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    • 12. 发明申请
    • Methods of fabrication of shroud-based electrodes for monitoring cardiac activity
    • 制造用于监测心脏活动的护罩型电极的方法
    • US20060217778A1
    • 2006-09-28
    • US11086837
    • 2005-03-22
    • James StromScott BrabecJohn NicholsonMichael FletcherThomas AdamskiChristopher Stancer
    • James StromScott BrabecJohn NicholsonMichael FletcherThomas AdamskiChristopher Stancer
    • A61N1/375
    • A61N1/375A61N1/0504A61N1/3756
    • The present invention provides a subcutaneous (or submuscular) single or multiple-electrode array including various embodiments of a surround shroud coupled to a peripheral portion of an implantable medical device (IMD). The shroud incorporates a plurality of substantially planar electrodes mechanically coupled within recessed portions of the shroud. These electrodes electrically couple to IMD circuitry to monitor cardiac activity of a subject. Temporal recordings of the detected cardiac activity are referred to herein as an extra-cardiac electrogram (EC-EGM). The recordings can be stored upon computer readable media within an IMD at various resolution (e.g., continuous beat-by-beat, periodic, triggered, mean value, average value, etc.). Real time or stored EC-EGM signals can be provided to remote equipment via telemetry. For example, when telemetry, or programming, head of an IMD programming apparatus is positioned within range of an IMD the programmer receives some or all of the EC-EGM signals.
    • 本发明提供包括耦合到可植入医疗装置(IMD)的周边部分的环绕护罩的各种实施例的皮下(或肌肉下)单电极阵列或多电极阵列。 护罩包括多个基本上平面的电极,机械耦合在护罩的凹陷部分内。 这些电极电耦合到IMD电路以监测受试者的心脏活动。 检测到的心脏活动的时间记录在本文中称为心外电图(EC-EGM)。 记录可以以各种分辨率(例如,连拍,逐周期,触发,平均值,平均值等)存储在IMD内的计算机可读介质上。 可以通过遥测提供实时或存储的EC-EGM信号到远程设备。 例如,当遥测或编程时,IMD编程设备的头部位于IMD的范围内,程序员接收部分或全部EC-EGM信号。
    • 17. 发明申请
    • Outdoor changeable message sign
    • 户外可变信息标志
    • US20070251132A1
    • 2007-11-01
    • US11649735
    • 2007-01-04
    • Eugene LuomaJames BlesenerJohn Nicholson
    • Eugene LuomaJames BlesenerJohn Nicholson
    • G09F13/00
    • G09F9/33G09F9/3026
    • A preferred embodiment of the present invention is a mobile sign with a solar panel for warning motorists of highway problems. The mobile sign comprises support structure configured as a wheeled vehicle. In preferred embodiments, the sign panel comprises an enclosure or housing having a front transparent panel, a multiplicity of LED's in a matrixical arrangement for generating electronically changeable messages mounted in the enclosure and spaced from the front panel, and a pattern of opaque material, for example paint, applied on the exterior of the front transparent panel defining a plurality of windows for passing light therethrough. In a preferred embodiment, the windows will be in a matrixical arrangement comprising a plurality of rows and columns of individual LED's or rows and columns of groupings of LEDs.
    • 本发明的优选实施例是具有太阳能电池板的移动标志,用于警告高速公路问题的驾驶者。 移动标志包括构造为轮式车辆的支撑结构。 在优选实施例中,符号面板包括具有前透明面板的外壳或壳体,矩阵布置中的多个LED,用于产生安装在外壳中并与前面板间隔开的电子可更换消息以及不透明材料的图案,用于 涂覆在前透明板的外部,其限定多个窗口,用于使光通过其中。 在优选实施例中,窗口将处于包括多个行和列的各个LED或LED的分组的行和列的矩阵布置中。
    • 20. 发明申请
    • Connector assembly for an implantable medical device and process for making
    • US20050137642A1
    • 2005-06-23
    • US10966636
    • 2004-10-15
    • Bryan ZartBrian BurwickAndrew RiesJohn NicholsonJay LahtiGregory Theis
    • Bryan ZartBrian BurwickAndrew RiesJohn NicholsonJay LahtiGregory Theis
    • A61N1/375H01R13/504H01R43/18
    • H01R13/504A61N1/3752H01R43/18Y10T29/49146
    • An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts. Next, this loaded core assembly is prepared for an overmolding process by loading bushings into apertures of the various conductive circuit components to prevent these apertures from receiving thermoplastic material during the overmold process. The prepared and loaded core assembly is positioned into a second-shot mold assembly, and a second-shot of thermoplastic material is injected into the mold. This thermoplastic material is heated to a temperature at, or above, the melting point of the material to create a bond between the core portion and the overmold material. To achieve this, the ratio of the mass of the core element as compared to that of the overmold material is made as small as possible so that the heat energy from the mold is able to adequately heat the core portion. Bonding may further be enhanced by providing ridges on the surface of the core portion that are melted during the overmold process, and/or by pre-heating the core portion prior to injecting the second shot of thermoplastic material into the mold.