09-17
    • Hajime KashiwaseHiromichi WatanabeHiroshi Yokoyama
    • Hajime KashiwaseHiromichi WatanabeHiroshi Yokoyama
    • G01L19/04F02D35/02F02D45/00G01L23/10G01M15/08F02P5/00F02M7/00
    • G01L23/10F02D35/023F02D41/28F02D2041/281G01M15/08
    • A combustion pressure data collection system for a multi-cylinder engine includes a cylinder pressure sensor, an amplifier unit, and a channel switching unit. The cylinder pressure sensor directly detect a combustion pressure of respective cylinders, the amplifier unit converts a charge signal from the cylinder pressure sensor into voltage signal and have an automatic correction function for automatically correcting a voltage output level so that the level is setted to the same level before and after the cylinder pressure sensor generate a charge, and the amplifier unit of the respective cylinders is connected to the channel switching unit. A channel for actuating to be measured is selected from signals of a plurality of channels supplied from the amplifier units in response to a channel selection signal output from an electronic engine control unit, and combustion pressure data are outputted to the electronic engine control unit from the cylinder of the channel, thereby combustion pressure data can be effectively collected by a simple arrangement without complex processing.
    • 用于多缸发动机的燃烧压力数据收集系统包括气缸压力传感器,放大器单元和通道切换单元。 气缸压力传感器直接检测各个气缸的燃烧压力,放大器单元将来自气缸压力传感器的充电信号转换为电压信号,并具有自动校正功能,用于自动校正电压输出电平,使电平设置为相同 气缸压力传感器之前和之后的电平产生电荷,并且各个气缸的放大器单元连接到通道切换单元。 响应于从电子发动机控制单元输出的通道选择信号,从放大器单元提供的多个通道的信号中选择待测量的通道,并且燃烧压力数据从电子发动机控制单元从 通道的气缸,由此燃烧压力数据可以通过简单的布置有效地收集而不需要复杂的处理。
    • 16. 发明授权
    • Substrate for circuit wiring
    • 电路布线基板
    • US07078628B2
    • 2006-07-18
    • US10723349
    • 2003-11-25
    • Hiromichi WatanabeYoshifumi FukatsuHideaki Kaino
    • Hiromichi WatanabeYoshifumi FukatsuHideaki Kaino
    • H05K1/03
    • H05K3/284H01L23/49894H01L2924/0002H05K1/056H05K2201/0209H05K2201/0212H01L2924/00
    • The present invention concerns a substrate for circuit wiring in which an electronic component is mounted, by soldering, to a wiring pattern formed on an insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-based filler are added in the insulated layer to reduce the linear thermal expansion of the layer and increase its elastic modulus. The mounting portion of an electronic component is molded with a resin material to which a silica-based filler has been added, and which thus has a coefficient of linear thermal expansion smaller than the coefficient of linear thermal expansion of the insulated layer. This serves to alleviate the stress caused by the linear thermal expansion of the metallic substrate, and thereby to prevent separation from occurring between the insulated layer and the metallic substrate, as well as between the insulated layer and the wiring pattern, when subjected to a high-temperature environment.
    • 本发明涉及一种用于电路布线的基板,其中通过焊接将电子部件安装到沉积在金属基板上的绝缘层上形成的布线图案。 在绝缘层中添加二氧化硅系填料和橡胶类填料,以减少层的线性热膨胀并提高其弹性模量。 电子部件的安装部分用添加有二氧化硅基填料的树脂材料模制,因此具有比绝热层的线性热膨胀系数小的线性热膨胀系数。 这用于减轻金属基板的线性热膨胀引起的应力,从而防止在绝缘层和金属基板之间以及绝缘层和布线图案之间发生分离时,当受到高 温度环境。