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1. 发明授权

US11978595B2 Capacitor component including through-hole structure to increase capacitance 有权
公开(公告)号：US11978595B2
公开(公告)日：2024-05-07
申请号：US17712424
申请日：2022-04-04
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sang Jong Lee , Su Bong Jang , Min Cheol Park , Tae Ho Yun , Han Kim
IPC分类号： H01G4/248 , H01G4/232 , H01G4/30
CPC分类号： H01G4/248 , H01G4/232 , H01G4/30
摘要： A capacitor component includes a body having first surface and second surfaces opposing each other and including through-holes penetrating through the first surface and the second surface, a first electrode covering an inner wall of each of the plurality of through-holes, a first common electrode covering the first surface and connected to the first electrode, a dielectric layer surrounded by the first electrode in the through-hole, a second electrode surrounded by the dielectric layer in the through-hole, a second common electrode layer covering the second surface and connected to the second electrode, a first external electrode disposed on at least one of a plurality of side surfaces of the body and connected to the first common electrode layer, and a second external electrode disposed on at least one of the plurality of side surfaces of the body and connected to the second common electrode layer.

2. 发明授权

US11342124B2 Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor 有权
公开(公告)号：US11342124B2
公开(公告)日：2022-05-24
申请号：US17078364
申请日：2020-10-23
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Ghyu Ahn , Sang Soo Park , Min Cheol Park , Byoung Hwa Lee
IPC分类号： H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12
摘要： There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as 1/2 of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as 1/2 of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≤(B+C)/A≤1.745.

3. 发明授权

US10847320B2 Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor 有权
公开(公告)号：US10847320B2
公开(公告)日：2020-11-24
申请号：US16815684
申请日：2020-03-11
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Ghyu Ahn , Sang Soo Park , Min Cheol Park , Byoung Hwa Lee
IPC分类号： H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12
CPC分类号： H01G4/30 , H01G2/065 , H01G4/012 , H01G4/12
摘要： There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≤(B+C)/A≤1.745.

4. 发明授权

US10622154B2 Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor 有权
公开(公告)号：US10622154B2
公开(公告)日：2020-04-14
申请号：US16259560
申请日：2019-01-28
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Ghyu Ahn , Sang Soo Park , Min Cheol Park , Byoung Hwa Lee
IPC分类号： H01G4/30 , H01G4/06 , H01G4/012 , H01G4/12 , H01G2/06
CPC分类号： H01G4/30 , H01G2/065 , H01G4/012 , H01G4/12
摘要： There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≤(B+C)/A≤1.745.

5. 发明授权

US10446319B2 Multilayer ceramic capacitor and board having the same 有权
公开(公告)号：US10446319B2
公开(公告)日：2019-10-15
申请号：US15183133
申请日：2016-06-15
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Cheol Park , Young Ghyu Ahn
IPC分类号： H01G4/30 , H01G4/005 , H01G4/232 , H05K1/18 , H01G4/012 , H05K1/02 , H05K1/11 , H05K3/34
摘要： A multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers layered in a width direction of the ceramic body, and including an active region including first and second internal electrodes alternately disposed with at least one of the dielectric layers interposed therebetween and an ESR adjustment region including one or more third internal electrodes; and first, second and third external electrodes disposed on a mounting surface of the ceramic body to be spaced apart from each other in a length direction of the ceramic body, and a board having the same.

6. 发明授权

US10340086B2 Multilayer ceramic capacitor and board having the same 有权
公开(公告)号：US10340086B2
公开(公告)日：2019-07-02
申请号：US15865773
申请日：2018-01-09
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Byoung Hwa Lee , Kyo Kwang Lee , Min Cheol Park , Young Ghyu Ahn , Sang Soo Park
IPC分类号： H01G4/30 , H01G4/232 , H01G2/06 , H01G4/008 , H01G4/12 , H01G4/248 , H05K1/11 , H05K1/18 , H05K3/34
摘要： A multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044≤LG*log [1/AT]≤0.00150.

7. 发明授权

US09576728B2 Laminated chip electronic component, board for mounting the same, and packing unit thereof 有权
标题翻译：层叠芯片电子部件，用于安装其的基板及其包装单元
公开(公告)号：US09576728B2
公开(公告)日：2017-02-21
申请号：US13918512
申请日：2013-06-14
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Ghyu Ahn , Sang Soo Park , Min Cheol Park , Se Hwa Jeong
IPC分类号： H05K1/16 , H01G4/005 , H05K1/02 , H01G4/30
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611
摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.
摘要翻译：层叠芯片电子部件包括：陶瓷体，其包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的外部电极; 其中内部电极以相对的方式设置在其间插入电介质层的有源层以形成电容; 以及在有源层的厚度方向的上部和下部形成的上部和下部覆盖层，所述下部覆盖层的厚度大于上部覆盖层的厚度。

