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11. 发明授权

US07206193B2 Surface-mount capacitor and method of producing the same 有权
标题翻译：表面贴装电容器及其制造方法
公开(公告)号：US07206193B2
公开(公告)日：2007-04-17
申请号：US11260831
申请日：2005-10-27
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01G2/10 , H01G9/08
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层叠板状电容器元件而形成，所述电容器元件的相对端部具有阳极引线部分11和位于其中心的阴极部分12，阳极端子18经由一个阳极引线部分11经由条状板14和连接到阴极部分12的阴极端子19。阳极和阴极端子18和19具有扁平形状并且形成在公共平面上作为基板安装表面。模具树脂壳体20具有填充阳极和阴极端子18和19之间的间隙的底部，并且机构地连接阳极和阴极端子18和19以及基本垂直于基板安装表面的侧壁。阳极和阴极端子18和19具有暴露在模制树脂壳体20的内底表面上的上表面，以连接到阳极引线部分11和阴极部分12。

12. 外观设计

USD587198S1 Surface-mount low-profile capacitor 有权
标题翻译：表面贴装薄型电容器
公开(公告)号：USD587198S1
公开(公告)日：2009-02-24
申请号：US29301364
申请日：2008-02-26
申请人： Toshihisa Nagasawa
设计人： Toshihisa Nagasawa

13. 外观设计

USD587199S1 Surface-mount low-profile capacitor 有权
公开(公告)号：USD587199S1
公开(公告)日：2009-02-24
申请号：US29301365
申请日：2008-02-26
申请人： Toshihisa Nagasawa
设计人： Toshihisa Nagasawa

14. 发明授权

US06392868B1 Electric double layer capacitor 有权
公开(公告)号：US06392868B1
公开(公告)日：2002-05-21
申请号：US09792056
申请日：2001-02-26
申请人： Masako Ohya , Kazuya Mimura , Yutaka Nakazawa , Satoshi Abe , Satoshi Arai , Takashi Yasuda , Toshihisa Nagasawa , Koji Sakata , Mitsuru Ogawa
发明人： Masako Ohya , Kazuya Mimura , Yutaka Nakazawa , Satoshi Abe , Satoshi Arai , Takashi Yasuda , Toshihisa Nagasawa , Koji Sakata , Mitsuru Ogawa
IPC分类号： H01G900
摘要： An electric double-layer capacitor has a pair of thrust plates for thrusting a stacked cell pair and a gasket for encapsulating the stacked cell pair together with the thrust plates. The thrust plate has slanted side surfaces for effecting a close contact with a packaging overcoat. The thrust plates and the mounting gasket are coupled together by an interdigitaion relationship.

15. 发明授权

US06882521B2 Chip-type capacitor, method of manufacturing the same and molding die 有权
标题翻译：片式电容器，其制造方法和成型模具
公开(公告)号：US06882521B2
公开(公告)日：2005-04-19
申请号：US10738863
申请日：2003-12-16
申请人： Makoto Tsutsui , Toshihisa Nagasawa
发明人： Makoto Tsutsui , Toshihisa Nagasawa
IPC分类号： H01G4/228 , H01G2/06 , H01G9/00 , H01G9/004 , H01G9/008 , H01G9/012 , H01G9/042 , H01G9/08 , H01G9/10 , H01G13/00
CPC分类号： H01G9/012 , H01G2/065 , H01G9/042 , H01G9/10 , Y10T29/417
摘要： A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.
摘要翻译：芯片型电容器包括电容器元件，覆盖整个电容器元件的封装树脂，阳极端子，底部表面暴露在封装树脂的安装表面上的基部和垂直于该电容元件的竖直部分基部，其一端连接到基部，另一端焊接到从电容器元件引出的阳极引线，以及阴极端子，其通过导电粘合剂固定到电容器元件，以暴露在电容器元件上的底表面封装树脂的安装表面。在封装树脂的相对侧面的每一侧形成有凹部，从而部分露出与底面相反的阳极和阴极端子的上表面，形成从封装树脂露出的端子露出部。

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