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    • 14. 发明申请
    • Chalcogenide devices and materials having reduced germanium or telluruim content
    • 硫族化物装置和具有降低的锗或碲化物含量的材料
    • US20070034851A1
    • 2007-02-15
    • US11301211
    • 2005-12-12
    • Sergey KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • Sergey KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • H01L47/00
    • H01L45/06H01L45/1233H01L45/144H01L45/1625
    • A chalcogenide material and chalcogenide memory device exhibiting fast operation (short set pulse times) over an extended range of reset state resistances. Electrical devices containing the instant chalcogenide materials permit rapid transformations from the reset state to the set state for reset and set states having a high resistance ratio. The instant devices thus provide for high resistance contrast and improved readability of memory states while preserving fast operational speeds for the device. The chalcogenide materials include materials comprising Ge, Sb and Te in which the Ge and/or Te content is lean relative to the commonly used Ge2Sb2Te5 chalcogenide composition. In one embodiment, the atomic concentration of Ge is between 11% and 22%, the atomic concentration of Sb is between 22% and 65%, and the atomic concentration of Te is between 28% and 55%. In a preferred embodiment, the atomic concentration of Ge is between 15% and 18%, the atomic concentration of Sb is between 32% and 35%, and the atomic concentration of Te is between 48% and 51%.
    • 硫化物材料和硫族化物存储器件在复位状态电阻的延长范围内表现出快速操作(短脉冲时间)。 包含瞬时硫族化物材料的电气装置允许从复位状态到设定状态的快速转换以及具有高电阻比的置位状态。 因此,即时设备提供高电阻对比度和改善存储器状态的可读性,同时保持设备的快速操作速度。 硫属化物材料包括Ge,Sb和Te的材料,其中Ge和/或Te含量相对于通常使用的Ge 2 Sb 2 Te 5是稀的 硫族化合物组合物。 在一个实施方案中,Ge的原子浓度为11%至22%,Sb的原子浓度为22%至65%,Te的原子浓度为28%至55%。 在优选的实施方式中,Ge的原子浓度为15%〜18%,Sb的原子浓度为32%〜35%,Te的原子浓度为48%〜51%。
    • 18. 发明申请
    • Memory Device and Method of Making Same
    • 记忆体及其制作方法
    • US20110227027A1
    • 2011-09-22
    • US13039952
    • 2011-03-03
    • Wolodymyr CzubatyjTyler LowreySergey Kostylev
    • Wolodymyr CzubatyjTyler LowreySergey Kostylev
    • H01L45/00
    • G11C11/5678G11C11/56G11C13/0004H01L45/06H01L45/122H01L45/143H01L45/144H01L45/148
    • A radial memory device includes a phase-change material, a first electrode in electrical communication with the phase-change material, the first electrode having a substantially planar first area of electrical communication with the phase-change material. The radial memory device also includes a second electrode in electrical communication with the phase-change material, the second electrode having a second area of electrical communication with the phase-change material, the second area being laterally spacedly disposed from the first area and substantially circumscribing the first area.Further, a method of making a memory device is disclosed. The steps include depositing a first electrode, depositing a first insulator, configuring the first insulator to define a first opening. The first opening provides for a generally planar first contact of the first electrode. The method further including the steps of depositing a phase-change material, depositing a second insulator, configuring the second insulator, depositing a second electrode having a second contact laterally displaced from said first contact, and configuring said second electrode.
    • 径向存储器件包括相变材料,与相变材料电连通的第一电极,第一电极具有与相变材料电连通的基本平坦的第一区域。 所述径向存储装置还包括与所述相变材料电连通的第二电极,所述第二电极具有与所述相变材料电连通的第二区域,所述第二区域与所述第一区域横向间隔设置并且基本上限定 第一个区域。 此外,公开了一种制造存储器件的方法。 这些步骤包括沉积第一电极,沉积第一绝缘体,构成第一绝缘体以限定第一开口。 第一开口提供第一电极的大致平面的第一接触。 该方法还包括以下步骤:沉积相变材料,沉积第二绝缘体,构成第二绝缘体,沉积具有从所述第一触点横向移位的第二触点的第二电极,以及配置所述第二电极。