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    • 13. 发明授权
    • Electronic component and fabrication method thereof
    • 电子元件及其制造方法
    • US09287044B2
    • 2016-03-15
    • US13737504
    • 2013-01-09
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Hae Sock ChungByoung Hwa LeeEun Hyuk ChaeMin Cheol Park
    • H01G4/30H01G4/012H01G4/232
    • H01G4/012H01G4/232H01G4/30
    • There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness t1 and t2 of the first and second internal electrodes is 0.9 μm or less, while a roughness R1 of the first internal electrode is lower than a roughness R2 of the second internal electrode.
    • 提供了电子部件及其制造方法。 电子部件包括:陶瓷主体,其包括长度方向的端面,宽度方向的侧面和厚度方向的上下表面; 第一和第二外部电极分别形成在端面上; 分别形成在侧表面上的第三和第四外部电极; 第一内部电极,形成在陶瓷主体内并连接到第一和第二外部电极; 以及与第一内部电极交替配置的第二内部电极,同时具有介于其间的陶瓷层,并且与第三和第四外部电极连接,其中第一和第二内部电极的厚度t1和t2为0.9μm以下,而 第一内部电极的粗糙度R1低于第二内部电极的粗糙度R2。