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11. 发明授权

US07122757B2 Contact sensor package structure 有权
标题翻译：接触传感器封装结构
公开(公告)号：US07122757B2
公开(公告)日：2006-10-17
申请号：US10868496
申请日：2004-06-14
申请人： Shih-Chang Lee , Cheng-Yin Lee , Yung-Li Lu , Ying-Tsai Yeh , Pei-Chi Lin
发明人： Shih-Chang Lee , Cheng-Yin Lee , Yung-Li Lu , Ying-Tsai Yeh , Pei-Chi Lin
IPC分类号： H03K17/975
CPC分类号： H03K17/975 , H03K17/98 , Y10T428/30
摘要： A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.
摘要翻译：接触传感器封装具有衬底，膜，密封剂和设置在衬底上的多个接触传感器。接触传感器设置在由基板，膜和密封剂限定的封闭空间内。接触传感器封装还具有至少形成在基板上的接地导电迹线和形成在膜的表面上并电连接到接地导电迹线的静电电荷耗散层。静电电荷耗散层具有作为用于检测接触工件的接触面的上表面。

12. 发明授权

US07019407B2 Flip chip package structure 有权
标题翻译：倒装芯片封装结构
公开(公告)号：US07019407B2
公开(公告)日：2006-03-28
申请号：US10707609
申请日：2003-12-24
申请人： Yu-Wen Chen , Ming-Lun Ho , Shih-Chang Lee , Chih-Huang Chang
发明人： Yu-Wen Chen , Ming-Lun Ho , Shih-Chang Lee , Chih-Huang Chang
IPC分类号： H01L23/48
CPC分类号： H05K3/3436 , H01L23/49816 , H01L23/49838 , H01L24/13 , H01L24/14 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/1403 , H01L2224/16225 , H01L2224/16237 , H01L2224/81136 , H01L2224/81194 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/112 , H05K2201/094 , H05K2201/09472 , H05K2201/09518 , H05K2201/10674 , Y02P70/613 , H01L2224/05599
摘要： A flip chip package structure comprising a chip, a substrate, at least a first bump and a plurality of second bumps is provided. The chip has a first bump-positioning region and the substrate has a second bump-positioning region. The substrate has at least a first hole and multiple second holes. The first hole and the second holes are located within the second bump-positioning region. The first hole has a depth greater than that of the second hole. The first bump is set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The first bump is bonded to the substrate through the first holes. The second bumps are set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The second bumps are bonded to the substrate through the second holes. The first bump has a volume greater than the volume of the second bump.
摘要翻译：提供了包括芯片，基板，至少第一凸块和多个第二凸块的倒装芯片封装结构。芯片具有第一凸块定位区域，并且基板具有第二凸起定位区域。衬底具有至少第一孔和多个第二孔。第一孔和第二孔位于第二凸起定位区域内。第一孔的深度大于第二孔的深度。第一凸块设置在芯片的第一凸点定位区域和衬底的第二凸起定位区域之间。第一凸起通过第一孔结合到基底。在芯片的第一凸块定位区域和基板的第二凸块定位区域之间设置第二凸块。第二凸起通过第二孔结合到基底。第一凸起的体积大于第二凸块的体积。

13. 发明授权

US07002805B2 Thermal enhance MCM package and manufacturing method thereof 有权
标题翻译：热增强MCM封装及其制造方法
公开(公告)号：US07002805B2
公开(公告)日：2006-02-21
申请号：US10747037
申请日：2003-12-30
申请人： Shih-Chang Lee , Su Tao , Chian-Chi Lin
发明人： Shih-Chang Lee , Su Tao , Chian-Chi Lin
IPC分类号： H05K7/20
CPC分类号： H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/1023 , H01L2225/107 , H01L2225/1082 , H01L2225/1094 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/15331 , H01L2924/16152 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the second carrier are electrically connected to the first package and the second package respectively. The second package is accommodated in the opening and electrically connected to the first package via the first carrier, the second carrier and the intermediate carrier. The cap-like heat spreader has a supporting portion and an alignment portion wherein the supporting portion is connected to the alignment portion to define a cavity. The cavity not only accommodates the first package, the first carrier, the second package, the second carrier and the intermediate substrate but also provides alignment mechanism by the supporting portion and the alignment portion to prevent the dislocation after all the components of the thermal enhance MCM package are connected with each other. Furthermore, the first carrier has a first side and the second carrier has a second side. The first side and the second side both have grounding portions, for example recessed portions and metal layers, for providing a ground shielding of the first package and the second package against the outside. In addition, the grounding portions also provide thermal paths to increase the ability of the heat dissipation. Besides, a method for manufacturing the thermal enhance MCM package is provided.
摘要翻译：热增强多芯片模块（MCM）封装主要包括第一封装，第一载体，第二封装，第二载体，中间基板和帽状散热器。中间基板具有开口。第一载体和第二载体分别电连接到第一封装和第二封装。第二包装被容纳在开口中并且经由第一载体，第二载体和中间载体电连接到第一封装。帽状散热器具有支撑部分和对准部分，其中支撑部分连接到对准部分以限定空腔。空腔不仅容纳第一封装，第一载体，第二封装，第二载体和中间基板，而且还通过支撑部分和对准部分提供对准机构，以防止在热增强MCM的所有部件的所有部件之后的位错包装相互连接。此外，第一载体具有第一侧，第二载体具有第二侧。第一侧和第二侧都具有接地部分，例如凹部和金属层，用于提供第一包装和第二包装的接地屏蔽抵抗外部。此外，接地部分还提供热路径以增加散热能力。此外，还提供了一种用于制造热增强MCM封装的方法。

