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    • 11. 发明授权
    • Aluminum contact integration on cobalt silicide junction
    • 硅化钴接头上的铝接触集成
    • US07867900B2
    • 2011-01-11
    • US12240816
    • 2008-09-29
    • Wei Ti LeeMohd Fadzli Anwar HassanTed GuoSang-Ho Yu
    • Wei Ti LeeMohd Fadzli Anwar HassanTed GuoSang-Ho Yu
    • H01L21/44
    • H01L23/53214H01L21/02068H01L21/28518H01L21/76876H01L21/76877H01L23/485H01L23/53223H01L2924/0002H01L2924/00
    • Embodiments herein provide methods for forming an aluminum contact on a cobalt silicide junction. In one embodiment, a method for forming materials on a substrate is provided which includes forming a cobalt silicide layer on a silicon-containing surface of the substrate during a silicidation process, forming a fluorinated sublimation film on the cobalt silicide layer during a plasma process, heating the substrate to a sublimation temperature to remove the fluorinated sublimation film, depositing a titanium-containing nucleation layer over the cobalt silicide layer, and depositing an aluminum-containing material over the titanium-containing nucleation layer. In one example, the method further provides forming the cobalt silicide layer by depositing a cobalt-containing layer on the silicon-containing surface, heating the substrate during a rapid thermal annealing (RTA) process, etching away any remaining portions of the cobalt-containing layer from the substrate, and subsequently heating the substrate during another RTA process.
    • 本文的实施方案提供了在钴硅化物结上形成铝接触的方法。 在一个实施例中,提供了一种在衬底上形成材料的方法,包括在硅化过程中在衬底的含硅表面上形成钴硅化物层,在等离子体工艺期间在硅化钴层上形成氟化升华膜, 将基板加热到升华温度以除去氟化升华膜,在硅化钴层上沉积含钛成核层,并在含钛成核层上沉积含铝材料。 在一个实例中,该方法还提供通过在含硅表面上沉积含钴层来形成钴硅化物层,在快速热退火(RTA)工艺中加热衬底,蚀刻掉含钴的剩余部分 层,然后在另一RTA工艺期间加热衬底。
    • 12. 发明申请
    • ALUMINUM CONTACT INTEGRATION ON COBALT SILICIDE JUNCTION
    • 铝接点集成在钴硅酮结上
    • US20090087983A1
    • 2009-04-02
    • US12240816
    • 2008-09-29
    • WEI TI LEEMohd Fadzli Anwar HassanTed GuoSang-Ho Yu
    • WEI TI LEEMohd Fadzli Anwar HassanTed GuoSang-Ho Yu
    • H01L21/44
    • H01L23/53214H01L21/02068H01L21/28518H01L21/76876H01L21/76877H01L23/485H01L23/53223H01L2924/0002H01L2924/00
    • Embodiments herein provide methods for forming an aluminum contact on a cobalt silicide junction. In one embodiment, a method for forming materials on a substrate is provided which includes forming a cobalt silicide layer on a silicon-containing surface of the substrate during a silicidation process, forming a fluorinated sublimation film on the cobalt silicide layer during a plasma process, heating the substrate to a sublimation temperature to remove the fluorinated sublimation film, depositing a titanium-containing nucleation layer over the cobalt silicide layer, and depositing an aluminum-containing material over the titanium-containing nucleation layer. In one example, the method further provides forming the cobalt silicide layer by depositing a cobalt-containing layer on the silicon-containing surface, heating the substrate during a rapid thermal annealing (RTA) process, etching away any remaining portions of the cobalt-containing layer from the substrate, and subsequently heating the substrate during another RTA process.
