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11. 发明授权

US07903069B2 LCD driver integrated circuit having double column structure 失效
标题翻译： LCD驱动器集成电路具有双列结构
公开(公告)号：US07903069B2
公开(公告)日：2011-03-08
申请号：US11467597
申请日：2006-08-28
申请人： Jae-Wook Kwon , Seung-Jung Lee
发明人： Jae-Wook Kwon , Seung-Jung Lee
IPC分类号： G09G3/36
CPC分类号： G09G3/3688 , G09G2310/027 , G09G2320/0276
摘要： A driver integrated circuit (IC) for a liquid crystal display (LCD) has a double column structure. The driver IC includes a first shift register unit, a first data latch unit, first and second decoders, and first and second output buffers. The first data latch unit receives and stores first and second group channel data in response to a clock signal generated by the first shift register unit. The first decoder receives the first group channel data and outputs gamma voltages corresponding to the first group channel data. The second decoder receives the second group channel data and outputs gamma voltages corresponding to the second group channel data. The first and second output buffers are aligned along a long edge of the driver IC and buffer the corresponding gamma voltages to drive corresponding channels. The first shift register unit and the first data latch unit are shared by upper and lower blocks to process the first and second group channel data together.
摘要翻译：用于液晶显示器（LCD）的驱动器集成电路（IC）具有双列结构。驱动器IC包括第一移位寄存器单元，第一数据锁存单元，第一和第二解码器以及第一和第二输出缓冲器。第一数据锁存单元响应于由第一移位寄存器单元产生的时钟信号而接收并存储第一和第二组信道数据。第一解码器接收第一组信道数据并输出与第一组信道数据相对应的伽马电压。第二解码器接收第二组信道数据并输出对应于第二组信道数据的伽马电压。第一和第二输出缓冲器沿着驱动器IC的长边对准，并且缓冲相应的伽马电压以驱动相应的通道。第一移位寄存器单元和第一数据锁存单元由上下块共享以一起处理第一和第二组信道数据。

12. 发明授权

US07589457B2 Nondestructive reliability monitoring method for adhesively bonded structures whose sensitivity is improved by using piezoelectric or conductive materials 失效
标题翻译：通过使用压电或导电材料提高灵敏度的粘结结构的非破坏性可靠性监测方法
公开(公告)号：US07589457B2
公开(公告)日：2009-09-15
申请号：US11752159
申请日：2007-05-22
申请人： Dai-Gil Lee , Hui-Yun Hwang , Woo-Seok Chin , Seung-Min Lee , Byung-Chul Kim , Jae-Wook Kwon , Soon-Ho Yoon
发明人： Dai-Gil Lee , Hui-Yun Hwang , Woo-Seok Chin , Seung-Min Lee , Byung-Chul Kim , Jae-Wook Kwon , Soon-Ho Yoon
IPC分类号： H01L41/113
CPC分类号： G01N29/045 , G01N27/24 , G01N2291/0231 , G01N2291/02863 , Y10T29/42 , Y10T29/49004
摘要： A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life.
摘要翻译：公开了一种用于以更高的灵敏度和非破坏性的方式测试接合结构的接合部件完整性的方法。该方法包括以下步骤：将压电材料或导电材料与粘合剂混合，在粘合目标物体之间固化粘合剂，将结合目标物体彼此电连接，使电流流过结合目标物体，以测量在接合目标物体之间流动的电荷量，并且基于电荷量确定接合目标物体和粘合剂之间的接合损伤的存在，并且基于以下方式预测接合结构体的剩余寿命：指示电荷量与预定疲劳寿命之间的相关性的数据。

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