14. 发明申请

US20050274597A1 Contact sensor package structure 有权
标题翻译：接触传感器封装结构
公开(公告)号：US20050274597A1
公开(公告)日：2005-12-15
申请号：US10868496
申请日：2004-06-14
申请人： Shih-Chang Lee , Cheng-Yin Lee , Yung-Li Lu , Ying-Tsai Yeh , Pei-Chi Lin
发明人： Shih-Chang Lee , Cheng-Yin Lee , Yung-Li Lu , Ying-Tsai Yeh , Pei-Chi Lin
IPC分类号： H03K17/975
CPC分类号： H03K17/975 , H03K17/98 , Y10T428/30
摘要： A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.
摘要翻译：接触传感器封装具有衬底，膜，密封剂和设置在衬底上的多个接触传感器。接触传感器设置在由基板，膜和密封剂限定的封闭空间内。接触传感器封装还具有至少形成在基板上的接地导电迹线和形成在膜的表面上并电连接到接地导电迹线的静电电荷耗散层。静电电荷耗散层具有作为用于检测接触工件的接触面的上表面。

15. 发明授权

US06815833B2 Flip chip package 有权
公开(公告)号：US06815833B2
公开(公告)日：2004-11-09
申请号：US10657230
申请日：2003-09-09
申请人： Shih-Chang Lee , Gwo-Liang Weng , Wei-Chang Tai , Cheng-Yin Lee
发明人： Shih-Chang Lee , Gwo-Liang Weng , Wei-Chang Tai , Cheng-Yin Lee
IPC分类号： H01L2348
CPC分类号： H01L23/433 , H01L23/3114 , H01L23/4334 , H01L23/49503 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16245 , H01L2224/45099 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/18161 , H01L2924/3011 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2924/00012
摘要： A flip chip package mainly comprises a chip, a leadless lead frame. The leadless lead frame has a die paddle and a plurality of leads. The active surface of the chip has a plurality of bonding pads formed thereon. Besides, a plurality of bumps formed on the bonding pads are electrically connected to the chip, the leads and the die paddle. Therein, the die paddle electrically connected to the chip via the bumps not only prevents the chip from being dislocated but also provides another grounding and heat transmission paths to enhance the electrical, thermal and mechanical performance of the flip chip package. Similarly, the bumps formed on the bonding pads of the chip are electrically connected to the leads so as to fix the chip to the lead frame more securely.

16. 发明授权

US06624004B2 Flip chip interconnected structure and a fabrication method thereof 有权
公开(公告)号：US06624004B2
公开(公告)日：2003-09-23
申请号：US10177898
申请日：2002-06-20
申请人： Shih-Chang Lee
发明人： Shih-Chang Lee
IPC分类号： H01L2144
CPC分类号： H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2924/00014 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/3511 , H05K3/284 , H05K3/3436 , H05K2201/094 , H05K2201/10674 , H05K2201/10977 , H05K2201/10992 , H05K2203/0465 , Y02P70/613 , H01L2924/00 , H01L2224/05599
摘要： A flip chip interconnected structure comprises a chip having an active surface in which a plurality of bonding pads are formed on the active surface of the chip. A substrate has a surface and a chip locating region. The chip locating region is on the surface of the substrate and a plurality of nodes are formed on the chip locating region. A plurality of solder balls are respectively connected to the bonding pads and the nodes. The solder balls have various sizes. The chip is bonded to the chip locating region of the substrate by the solder balls.