    • 本文的实施方案提供了在钴硅化物结上形成铝接触的方法。 在一个实施例中,提供了一种在衬底上形成材料的方法,包括在硅化过程中在衬底的含硅表面上形成钴硅化物层,在等离子体工艺期间在硅化钴层上形成氟化升华膜, 将基板加热到升华温度以除去氟化升华膜,在硅化钴层上沉积含钛成核层,并在含钛成核层上沉积含铝材料。 在一个实例中,该方法还提供通过在含硅表面上沉积含钴层来形成钴硅化物层,在快速热退火(RTA)工艺中加热衬底,蚀刻掉含钴的剩余部分 层,然后在另一RTA工艺期间加热衬底。
    • 13. 发明申请
    • Aluminum sputtering while biasing wafer
    • 铝溅射同时偏置晶圆
    • US20070045103A1
    • 2007-03-01
    • US11209328
    • 2005-08-23
    • Wei LeeTed GuoSang-Ho Yu
    • Wei LeeTed GuoSang-Ho Yu
    • C23C14/00
    • C23C14/185C23C14/025C23C14/046C23C14/345
    • An aluminum sputtering process including RF biasing the wafer and a two-step aluminum fill process and apparatus used therefor to fill aluminum into a narrow via hole by sputtering under two distinctly different conditions, preferably in two different plasma sputter reactors. The first step includes sputtering a high fraction of ionized aluminum atoms onto a relatively cold wafer, e.g., held at less than 150° C., and relatively highly biased to attract aluminum atoms into the narrow holes and etch overhangs. The second step includes more neutral sputtering onto a relatively warm wafer, e.g. held at greater than 250° C., and substantially unbiased to provide a more isotropic and uniform aluminum flux. The magnetron scanned about the back of the aluminum target may be relatively small and unbalanced in the first step and relatively large and balanced in the second.
    • 一种铝溅射工艺,包括RF偏置晶片和两步铝填充工艺和装置,用于在两个明显不同的条件下,优选在两个不同的等离子体溅射反应器中通过溅射将铝填充到窄通孔中。 第一步包括将大部分电离铝原子溅射到相对冷的晶片上,例如保持在小于150℃,并且相当高的偏压以将铝原子吸引到窄孔中并蚀刻突出端。 第二步包括在相对温暖的晶片上的更中性的溅射,例如 保持在大于250℃,并且基本上无偏差以提供更多的各向同性和均匀的铝通量。 围绕铝靶的背面扫描的磁控管可能在第一步骤中相对较小并且不平衡,而在第二步中相对较大且平衡。
    • 14. 发明授权
    • Organic electroluminescent display device and method of driving the same
    • 有机电致发光显示装置及其驱动方法
    • US09240139B2
    • 2016-01-19
    • US12591310
    • 2009-11-16
    • Hak-Su KimSang-Ho YuWon-Kyu Ha
    • Hak-Su KimSang-Ho YuWon-Kyu Ha
    • G09G5/00G09G3/30G09G3/32
    • G09G3/3233G09G2300/0819G09G2300/0842G09G2310/0224G09G2310/0251G09G2320/0233G09G2320/0252G09G2320/043
    • An organic electroluminescent display device includes a plurality of pixels, each one of the plurality of pixels including: a switching transistor that is connected to a gate line and a data line; a driving transistor, wherein a data voltage of the data line passing through the switching transistor is reflected into a gate of the driving transistor; a sampling transistor that samples a threshold voltage of the driving transistor, wherein a gate of the sampling transistor is connected to a control line, and the sampled threshold voltage is reflected into the gate of the driving transistor; an initializing transistor, wherein a gate of the initializing transistor is connected to a previous or next gate line, and an initialization voltage passing through the initializing transistor is reflected into the gate of the driving transistor; and an organic light emitting diode that is connected to the driving transistor, wherein a driving current of the organic light emitting diode is adjusted according to a voltage of the gate of the driving transistor.
