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11. 发明申请

US20130003283A1 DISPLAY DEVICE 有权
标题翻译：显示设备
公开(公告)号：US20130003283A1
公开(公告)日：2013-01-03
申请号：US13525669
申请日：2012-06-18
申请人： Takeshi Sakamoto
发明人： Takeshi Sakamoto
IPC分类号： G06F1/16
CPC分类号： G02F1/133308 , G02F2001/133314 , G02F2201/46
摘要： A display device includes: a display panel; a rear housing covering a back face of the display panel, and including a plurality of first screw holes at a peripheral portion thereof; a frame including a front portion, a side portion, a rear portion, and a plurality of second screw holes provided in the rear portion, the front portion covering a peripheral portion of a front face of the display panel, the side portion covering a side face of the display panel, the rear portion covering the peripheral portion of the rear housing, and the second screw holes being arranged alternately with the first screw holes; and a back face plate covering the rear portion of the frame and the rear housing, and including third screw holes corresponding to the first screw holes and the second screw holes.
摘要翻译：显示装置包括：显示面板; 后壳体，其覆盖所述显示面板的背面，并且在其周边部分包括多个第一螺钉孔; 包括前部，侧部，后部和设置在后部的多个第二螺钉孔的框架，所述前部覆盖所述显示面板的正面的周边部分，所述侧部覆盖所述侧部所述后部覆盖所述后壳体的周边部分，并且所述第二螺钉孔与所述第一螺钉孔交替布置; 以及覆盖框架的后部和后壳体的背面板，并且包括对应于第一螺钉孔和第二螺钉孔的第三螺钉孔。

12. 发明申请

US20120327501A1 LASER PROCESSING SYSTEM 有权
标题翻译：激光加工系统
公开(公告)号：US20120327501A1
公开(公告)日：2012-12-27
申请号：US13575376
申请日：2011-01-05
申请人： Takeshi Sakamoto , Takafumi Ogiwara
发明人： Takeshi Sakamoto , Takafumi Ogiwara
IPC分类号： G02B26/00
CPC分类号： B23K26/40 , B23K26/53 , B23K2103/50
摘要： In a laser processing system 400, a plurality of element patterns for creating a modulation pattern are prepared, and the modulation pattern is created from the element patterns according to a condition for forming the modified region for an object to be processed in order to form the modified region corresponding thereto. Laser light is modulated according to thus created modulation pattern, and the modified region is formed in the object by irradiation with the modulated laser light. Thus, according to the condition for forming the modified region corresponding to the object, the modulation pattern is created from the element patterns prepared beforehand.
摘要翻译：在激光处理系统400中，准备用于产生调制图案的多个元件图案，并且根据用于形成待处理对象的修改区域的条件从元件图案创建调制图案，以便形成对应的修改区域。根据这样产生的调制图案对激光进行调制，通过照射调制后的激光将被修饰区域形成在物体内。因此，根据用于形成对象的修改区域的条件，根据预先准备的元素图案产生调制图案。

13. 发明授权

US08138450B2 Method for cutting workpiece 有权
标题翻译：切割工件的方法
公开(公告)号：US08138450B2
公开(公告)日：2012-03-20
申请号：US11994581
申请日：2006-07-03
申请人： Takeshi Sakamoto , Kenichi Muramatsu
发明人： Takeshi Sakamoto , Kenichi Muramatsu
IPC分类号： H01L21/78
CPC分类号： B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： A method of cutting an object to be processed is provided, which can accurately cut an object to be processed comprising a substrate and a multilayer part provided on the front face of the substrate while having a plurality of functional devices into the functional devices along a line to cut in a short time even when the substrate is thick. A substrate 4 is irradiated with laser light L from the multilayer part 16 side while locating a converging point P within the substrate 4, so as to form a first modified region 71 shifted from the center position CL in the thickness direction of the substrate 4 to the rear face 21 side of the substrate 4 and a second modified region 72 shifted from the center position CL in the thickness direction of the substrate 4 to the front face 3 side of the substrate 4 within the substrate 4 along a line to cut, and generate a fracture 24 from the second modified region 72 to the front face 3 of the substrate 4. Thereafter, while in a state where an expandable tape 23 attached to the rear face 21 of the substrate 4 is expanded, a stress is generated in an object to be processed 1 such as to open the fracture 24.
摘要翻译：提供了一种切割待处理物体的方法，其可以精确地切割被加工物，其包括基板和设置在基板的正面上的多层部件，同时沿着线路具有多个功能元件进入功能元件即使在基材较厚时也能在短时间内切割。基板4从多层部16侧照射激光L，同时将会聚点P定位在基板4内，以形成从基板4的厚度方向的中心位置CL移位的第一改质区域71到基板4的背面21侧和第二改质区域72沿着切断线在基板4的基板4的基板4的基板4的前面3侧沿基板4的厚度方向从中心位置CL移位，产生从第二改质区域72到基板4的正面3的断裂线24.此后，在将基板4的背面21上附着的可扩张带23膨胀的状态下，产生应力待处理物体1如打开骨折24。

