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11. 发明授权

US08668484B2 Mold, imprint method, and process for producing a chip 有权
标题翻译：模具，压印方法和制造芯片的工艺
公开(公告)号：US08668484B2
公开(公告)日：2014-03-11
申请号：US12388194
申请日：2009-02-18
申请人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
发明人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
IPC分类号： B29C59/00
CPC分类号： B29C59/00 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0017 , G03F9/7042
摘要： A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
摘要翻译：该模具能够在将待固化的树脂材料设置在模具和待加工构件之间的状态下与要处理的构件高度准确地对准，并且由第一材料和对准构成的基板2010构成标记2102由与第一材料不同的第二材料形成。第一材料和第二材料在紫外线波长范围的一部分中具有透光性。第二种材料的折射率不小于1.7。

12. 发明申请

US20110042352A1 IMPRINT METHOD AND PROCESSING METHOD OF SUBSTRATE USING THE IMPRINT METHOD 有权
标题翻译：使用IMPRINT方法的衬底的印刷方法和处理方法
公开(公告)号：US20110042352A1
公开(公告)日：2011-02-24
申请号：US12282454
申请日：2008-08-01
申请人： Shingo Okushima , Junichi Seki , Haruhito Ono , Nao Nakatsuji , Atsunori Terasaki
发明人： Shingo Okushima , Junichi Seki , Haruhito Ono , Nao Nakatsuji , Atsunori Terasaki
IPC分类号： C23F1/00 , B05D3/00
CPC分类号： G03F7/0002 , B29C33/424 , B82Y10/00 , B82Y40/00
摘要： An imprint method for imprinting a pattern of a mold onto a resin material on a substrate. The imprint method includes a step of forming a processed area in which an imprint pattern corresponding to the pattern of the mold is formed, and an outside area formed of a periphery of the processed area, by bringing the mold into contact with the resin material formed on the substrate, so that a portion of the resin material is extruded from the processed area into the outside area, a step of forming a protection layer for protecting the processed area, and a step of removing a layer of the resin material in the outside area, while the imprint pattern formed on a layer of the resin material in the processed area, is protected by the protection layer, so as not to be removed.
摘要翻译：用于将模具图案压印在基板上的树脂材料上的压印方法。压印方法包括通过使模具与形成的树脂材料接触来形成其中形成与模具的图案相对应的压印图案的处理区域和由处理区域的周边形成的外部区域的步骤在基板上，使得一部分树脂材料从处理区域挤出到外部区域中，形成用于保护加工区域的保护层的步骤，以及在外部去除树脂材料层的步骤区域，而在处理区域中形成在树脂材料层上的印模图案被保护层保护，以便不被去除。

13. 发明申请

US20100078840A1 IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE 审中-公开
标题翻译：印刷装置及其制造方法
公开(公告)号：US20100078840A1
公开(公告)日：2010-04-01
申请号：US12565664
申请日：2009-09-23
申请人： Eigo Kawakami , Hideki Ina , Junichi Seki , Atsunori Terasaki , Shingo Okushima , Motoki Okinaka
发明人： Eigo Kawakami , Hideki Ina , Junichi Seki , Atsunori Terasaki , Shingo Okushima , Motoki Okinaka
IPC分类号： B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F9/7015 , G03F9/7042
摘要： An apparatus for pressing resin on a shot region of a substrate and a mold to each other to form a resin pattern on the shot region, including: a mold chuck; an X-Y stage including a substrate chuck, the resin held by the substrate chuck and mold held by the mold chuck being pressed to each other in a Z-axis direction; a dispenser for dispensing the resin on the shot region; a scope for measuring, in an X-Y plane, a position of a substrate mark formed in each of a plurality of shot regions of the substrate held by the substrate chuck; and a reference mark formed on the X-Y stage. The X-Y stage has a moving range allowing the dispenser to dispense the resin on all shot regions of the substrate, and the position of the reference mark can be measured within the moving range of the X-Y stage.
摘要翻译：一种用于将基板和模具的注射区域上的树脂彼此挤压以在射出区域上形成树脂图案的装置，包括：模具卡盘; 包括基板卡盘的X-Y平台，由基板卡盘保持的树脂和由卡盘夹持的模具在Z轴方向上彼此挤压; 用于在喷射区域上分配树脂的分配器; 用于在X-Y平面中测量形成在由基板卡盘保持的基板的多个注射区域中的每一个中的基板标记的位置的范围; 和在X-Y平台上形成的参考标记。 X-Y平台具有移动范围，允许分配器在基板的所有喷射区域上分配树脂，并且可以在X-Y平台的移动范围内测量参考标记的位置。

