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    • 16. 发明申请
    • Polyester resin composition
    • 聚酯树脂组合物
    • US20060178481A1
    • 2006-08-10
    • US10555208
    • 2004-04-28
    • Hideo MatsuokaMitsushige HamaguchiToru Nishimura
    • Hideo MatsuokaMitsushige HamaguchiToru Nishimura
    • C08L27/12B29C65/00
    • C08L67/02C08L23/025C08L23/0815C08L67/03C08L81/04C08L101/06C08L2666/02
    • This invention is a polyester resin composition comprising 100 parts by weight of a resin composition consisting of 60 to 95 wt % of (a) a polyester resin and 5 to 40 wt % of (b) an olefin-based resin, and 0.5 to 30 parts by weight of (c) one or more resins selected from polyphenylene sulfide resins and liquid crystal resins, wherein said olefin-based resin (b) is composed of (b-1) a functional group-containing olefin copolymer having at least one kind of functional groups selected from carboxylic acid groups, carboxylic anhydride groups, carboxylic ester groups, metal carboxylate groups and epoxy groups and (b-2) an ethylene/a-olefin copolymer obtained by copolymerizing ethylene and an a-olefin with 3 to 20 carbon atoms; and the polyester resin (a) forms a continuous phase, while the olefin-based resin (b) is dispersed as particles with an average particle size of 0.01 to 2 μm in the composition. This invention provides a polyester resin composition having excellent flexibility and impact resistance in a low-temperature atmosphere, also having excellent flowability and chemicals resistance, and suitable for injection molding.
    • 本发明是一种聚酯树脂组合物,其包含100重量份由60至95重量%的(a)聚酯树脂和5至40重量%的(b)烯烃类树脂组成的树脂组合物和0.5至30重量份 (c)选自聚苯硫醚树脂和液晶树脂中的一种或多种树脂,其中所述烯烃类树脂(b)由(b-1)含有至少一种的含官能团的烯烃共聚物组成 选自羧酸基团,羧酸酐基团,羧酸酯基团,金属羧酸酯基团和环氧基团的官能团和(b-2)通过使乙烯和α-烯烃与3-20碳共聚而获得的乙烯/α-烯烃共聚物 原子 并且聚酯树脂(a)形成连续相,而烯烃类树脂(b)在组合物中作为平均粒径为0.01〜2μ​​m的颗粒分散。 本发明提供一种在低温气氛中具有优异的柔韧性和耐冲击性的聚酯树脂组合物,其流动性和耐化学性优异,适用于注射成型。
    • 18. 发明授权
    • Polyamide resin composition and process for producing the same
    • 聚酰胺树脂组合物及其制造方法
    • US06605655B1
    • 2003-08-12
    • US09509623
    • 2000-03-29
    • Koya KatoToru NishimuraToru Yamanaka
    • Koya KatoToru NishimuraToru Yamanaka
    • C08G6900
    • C08K9/04C08L77/00C08L77/06C08L23/00
    • Provided is a polyamide resin composition comprising a melt blend of (A) a polyamide resin, (B) a phyllosilicate, and (C) an olefin compound having a carboxylic acid anhydride group in the molecule or a polymer of the olefin compound, in which the phyllosilicate (B) has a reactive functional group bonded thereto and is such that the exchangeable metal ions existing in the inter layers are ion-exchanged with organic onium ions. The composition has a reduced inorganic ash content and has both high stiffness and high ductility. Optionally, the composition contains an inorganic filler apart from the phyllosilicate, an impact modifier, and a flame retardant, still having high stiffness and high ductility.
    • 提供一种聚酰胺树脂组合物,其包含(A)聚酰胺树脂,(B)页硅酸盐和(C)分子中具有羧酸酐基团的烯烃化合物或烯烃化合物的聚合物的熔融共混物,其中 页硅酸盐(B)具有与其结合的反应性官能团,使得存在于层间的交换性金属离子与有机鎓离子进行离子交换。 该组合物具有降低的无机灰分含量,具有高刚度和高延展性。 任选地,组合物含有除了页硅酸盐之外的无机填料,抗冲改性剂和阻燃剂,仍然具有高刚度和高延展性。
    • 19. 发明授权
    • Thermoplastic resin composition and sheets and cards made from the same
    • 热塑性树脂组合物和由其制成的片材和卡片
    • US06333113B2
    • 2001-12-25
    • US09051063
    • 1998-04-13
    • Ryuichi SugieToru NishimuraMotoki Hiratsuka
    • Ryuichi SugieToru NishimuraMotoki Hiratsuka
    • B32B2736
    • C08J5/18B32B3/30B32B27/36B32B38/06B32B2305/22B32B2425/00C08J2367/02Y10S428/90Y10T428/24372Y10T428/24479Y10T428/251Y10T428/2911Y10T428/31507Y10T428/31786
    • Cards which contain any one of the following thermoplastic resin compositions I to III in its material can be used as magnetic cards, IC cards, etc. since they are excellent in heat resistance, processability and embossability: a composition consisting of ingredients (A) and (B); a composition consisting of ingredients (A), (B) and (D); and a composition consisting of 100 parts by weight of one or more selected from the following ingredients (A), (B) and (D) and 2 to 25 parts by weight of the following ingredient (C), wherein ingredient (A) is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, wherein the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) is 1 or more; ingredient (B) is an aromatic polycarbonate; ingredient (C) is an inorganic sheet-like filler of 0.5 to 20 &mgr;m in average grain size; and ingredient (D) is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, wherein the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) is less than 1.
    • 在其材料中含有下列热塑性树脂组合物I至III中的任何一种的卡可以用作磁卡,IC卡等,因为它们具有优异的耐热性,加工性和压花性:由组分(A)和 (B); 由组分(A),(B)和(D)组成的组合物; 和由以下成分(A),(B)和(D)中选出的一种或多种的100重量份和以下成分(C)2〜25重量份组成的组合物,其中成分(A)为 由二羧酸成分与对苯二甲酸成分作为主要二羧酸成分的聚酯和作为主要二醇成分的乙二醇成分(I)和1,4-环己烷二甲醇成分(II)构成的聚酯,其中摩尔比(I)/(II) 的乙二醇组分(I)与1,4-环己烷二甲醇组分(II)的摩尔比为1以上; 成分(B)是芳族聚碳酸酯; 成分(C)是平均粒径为0.5〜20μm的无机片状填料, 成分(D)是以对苯二甲酸成分为主要二羧酸成分的二羧酸成分和乙二醇成分(I)和作为主要二醇成分的1,4-环己烷二甲醇成分(II)构成的聚酯,其中摩尔比( 乙二醇组分(I)至1,4-环己烷二甲醇组分(II)的I)/(II)小于1。