14. 发明申请

US20120006799A1 LASER PROCESSING METHOD AND CHIP 有权
标题翻译：激光加工方法和芯片
公开(公告)号：US20120006799A1
公开(公告)日：2012-01-12
申请号：US13235936
申请日：2011-09-19
申请人： Ryuji SUGIURA , Takeshi Sakamoto
发明人： Ryuji SUGIURA , Takeshi Sakamoto
IPC分类号： B23K26/00
CPC分类号： H01L21/78 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , C03B33/0222
摘要： An object to be processed can be cut highly accurately along a line to cut.An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.
摘要翻译：可以沿着切割线高精度地切割待处理的物体。在将硅晶片11内的会聚点定位的同时用激光照射被处理体1，并且会聚点沿切割线5相对移动，以形成位于物体1内的改质区域M1，M2 沿着切割线5，然后是位于对象1内的修改区域M1，M2之间的修改区域M3。

15. 发明申请

US20110316200A1 METHOD OF CUTTING OBJECT TO BE PROCESSED, METHOD OF CUTTING STRENGTHENED GLASS SHEET AND METHOD OF MANUFACTURING STRENGTHENED GLASS MEMBER 有权
标题翻译：切割加工对象的方法，切割加强玻璃板的方法及制造加强玻璃构件的方法
公开(公告)号：US20110316200A1
公开(公告)日：2011-12-29
申请号：US13151877
申请日：2011-06-02
申请人： Hiroyuki IWAKI , Takafumi Ogiwara , Takeshi Sakamoto , Masaharu Hoshikawa , Kazuhiro Atsumi , Daisuke Kawaguchi , Takafumi Tsunematsu
发明人： Hiroyuki IWAKI , Takafumi Ogiwara , Takeshi Sakamoto , Masaharu Hoshikawa , Kazuhiro Atsumi , Daisuke Kawaguchi , Takafumi Tsunematsu
IPC分类号： B29C35/08
CPC分类号： B23K26/53 , B23K26/064 , B23K26/40 , B23K2103/50
摘要： A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line.
摘要翻译：切割待处理物体的方法包括以下步骤：用激光照射被处理物体，所述激光是椭圆偏振光以外的椭圆偏振光以外的激光，使得激光的偏振方向与切割物体和物体的厚度方向，同时将激光的会聚点定位在物体内，以沿着线形成在物体内的改质区域，并从该改质区域在厚度方向上产生断裂并且使裂缝到达物体的前后面以沿着该线切割物体。

