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    • 16. 发明申请
    • Nitride semiconductor light-emitting device and method for producing same
    • 氮化物半导体发光器件及其制造方法
    • US20080283866A1
    • 2008-11-20
    • US12216533
    • 2008-07-07
    • Teruyoshi TakakuraShigetoshi ItoTakeshi Kamikawa
    • Teruyoshi TakakuraShigetoshi ItoTakeshi Kamikawa
    • H01L33/00
    • H01S5/3202B82Y20/00H01L33/007H01S5/0202H01S5/0207H01S5/0211H01S5/0425H01S5/2201H01S5/2214H01S5/34333
    • In a method for producing a nitride semiconductor light-emitting device according to the present invention, first, a nitride semiconductor substrate having groove portions formed is prepared. An underlying layer comprising nitride semiconductor is formed on the nitride semiconductor substrate including the side walls of the groove portions, in such a manner that the underlying layer has a crystal surface in each of the groove portions and the crystal surface is tilted at an angle of from 53.5° to 63.4° with respect to the surface of the substrate. Over the underlying layer, a light-emitting-device structure composed of a lower cladding layer containing Al, an active layer, and an upper cladding layer containing Al is formed. According to the present invention, thickness nonuniformity and lack of surface flatness, which occur when accumulating a layer with light-emitting-device structure of nitride semiconductor over the nitride semiconductor substrate, are alleviated while inhibiting occurrence of cracking.
    • 在本发明的氮化物半导体发光元件的制造方法中,首先,准备形成有槽部的氮化物半导体基板。 在包括沟槽部分的侧壁的氮化物半导体衬底上形成包括氮化物半导体的下层,使得下层在每个沟槽部分中具有晶体表面,并且晶体表面以 相对于基板的表面为53.5°〜63.4°。 在下层之上,形成由包含Al的下包层,有源层和含有Al的上包层组成的发光器件结构。 根据本发明,在氮化物半导体衬底上堆积具有氮化物半导体的发光器件结构的层时发生的厚度不均匀性和表面平坦度不足,同时抑制裂纹的发生。
    • 19. 发明授权
    • Nitride semiconductor light emitting device chip
    • 氮化物半导体发光器件芯片
    • US06881981B2
    • 2005-04-19
    • US10250617
    • 2001-12-27
    • Yuhzoh TsudaShigetoshi Ito
    • Yuhzoh TsudaShigetoshi Ito
    • H01L33/00H01L33/14H01L33/32H01S5/323H01S5/343
    • H01L33/32B82Y20/00H01L33/0075H01L33/145H01S5/32341H01S5/34333
    • In a nitride semiconductor light emitting device chip, a mask pattern on a nitride semiconductor substrate (101) is formed of a growth inhibiting film on which a nitride semiconductor layer is hard to grow. There are a plurality of windows unprovided with the growth inhibiting film. There are at least two different widths as mask widths each between the adjacent windows. The mask pattern includes a mask A group (MAG) and mask B groups (MBG) arranged on respective sides of the mask A group. A mask A width in the mask A group is wider than a mask B width in the mask B group. The nitride semiconductor light emitting device chip further includes a nitride semiconductor underlayer (102) covering the windows and the mask pattern, and a light emitting device structure having a light emitting layer (106) including at least one quantum well layer between an n type layer (103-105) and a p type layer (107-110) over the underlayer. A current-constricting portion (RS) through which substantial current is introduced into the light emitting layer is formed above mask A.
    • 在氮化物半导体发光器件芯片中,氮化物半导体衬底(101)上的掩模图案由氮化物半导体层难以生长的生长抑制膜形成。 没有提供生长抑制膜的多个窗口。 至少两个不同的宽度作为每个相邻窗口之间的掩模宽度。 掩模图案包括布置在掩模A组的相应侧上的掩模A组(MAG)和掩模B组(MBG)。 掩模掩模A组中的宽度比掩模B组中的掩码B宽度宽。 氮化物半导体发光器件芯片还包括覆盖窗口和掩模图案的氮化物半导体底层(102)和发光器件结构,其具有发光层(106),发光层(106)包括在n型层之间的至少一个量子阱层 (103-105)和ap型层(107-110)。 在掩模A上方形成有通过其将大量电流引入发光层的电流限制部分(RS)。