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11. 发明授权

US07000002B2 Streaming data from multiple sources according to storage location information 有权
标题翻译：根据存储位置信息从多个源流式传输数据
公开(公告)号：US07000002B2
公开(公告)日：2006-02-14
申请号：US11087122
申请日：2005-03-22
申请人： Naoya Suzuki , Hidekazu Tanaka
发明人： Naoya Suzuki , Hidekazu Tanaka
IPC分类号： G06F12/00 , G06F13/00 , H04L12/28
CPC分类号： G06F17/30749 , G06F17/30017
摘要： In a data processing system, device, and method and a program storage medium, provided are data storage devices that store data and a data processing device that receives a list describing information about data stored in the data storage devices from the data storage devices and that receives and processes data selected based on the received list. Accordingly, a large amount of data can be processed with the data processing device irrespective of storage capacity of storage means.
摘要翻译：在数据处理系统，设备和方法以及程序存储介质中，提供存储数据的数据存储设备和数据处理设备，该数据存储设备从数据存储设备接收关于数据存储设备中存储的数据的列表的列表，并且接收并处理基于接收到的列表选择的数据。因此，可以与数据处理装置一起处理大量数据，而与存储装置的存储容量无关。

12. 发明授权

US06611064B1 Semiconductor device and method for manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06611064B1
公开(公告)日：2003-08-26
申请号：US09744577
申请日：2001-04-05
申请人： Takashi Kousaka , Naoya Suzuki , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
发明人： Takashi Kousaka , Naoya Suzuki , Toshiaki Tanaka , Masaaki Yasuda , Aizou Kaneda
IPC分类号： H01L2329
CPC分类号： H01L24/83 , H01L23/3121 , H01L23/3128 , H01L23/49816 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83136 , H01L2224/8319 , H01L2224/83855 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/12044 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/20753
摘要： In the present invention, provided are a semiconductor device having a semiconductor-element-mounting substrate on which a semiconductor element has been mounted via an adhesive having an exothermic-reaction curing start temperature of 130° C. or below as measured with a differential scanning calorimeter at a heating rate of 10° C./minute, and a process for its fabrication.
摘要翻译：在本发明中，提供了一种半导体器件，其具有半导体元件安装基板，半导体元件已经通过具有130℃或更低的放热反应固化开始温度的粘合剂安装在其上，用差示扫描测量量热计，加热速率为10℃/分钟，其制造方法。

13. 发明授权

US08019833B2 Information processing device, information processing method, information processing program, and remote controller terminal 有权
标题翻译：信息处理装置，信息处理方法，信息处理程序和遥控器终端
公开(公告)号：US08019833B2
公开(公告)日：2011-09-13
申请号：US12466531
申请日：2009-05-15
申请人： Naoya Suzuki
发明人： Naoya Suzuki
IPC分类号： G06F15/16
CPC分类号： G06F3/0482 , G06F2203/04802 , H04M1/7253 , H04M1/72533 , H04M2250/02
摘要： An information processing system, an information processing device, an information processing method, an information processing program, and a remote controller terminal offer further improved operability. A remote controller terminal uses function item information receiving means to receive function item information representing functions of an information terminal device to be operated, which is directly transmitted from the information terminal device, and uses processing command transmitting means to directly transmit a processing command corresponding to the received function item information to the information terminal device in accordance with user's input operation, and the information processing device uses processing command receiving means to receive the processing command directly transmitted from the remote controller terminal, and uses control means to control the function corresponding to the processing command in order to execute predetermined processing in accordance with instructions from the remote controller terminal, thus the information terminal device 2 can be directly operated with the remote controller terminal 3, without having a wired connection.
摘要翻译：信息处理系统，信息处理装置，信息处理方法，信息处理程序和遥控器终端提供进一步提高的可操作性。遥控器终端使用功能项信息接收装置来接收表示从信息终端装置直接发送的要被操作的信息终端装置的功能的功能项信息，并且使用处理命令发送装置直接发送对应于根据用户的输入操作将接收的功能项信息发送到信息终端装置，信息处理装置使用处理指令接收装置接收从遥控器终端直接发送的处理命令，并且使用控制装置来控制对应于该处理命令为了根据来自遥控器终端的指令执行预定处理，因此信息终端装置2可以直接与遥控器终端3一起操作，而不需要有线连接。

14. 外观设计

USD633824S1 Motor vehicle and/or toy replica thereof 有权
公开(公告)号：USD633824S1
公开(公告)日：2011-03-08
申请号：US29365844
申请日：2010-07-15
申请人： Hirofumi Fukui , Naoya Suzuki
设计人： Hirofumi Fukui , Naoya Suzuki

15. 外观设计

USD566020S1 Rear bumper for an automobile 有权
公开(公告)号：USD566020S1
公开(公告)日：2008-04-08
申请号：US29274372
申请日：2007-04-20
申请人： Etsuya Ohishi , Nobuyuki Tomatsu , Naoya Suzuki
设计人： Etsuya Ohishi , Nobuyuki Tomatsu , Naoya Suzuki

16. 外观设计

USD535040S1 Front combination lamp lens for an automobile 有权
标题翻译：汽车前组合灯透镜
公开(公告)号：USD535040S1
公开(公告)日：2007-01-09
申请号：US29239681
申请日：2005-10-03
申请人： Issei Otsubo , Takeo Sowa , Naoya Suzuki
设计人： Issei Otsubo , Takeo Sowa , Naoya Suzuki