14. 发明申请

US20100072667A1 IMPRINTING METHOD 审中-公开
标题翻译：印刷方法
公开(公告)号：US20100072667A1
公开(公告)日：2010-03-25
申请号：US12564187
申请日：2009-09-22
申请人： Eigo Kawakami , Motoki Okinaka , Hideki Ina , Junichi Seki , Atsunori Terasaki , Shingo Okushima
发明人： Eigo Kawakami , Motoki Okinaka , Hideki Ina , Junichi Seki , Atsunori Terasaki , Shingo Okushima
IPC分类号： B29C39/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： An imprinting method for depositing resins to a substrate, bringing a mold into contact with the resins, and transferring a pattern formed on the mold to the resins includes a first imprinting process for transferring the pattern to a first resin and a second imprinting process for forming the pattern on a second resin in an area adjacent to an area formed during the first imprinting process. The amount of the second resin to be deposited during the second imprinting process is different from that of the first resin used during the first imprinting process so that a gap between the area formed during the first imprinting process and an area to be formed during the second imprinting process is filled.
摘要翻译：用于将树脂沉积到基底上，使模具与树脂接触并将形成在模具上的图案转印到树脂上的印记方法包括用于将图案转印到第一树脂的第一印记方法和用于形成的第二印记工艺在与第一次压印过程中形成的区域相邻的区域中的第二树脂上的图案。在第二次压印处理期间，要沉积的第二树脂的量不同于在第一次压印过程中使用的第一树脂的量，使得在第一次压印过程中形成的区域与在第二次压印过程中形成的区域之间的间隙印记过程充满。

15. 发明申请

US20100072653A1 IMPRINTING APPARATUS AND METHOD THEREFOR 有权
标题翻译：印刷设备及其方法
公开(公告)号：US20100072653A1
公开(公告)日：2010-03-25
申请号：US12566513
申请日：2009-09-24
申请人： Eigo Kawakami , Shingo Okushima , Hideki Ina , Junichi Seki , Atsunori Terasaki , Motoki Okinaka
发明人： Eigo Kawakami , Shingo Okushima , Hideki Ina , Junichi Seki , Atsunori Terasaki , Motoki Okinaka
IPC分类号： B29C43/58 , B29C43/32
CPC分类号： B29C43/021 , B29C43/003 , B29C43/14 , B29C43/58 , B29C2043/025 , B29C2043/142 , B29C2043/5833 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel.
摘要翻译：提供了一种压印装置，其将模具的图案转移到基板上的树脂，所述压印装置包括沉积机构，所述沉积机构被配置为将所述树脂沉积到所述基板上; 第一驱动机构，其构造成在基板的表面平行的平面上改变基板和模具的相对位置; 第二驱动机构，被配置为在与基板的表面平行的平面上改变基板和沉积机构的相对位置; 以及控制单元，被配置为控制沉积机构和驱动机构，以便执行将树脂沉积到基板上的树脂沉积工艺和将模具图案平行地转移到基板上的树脂的压印工艺。

16. 发明申请

US20090189306A1 MANUFACTURING METHOD OF STRUCTURE BY IMPRINT 有权
标题翻译：通过印刷制造结构的方法
公开(公告)号：US20090189306A1
公开(公告)日：2009-07-30
申请号：US12361870
申请日：2009-01-29
申请人： Atsunori Terasaki , Shingo Okushima , Junichi Seki
发明人： Atsunori Terasaki , Shingo Okushima , Junichi Seki
IPC分类号： B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： A manufacturing method of a structure by an imprint process includes a first imprint step of forming a first resin material layer by applying a first resin material onto a substrate and then transferring an imprint pattern of a mold onto the first resin material layer, a second imprint step of forming a second resin material layer by applying a second resin material onto the first resin material layer formed in the first imprint step and onto an area of the substrate adjacent to the first resin material layer and then transferring the imprint pattern of the mold onto the second resin material layer, and a step of forming a pattern by etching the first and second resin material layers.
摘要翻译：通过压印处理的结构的制造方法包括：通过将第一树脂材料施加到基板上然后将模具的压印图案转印到第一树脂材料层上来形成第一树脂材料层的第一压印步骤，第二印记通过在第一压印步骤中形成的第一树脂材料层上施加第二树脂材料并与第一树脂材料层相邻的基板的区域上形成第二树脂材料层，然后将模具的压印图案转印到第二树脂材料层，以及通过蚀刻第一和第二树脂材料层形成图案的步骤。

17. 发明申请

US20090152753A1 MOLD, IMPRINT METHOD, AND PROCESS FOR PRODUCING A CHIP 有权
标题翻译：模具，印刷方法和制造芯片的方法
公开(公告)号：US20090152753A1
公开(公告)日：2009-06-18
申请号：US12388194
申请日：2009-02-18
申请人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
发明人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
IPC分类号： B29C43/58
CPC分类号： B29C59/00 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0017 , G03F9/7042
摘要： A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
摘要翻译：该模具能够在将待固化的树脂材料设置在模具和待加工构件之间的状态下与要处理的构件高度准确地对准，并且由第一材料和对准构成的基板2010构成标记2102由与第一材料不同的第二材料形成。第一材料和第二材料在紫外线波长范围的一部分中具有透光性。第二种材料的折射率不小于1.7。