16. 发明授权

US07970527B2 Engine start control apparatus and engine start control method 有权
标题翻译：发动机启动控制装置和发动机启动控制方法
公开(公告)号：US07970527B2
公开(公告)日：2011-06-28
申请号：US11260109
申请日：2005-10-28
申请人： Masahumi Nishi , Itsuki Hamaue , Yasuomi Kimura , Norio Tsuruta , Takeshi Sakamoto , Yasuo Ono
发明人： Masahumi Nishi , Itsuki Hamaue , Yasuomi Kimura , Norio Tsuruta , Takeshi Sakamoto , Yasuo Ono
IPC分类号： G06F19/00 , G06G7/70
CPC分类号： F02N11/10 , F02N11/0807
摘要： An engine start control apparatus enables a user to start an engine of a vehicle irrespective of a user's operation of ignition key. The engine start control apparatus includes a controller that performs engine start control and a storage unit. When the engine abnormally stops during a period in which the controller performs the engine start control, the storage unit stores at least one of a cause of the abnormal stop and a timing of the abnormal stop.
摘要翻译：发动机启动控制装置使得用户能够启动车辆的发动机，而与使用者的点火钥匙的操作无关。发动机起动控制装置包括执行发动机起动控制的控制器和存储单元。当发动机在控制器执行发动机起动控制的期间发动机异常停止时，存储单元存储异常停止的原因和异常停止的定时中的至少一个。

17. 发明授权

US07947574B2 Laser processing method and semiconductor chip 有权
标题翻译：激光加工方法和半导体芯片
公开(公告)号：US07947574B2
公开(公告)日：2011-05-24
申请号：US12748077
申请日：2010-03-26
申请人： Takeshi Sakamoto , Kenshi Fukumitsu
发明人： Takeshi Sakamoto , Kenshi Fukumitsu
IPC分类号： H01L21/00
CPC分类号： B28D5/0011 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50
摘要： A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision.This laser processing method irradiates a substrate 4 with laser light L while using a rear face 21 as a laser light entrance surface and locating a light-converging point P within the substrate 4, so as to form modified regions 71, 72, 73 within the substrate 4. Here, the quality modified region 71 is formed at a position where the distance between the front face 3 of the substrate 4 and the end part of the quality modified region 71 on the front face side is 5 μm to 15 μm. When the quality modified region 71 is formed at such a position, a laminate part 16 (constituted by interlayer insulating films 17a, 17b here) formed on the front face 3 of the substrate 4 is also cut along a line to cut with a high precision together with the substrate 4.
摘要翻译：提供了一种激光加工方法，即使当形成有包括多个功能元件的层叠部件的基板较厚时，也可以高精度地切割基板并层压部件。该激光加工方法使用背面21作为激光入射面，用激光L照射基板4，并且将聚光点P定位在基板4内，以在其内部形成改质区域71,72,73 这里，质量改质区域71形成在基板4的正面3与正面侧的质量改质区域71的端部之间的距离为5μm〜15μm的位置。当在这样的位置形成质量改良区域71时，也形成在基板4的正面3上形成的层叠体部16（由这里的层间绝缘膜17a，17b构成），沿着切割线切割高精度与基板4一起。

18. 发明申请

US20090212396A1 Laser Beam Machining Method And Semiconductor Chip 有权
标题翻译：激光束加工方法和半导体芯片
公开(公告)号：US20090212396A1
公开(公告)日：2009-08-27
申请号：US11667596
申请日：2005-11-10
申请人： Ryuji Sugiura , Takeshi Sakamoto
发明人： Ryuji Sugiura , Takeshi Sakamoto
IPC分类号： H01L29/00 , H01L21/301
CPC分类号： B28D5/0011 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： A laser processing method is provided, which, when cutting a substrate formed with a multilayer part including a plurality of functional devices, makes it possible to cut the multilayer part with a high precision in particular.In a state where a protective tape 22 is attached to the front face 16a of a multilayer part 16, a substrate 4 is irradiated with laser light L while using its rear face 4b as a laser light entrance surface, so as to form a modified region 7 within the substrate 4 along a line to cut, thereby generating a fracture 24 reaching the front face 4a of the substrate 4 from a front-side end part 7a of the modified region 7. Attaching an expandable tape to the rear face 4b of the substrate 4 and expanding it in the state where such a fracture 24 is generated can cut not only the substrate 4 but also the multilayer part 16 on the line to cut, i.e., interlayer insulating films 17a, 17b, with a favorable precision along the line to cut.
摘要翻译：提供一种激光加工方法，其中，当切割形成有包括多个功能元件的多层部件的基板时，可以特别高精度地切割多层部件。在保护带22附着到多层部16的前表面16a的状态下，用激光L照射基板4，同时使用其背面4b作为激光入射面，从而形成改质区域沿着切割线在衬底4内部，从而从修改区域7的前侧端部7a产生到达衬底4的前表面4a的断裂24.将可膨胀带附接到在产生这种断裂的状态下使基板4膨胀的状态不仅可以切割基板4而且还可以切割线路上的多层部16即线间绝缘膜17a，17b，切割。