17. 发明申请

US20060240849A1 Update notification system, update monitoring apparatus, mobile communication terminal, information processing apparatus, contents acquisition instructing method, contents acquiring method, and program storing medium 有权
公开(公告)号：US20060240849A1
公开(公告)日：2006-10-26
申请号：US11455701
申请日：2006-06-20
申请人： Naoya Suzuki
发明人： Naoya Suzuki
IPC分类号： H04Q7/20
CPC分类号： H04W4/00 , G06F17/30902 , H04L12/1859 , H04L12/189 , H04L12/1895 , H04L67/02 , H04L69/329 , H04W4/12
摘要： An update notification system is capable of efficiently acquiring updated contents. Provided are an update monitoring apparatus 6 for monitoring contents stored in a server 7 for their update situations to transmit an update notification signal when the contents is updated, a mobile communication terminal 3 for notifying the user that the contents have been updated, in response to receipt of the update notification signal and for transmitting an acquisition instructing signal for instructing acquisition of the updated contents, and an information processing apparatus 2 for downloading the updated contents from the server 7 in response to receipt of the acquisition instructing signal.

18. 发明申请

US20050162937A1 Streaming data from multiple sources according to storage location information 有权
公开(公告)号：US20050162937A1
公开(公告)日：2005-07-28
申请号：US11087252
申请日：2005-03-22
申请人： Naoya Suzuki , Hidekazu Tanaka
发明人： Naoya Suzuki , Hidekazu Tanaka
IPC分类号： G06F13/00 , G06F17/30 , G10K15/02 , G10K15/04 , G10L13/00 , G10L19/00 , G10L21/06 , G11C5/00
CPC分类号： G06F17/30749 , G06F17/30017
摘要： In a data processing system, device, and method and a program storage medium, provided are data storage devices that store data and a data processing device that receives a list describing information about data stored in the data storage devices from the data storage devices and that receives and processes data selected based on the received list. Accordingly, a large amount of data can be processed with the data processing device irrespective of storage capacity of storage means.

19. 发明授权

US06774501B2 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein 有权
公开(公告)号：US06774501B2
公开(公告)日：2004-08-10
申请号：US10381034
申请日：2003-03-21
申请人： Kazuhiko Kurafuchi , Naoya Suzuki , Masaaki Yasuda , Tatsuo Kawata , Hiroyuki Sakai , Masao Kawasumi
发明人： Kazuhiko Kurafuchi , Naoya Suzuki , Masaaki Yasuda , Tatsuo Kawata , Hiroyuki Sakai , Masao Kawasumi
IPC分类号： H01L2329
CPC分类号： H01L23/3107 , C08G59/302 , C08L63/00 , H01L23/293 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15747 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A resin-sealed semiconductor device which comprises a lead frame having a die bond pad and an inner lead, a semiconductor chip installed on the die bond pad via a die bonding material and a sealing material for sealing the semiconductor chip and the lead frame, wherein properties of the die bonding material and the sealing material after curing satisfies the following formulae: &sgr;e≦0.2×&sgr;b formula (1) Ui≧2.0×10−6×&sgr;ei formula (2) Ud≧4.69×10−6×ed formula (3) wherein &sgr;b (MPa)represents the flexural strength at break of the sealing material at 25°, Ui (N·m) and Ud (N·m) represent shear strain energies of the sealing material at a soldering temperature for the inner lead and the die bonding pad, respectively, at a peak temperature during soldering, where &sgr;e=(1/log(kd1))×Ee1×(&agr;m−&agr;e1)×&Dgr;T1 formula (4), &sgr;ei=Ee2×(&agr;e2−&agr;m)×&Dgr;T2 formula (5), &sgr;ed=log(kd2)×Ee2×(&agr;e2−&agr;m)×&Dgr;T2 Formula (6), kd1: a ratio of the flexural elastic modulus Ed1 (MPa) of the die bonding material at 25° to 1 MPa of elastic modulus (Ed1>1 MPa), kd2: a ratio of the flexural elastic modulus Ed2 (MPa) of the die bonding material at the peak temperature during the soldering to 1 MPa of elastic modulus (Ed2>1 MPa), Ee1: a flexural modulus (MPa) of the sealing material at 25°, Ee2: a flexural modulus (MPa) of the sealing material at the peak temperature during soldering, &agr;e1: an average thermal expansion coefficient (1/° C.) of the sealing material from forming temperature for the semiconductor to room temperature (25° C.), &agr;e2: an average thermal expansion coefficient (1/° C.) of the sealing material from the forming temperature for the semiconductor to a peak temperature during soldering, &agr;m: a thermal expansion coefficient (1/° C.) of the lead frame, &Dgr;T1: the difference (° C.) between the forming temperature for the semiconductor and the low temperature side temperature in the temperature cycle, and &Dgr;T2: the difference (° C.) between the forming temperature for the semiconductor and the peak temperature during soldering.

20. 外观设计

USD649498S1 Rear portion of an automobile 有权
公开(公告)号：USD649498S1
公开(公告)日：2011-11-29
申请号：US29377168
申请日：2010-10-18
申请人： Takeo Sowa , Naoya Suzuki
设计人： Takeo Sowa , Naoya Suzuki

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