8. 发明授权

US09510443B2 Multilayer ceramic electronic component and board having the same 有权
标题翻译：多层陶瓷电子元器件和板有相同的
公开(公告)号：US09510443B2
公开(公告)日：2016-11-29
申请号：US14885949
申请日：2015-10-16
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Cheol Park , Sang Soo Park , Young Ghyu Ahn , Kyo Kwang Lee
IPC分类号： H05K1/03 , H01G4/30 , H01G4/012 , H01G4/232 , H01G4/12 , H05K1/18 , H01G2/06 , H05K3/34
CPC分类号： H05K1/0306 , H01G2/065 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/181 , H05K3/3442 , H05K2201/10015
摘要： A multilayer ceramic electronic component includes a ceramic body including dielectric layers; and first and second internal electrodes having at least one of the dielectric layers interposed therebetween. Each of the first internal electrodes includes a first electrode plate and a first lead connected to the first electrode plate, the first lead being exposed to a first surface of the ceramic body and having a bent shape. Each of the second internal electrodes includes a second electrode plate and a second lead connected to the second electrode plate, the second lead being exposed to a second surface of the ceramic body and having a bent shape. A portion of the first lead overlaps the second electrode plate, and a portion of the second lead overlaps the first electrode plate.
摘要翻译：多层陶瓷电子部件包括：包含电介质层的陶瓷体; 以及插入其间的至少一个电介质层的第一和第二内部电极。每个第一内部电极包括第一电极板和连接到第一电极板的第一引线，第一引线暴露于陶瓷体的第一表面并具有弯曲形状。每个第二内部电极包括第二电极板和连接到第二电极板的第二引线，第二引线暴露于陶瓷体的第二表面并具有弯曲形状。第一引线的一部分与第二电极板重叠，第二引线的一部分与第一电极板重叠。

9. 发明授权

US09466428B2 Multilayer ceramic capacitor and board having the same mounted thereon 有权
标题翻译：多层陶瓷电容器及其上安装的电路板
公开(公告)号：US09466428B2
公开(公告)日：2016-10-11
申请号：US14169449
申请日：2014-01-31
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Cheol Park , Sang Soo Park
IPC分类号： H01G4/40 , H01G4/30 , H01G4/008 , H01G4/12
CPC分类号： H01G4/40 , H01G4/0085 , H01G4/1227 , H01G4/30
摘要： There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers; a capacitor part including first and second internal electrodes formed in the ceramic body; a resistor part including a first internal connection conductor, a third internal connection conductor formed on one dielectric layer in the ceramic body and a second internal connection conductor, a fourth internal connection conductor formed on another dielectric layer in the ceramic body; first to fourth external electrodes formed on first and second main surfaces of the ceramic body; and a first connection terminal formed on first end surface of the ceramic body and a second connection terminal formed on second end surface of the ceramic body, wherein the capacitor part and the resistor part are connected to each other in series.
摘要翻译：提供了一种多层陶瓷电容器，包括：陶瓷体，其包括多个电介质层; 电容器部分，包括形成在所述陶瓷体中的第一和第二内部电极; 形成在陶瓷体的一个电介质层上的第三内部连接导体和第二内部连接导体的电阻部，形成在陶瓷体的另一个电介质层上的第四内部连接导体，形成在陶瓷体的第一和第二主表面上的第一至第四外部电极; 以及形成在陶瓷体的第一端面上的第一连接端子和形成在陶瓷体的第二端面上的第二连接端子，其中电容器部分和电阻器部分串联连接。

10. 发明授权

US09449766B2 Composite electronic component and board having the same 有权
标题翻译：复合电子部件和板具有相同的功能
公开(公告)号：US09449766B2
公开(公告)日：2016-09-20
申请号：US14456747
申请日：2014-08-11
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Ghyu Ahn , Byoung Hwa Lee , Sang Soo Park , Min Cheol Park
IPC分类号： H01G17/00 , H01G4/06 , H01G4/228 , H01F27/24 , H01G4/35 , H01F27/02 , H01F10/00 , H05K1/18 , H01F27/33 , H01G4/30 , H01F27/28 , H01F27/29 , H01F27/40 , H05K1/16
CPC分类号： H01G17/00 , H01F27/2804 , H01F27/292 , H01F27/40 , H01F2027/2809 , H01G4/06 , H01G4/228 , H01G4/30 , H01G4/35 , H05K1/162 , H05K1/165 , H05K1/181 , H05K2201/09672 , Y02P70/611
摘要： A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body and connected to the conductive pattern of the inductor; an output terminal including a first output terminal formed on a second end surface of the composite body and connected to the conductive pattern of the inductor and a second output terminal disposed on a second side surface of the composite body; and a ground terminal disposed on a first side surface of the composite body and connected to the internal electrodes of the capacitor.
摘要翻译：复合电子部件可以包括：复合体，其包括彼此耦合的电容器和电感器，所述电容器具有陶瓷体，所述陶瓷体叠置有介电层和彼此面对的电介质层的内部电极，所述电感器具有堆叠具有导电图案的磁性层的磁性体; 输入端子，设置在复合体的第一端面上并连接到电感器的导电图案; 输出端子，包括形成在复合体的第二端面上并连接到电感器的导电图案的第一输出端子和布置在复合体的第二侧表面上的第二输出端子; 以及接地端子，其配置在复合体的第一侧面上并与电容器的内部电极连接。

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