19. 发明申请

US20090008373A1 Laser Processing Method 有权
标题翻译：激光加工方法
公开(公告)号：US20090008373A1
公开(公告)日：2009-01-08
申请号：US12094209
申请日：2006-11-16
申请人： Kenichi Muramatsu , Takeshi Sakamoto
发明人： Kenichi Muramatsu , Takeshi Sakamoto
IPC分类号： B23K26/02
CPC分类号： B23K26/53 , B23K26/40 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B28D5/0094 , H01L21/6838 , H01L21/78
摘要： A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum chuck with a porous sheet 53 interposed therebetween. Since the sheet 53 has a Young's modulus lower than that of the table 52, the tape 23 is restrained from biting into fine pores of the sheet 53. As a consequence, even when the table 52 and tape 23 are separated from each other by releasing the suction securing after forming a modified region 7, no strong bending stress acts on the object 1. This can prevent the object 1 from being cut along a line to cut from the modified region 7 acting as a cutting start point when separating the table 52 and tape 23 from each other.
摘要翻译：提供了一种激光加工方法，其可以防止在将吸力台和保持构件彼此分离时沿着用作切割起点的改质区域沿着切割线切割被处理物体。通过抽吸将保持待处理物体1的可膨胀带23通过抽吸固定到真空卡盘的吸盘52上，其间插入多孔片53。由于片材53的杨氏模量低于表52的杨氏模量，所以能够抑制带23咬入片材53的微细孔。结果，即使当桌子52和带23通过释放而彼此分离时在形成改质区域7之后的吸附固定，没有强烈的弯曲应力作用在物体1上。这样可以防止物体1从分离工作台52时作为切割起点的改质区域7切割出来和胶带23。

20. 发明申请

US20070287267A1 Laser Processing Method and Object to be Processed 有权
标题翻译：激光加工方法和待加工对象
公开(公告)号：US20070287267A1
公开(公告)日：2007-12-13
申请号：US10594892
申请日：2005-03-02
申请人： Takeshi Sakamoto , Kenichi Muramatsu
发明人： Takeshi Sakamoto , Kenichi Muramatsu
IPC分类号： H01L21/301 , B23K26/00
CPC分类号： B23K33/002 , B23K26/40 , B23K26/53 , B23K2101/36 , B23K2103/50
摘要： A laser processing method is provided, which, when cutting a substrate formed with a laminate part including a plurality of functional devices into a plurality of chips, each chip including at least one of the functional devices, can cut the laminate part with a high precision together with the substrate. In this laser processing method, modified regions differing from each other in terms of easiness to cause the substrate 4 to fracture are formed along respective lines to cut 5a to 5d. Therefore, when an expandable tape is attached to the rear face of a substrate 4 and expanded, an object to be processed 1 is cut stepwise into a plurality of chips. Such stepwise cutting allows uniform tensile stresses to act on respective parts extending along the lines to cut 5a to 5d, whereby interlayer insulating films on the lines to cut 5a to 5d are cut with a high precision together with the substrate 4.
摘要翻译：提供了一种激光加工方法，其将由具有多个功能元件的层叠部件形成的基板切割成多个芯片时，包括至少一个功能元件的芯片可以以高精度切割层叠部件与基底一起。在这种激光加工方法中，沿着各个线形成沿着各自的线形成彼此不同的改变区域，以使得基板4断裂，以切割5a至5d。因此，当将可膨胀带附接到基板4的后表面并膨胀时，被处理物体1被逐步切割成多个芯片。这种逐步切割允许均匀的拉伸应力作用于沿着切割线5a至5d延伸的相应部分，由此切割的切割线5a至5d上的层间绝缘膜与基板4一起被高精度地切割。

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