18. 发明申请

US20090098688A1 IMPRINT METHOD, CHIP PRODUCTION PROCESS, AND IMPRINT APPARATUS 有权
标题翻译：印刷方法，芯片生产过程和印刷设备
公开(公告)号：US20090098688A1
公开(公告)日：2009-04-16
申请号：US12091836
申请日：2008-03-17
申请人： Shingo Okushima , Junichi Seki , Atsunori Terasaki
发明人： Shingo Okushima , Junichi Seki , Atsunori Terasaki
IPC分类号： H01L21/56 , B29C35/08
CPC分类号： B29C35/0888 , B29C37/0053 , B29C43/003 , B29C43/021 , B29C43/58 , B29C2035/0827 , B29C2043/025 , B29C2043/3634 , B29C2043/5833 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01J37/026 , H01J2237/0042 , H01J2237/0047
摘要： An imprint method is constituted by a step of curing a resin material formed on a substrate in a state in which an imprint pattern of a mold is in contact or proximity with the resin material, and a step of parting the mold from the cured resin material. The parting is effected while irradiating an entire area in which the imprint pattern of the mold is formed and the cured resin material with an electromagnetic wave for ionizing gaseous molecules in an atmosphere in which the mold and the cured resin material are placed.
摘要翻译：压印方法由在模具的压印图案与树脂材料接触或接近的状态下固化形成在基板上的树脂材料的步骤和从固化树脂材料分离模具的步骤构成的步骤。在放置模具和固化树脂材料的气氛中照射形成有模具的印模图案的整个区域和固定的树脂材料进行分离，并用电离气体离子化气态分子。

19. 发明授权

US08828307B2 Imprint method, chip production process, and imprint apparatus 有权
标题翻译：压印方法，芯片生产工艺和压印设备
公开(公告)号：US08828307B2
公开(公告)日：2014-09-09
申请号：US12091836
申请日：2008-03-17
申请人： Shingo Okushima , Junichi Seki , Atsunori Terasaki
发明人： Shingo Okushima , Junichi Seki , Atsunori Terasaki
IPC分类号： B29C35/08 , B82Y40/00 , B29C37/00 , B29C43/00 , B29C43/02 , B82Y10/00 , G03F7/00 , B28B11/24 , H01J37/02 , B29C43/58 , B29C43/36
CPC分类号： B29C35/0888 , B29C37/0053 , B29C43/003 , B29C43/021 , B29C43/58 , B29C2035/0827 , B29C2043/025 , B29C2043/3634 , B29C2043/5833 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01J37/026 , H01J2237/0042 , H01J2237/0047
摘要： An imprint method includes contacting an imprint pattern of a mold and a resin material on a substrate. The resin material is cured by irradiating the resin material with light in a state in which the imprint pattern is in contact with the resin material. The mold is parted from the cured resin material, and gaseous molecules are irradiated, in an atmosphere in which the mold is placed, with an electromagnetic wave having a wavelength that is shorter than a wavelength of the light irradiating the resin material. The electromagnetic wave is emitted from an electrification removing light source that is provided in a lateral side of the mold. In the irradiating step, the gaseous molecules are ionized by the irradiation of the electromagnetic wave from the electrification removing light source. The ionized gaseous molecules are supplied into an atmosphere between the substrate and the mold to remove electrification of at least a portion of the mold.
摘要翻译：压印方法包括将模具的印模图案和树脂材料接触在基板上。通过在印模图案与树脂材料接触的状态下用光照射树脂材料来固化树脂材料。模具从固化的树脂材料中分出，并且在放置模具的气氛中，用比照射树脂材料的光的波长短的电磁波照射气态分子。电磁波从设置在模具的侧面的带电去除光源发射。在照射步骤中，通过从带电去除光源照射电磁波，使气态分子离子化。将电离的气态分子供入到基底和模具之间的气氛中以去除模具的至少一部分的带电。

20. 发明授权

US08138088B2 Manufacturing method of structure by imprint 有权
标题翻译：通过印记制造结构的方法
公开(公告)号：US08138088B2
公开(公告)日：2012-03-20
申请号：US12361870
申请日：2009-01-29
申请人： Atsunori Terasaki , Shingo Okushima , Junichi Seki
发明人： Atsunori Terasaki , Shingo Okushima , Junichi Seki
IPC分类号： H01L21/027
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： A manufacturing method of a structure by an imprint process includes a first imprint step of forming a first resin material layer by applying a first resin material onto a substrate and then transferring an imprint pattern of a mold onto the first resin material layer, a second imprint step of forming a second resin material layer by applying a second resin material onto the first resin material layer formed in the first imprint step and onto an area of the substrate adjacent to the first resin material layer and then transferring the imprint pattern of the mold onto the second resin material layer, and a step of forming a pattern by etching the first and second resin material layers.
摘要翻译：通过压印处理的结构的制造方法包括：通过将第一树脂材料施加到基板上然后将模具的压印图案转印到第一树脂材料层上来形成第一树脂材料层的第一压印步骤，第二印记通过在第一压印步骤中形成的第一树脂材料层上施加第二树脂材料并与第一树脂材料层相邻的基板的区域上形成第二树脂材料层，然后将模具的压印图案转印到第二树脂材料层，以及通过蚀刻第一和第二树脂材料层形成图案的步骤。

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