    • 有机电致发光显示装置包括多个像素,所述多个像素中的每一个包括:连接到栅极线和数据线的开关晶体管; 驱动晶体管,其中通过所述开关晶体管的数据线的数据电压被反射到所述驱动晶体管的栅极; 采样晶体管,其对所述驱动晶体管的阈值电压进行采样,其中所述采样晶体管的栅极连接到控制线,并且所述采样阈值电压被反射到所述驱动晶体管的栅极中; 初始化晶体管,其中初始化晶体管的栅极连接到先前或下一个栅极线,并且通过初始化晶体管的初始化电压被反射到驱动晶体管的栅极中; 以及连接到所述驱动晶体管的有机发光二极管,其中根据所述驱动晶体管的栅极的电压来调节所述有机发光二极管的驱动电流。
    • 17. 发明申请
    • Organic electroluminescent display device and method of driving the same
    • 有机电致发光显示装置及其驱动方法
    • US20100156875A1
    • 2010-06-24
    • US12591310
    • 2009-11-16
    • Hak-Su KimSang-Ho YuWon-Kyu Ha
    • Hak-Su KimSang-Ho YuWon-Kyu Ha
    • G09G5/00G09G3/30
    • G09G3/3233G09G2300/0819G09G2300/0842G09G2310/0224G09G2310/0251G09G2320/0233G09G2320/0252G09G2320/043
    • An organic electroluminescent display device includes a plurality of pixels, each one of the plurality of pixels including: a switching transistor that is connected to a gate line and a data line; a driving transistor, wherein a data voltage of the data line passing through the switching transistor is reflected into a gate of the driving transistor; a sampling transistor that samples a threshold voltage of the driving transistor, wherein a gate of the sampling transistor is connected to a control line, and the sampled threshold voltage is reflected into the gate of the driving transistor; an initializing transistor, wherein a gate of the initializing transistor is connected to a previous or next gate line, and an initialization voltage passing through the initializing transistor is reflected into the gate of the driving transistor; and an organic light emitting diode that is connected to the driving transistor, wherein a driving current of the organic light emitting diode is adjusted according to a voltage of the gate of the driving transistor.
    • 有机电致发光显示装置包括多个像素,所述多个像素中的每一个包括:连接到栅极线和数据线的开关晶体管; 驱动晶体管,其中通过所述开关晶体管的数据线的数据电压被反射到所述驱动晶体管的栅极; 采样晶体管,其对所述驱动晶体管的阈值电压进行采样,其中所述采样晶体管的栅极连接到控制线,并且所述采样阈值电压被反射到所述驱动晶体管的栅极中; 初始化晶体管,其中初始化晶体管的栅极连接到先前或下一个栅极线,并且通过初始化晶体管的初始化电压被反射到驱动晶体管的栅极中; 以及连接到所述驱动晶体管的有机发光二极管,其中根据所述驱动晶体管的栅极的电压来调节所述有机发光二极管的驱动电流。
    • 19. 发明授权
    • Staged aluminum deposition process for filling vias
    • 分阶段铝沉积工艺用于填充过孔
    • US06660135B2
    • 2003-12-09
    • US10038199
    • 2001-12-21
    • Sang-Ho YuYonghwa Chris ChaMurali AbburiShri SinghviFufa Chen
    • Sang-Ho YuYonghwa Chris ChaMurali AbburiShri SinghviFufa Chen
    • C25C1434
    • H01L21/76882
    • A semiconductor metallization process for providing complete via fill on a substrate, free of voids, and a planar metal surface, free of grooves. In one aspect, a refractory layer is deposited onto a substrate having high aspect ratio contacts or vias formed thereon. A conformal PVD metal layer, such as Al or Cu, is then deposited onto the refractory layer at a pressure below about 1 milliTorr. The vias and/or contacts are then filled with metal, such as by reflowing additional metal deposited by physical vapor deposition on the conformal PVD metal layer. The process is preferably performed in an integrated processing system that includes a long throw PVD chamber, wherein a target and a substrate are separated by at least 100 mm, and a hot metal PVD chamber, also serving as a reflow chamber.
    • 一种半导体金属化工艺,用于在没有空隙的基板上提供完整的通孔填充,以及没有凹槽的平面金属表面。 在一个方面,将耐火层沉积在具有高比例接触或在其上形成的通孔的基底上。 然后将保形PVD金属层(例如Al或Cu)以低于约1毫托的压力沉积到耐火层上。 然后,通孔和/或触点用金属填充,例如通过将通过物理气相沉积沉积的附加金属回流到共形PVD金属层上。 该方法优选在包括长抛PVD室的集成处理系统中进行,其中靶和基板被分开至少100mm,以及也用作回流室的热金属PVD室。