17. 发明申请

US20120019158A1 Polarity-reversible dimming controller having function of switching light source 审中-公开
标题翻译：具有切换光源功能的极性可逆调光控制器
公开(公告)号：US20120019158A1
公开(公告)日：2012-01-26
申请号：US12804493
申请日：2010-07-22
申请人： Chung-Shu Lee , Shih-Chang Lee , Chih-Kuan Lin , Chao-Ching Hsu
发明人： Chung-Shu Lee , Shih-Chang Lee , Chih-Kuan Lin , Chao-Ching Hsu
IPC分类号： H05B37/02
CPC分类号： H05B33/0884 , H05B33/0851
摘要： A polarity-reversible dimming controller having function of switching light source has a power supply module and a dimming control module. The dimming control module receives an external PWM dimming signal to control a feedback signal of the power supply module so as to dim or power on/off an LED lamp. The dimming control module has an output current switching circuit, a switch control circuit and a dimming control circuit. The output current switching circuit performs a PWM control over a current outputted from the power supply module by using the external PWM dimming signal to maintain chromacity of the LED lamp as a constant. The switch control circuit turns off the PWM controller to enter a standby mode for saving power once the PWM dimming signal exceeds a threshold value. As a full-wave rectification is performed on the PWM dimming signal, the polarity match issue upon assembling can be disregarded.
摘要翻译：具有切换光源功能的极性可逆调光控制器具有电源模块和调光控制模块。调光控制模块接收外部PWM调光信号，以控制电源模块的反馈信号，以使LED灯变暗或加电。调光控制模块具有输出电流切换电路，开关控制电路和调光控制电路。输出电流切换电路通过使用外部PWM调光信号对从电源模块输出的电流进行PWM控制，以将LED灯的色度维持为常数。一旦PWM调光信号超过阈值，开关控制电路关闭PWM控制器进入待机模式，以节省电力。由于对PWM调光信号进行全波整流，因此可以忽略组装时的极性匹配问题。

18. 发明申请

US20110083729A1 Multi-Junction Solar Cell 审中-公开
标题翻译：多功能太阳能电池
公开(公告)号：US20110083729A1
公开(公告)日：2011-04-14
申请号：US12896824
申请日：2010-10-01
申请人： Shih-Chang Lee , Yi-Chieh Lin
发明人： Shih-Chang Lee , Yi-Chieh Lin
IPC分类号： H01L31/06
CPC分类号： H01L31/0687 , Y02E10/544
摘要： A solar cell includes a substrate; a buffer layer located on the substrate; a SixGe(1-x) bottom cell located on the buffer layer; a first tunneling layer located on the SixGe(1-x) bottom cell; a GaNyAs(1-y) middle cell located on the first tunneling layer; a second tunneling cell located on the GaNyAs(1-y) middle cell; a GazIn(1-z)P top cell located on the second tunneling layer; and a contact layer located on the GazIn(1-z)P top cell.
摘要翻译：太阳能电池包括基板; 位于所述基板上的缓冲层; 位于缓冲层上的SixGe（1-x）底单元; 位于SixGe（1-x）底部单元上的第一隧道层; 位于第一隧穿层上的GaNyAs（1-y）中间电池; 位于GaN yAs（1-y）中间单元上的第二隧道单元; 位于第二隧道层上的GazIn（1-z）P顶部单元; 以及位于GazIn（1-z）P顶部电池上的接触层。

19. 发明申请

US20110058392A1 CURRENT-SHARING POWER SUPPLY APPARATUS 审中-公开
标题翻译：电流共享电源设备
公开(公告)号：US20110058392A1
公开(公告)日：2011-03-10
申请号：US12554856
申请日：2009-09-04
申请人： Shih-Chang Lee , Chung-Shu Lee
发明人： Shih-Chang Lee , Chung-Shu Lee
IPC分类号： H02M3/335
CPC分类号： H02M3/33569 , Y02B70/1433
摘要： A current-sharing power supply apparatus includes a conversion circuit, a square-wave generating circuit, a resonant circuit, a rectifier circuit, and a filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and at least one secondary winding. More particularly, two secondary windings of the two transformers are electrically connected in series. The square-wave generating circuit is electrically connected to a DC voltage to switch the DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier circuit has at least two switch components, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a rectified voltage, and the rectified voltage is outputted to at least one voltage output terminal.
摘要翻译：分流电源装置包括转换电路，方波发生电路，谐振电路，整流电路和滤波电路。转换电路具有两个变压器，并且每个变压器具有初级绕组和至少一个次级绕组。更具体地，两个变压器的两个次级绕组串联电连接。方波发生电路与直流电压电连接，将直流电压切换成脉动电压。谐振电路电连接到方波发生电路，并且具有第一电容器和变压器的初级绕组。整流电路具有至少两个开关部件，与变压器的次级绕组电连接，将交流输出电压整流为整流电压，整流电压输出至少一个电压输出端子。

20. 发明授权

US07195956B2 Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units 有权
标题翻译：在具有有缺陷的承载单元的半导体封装的组装期间平衡模制流动的方法
公开(公告)号：US07195956B2
公开(公告)日：2007-03-27
申请号：US11140054
申请日：2005-05-27
申请人： Gwo-Liang Weng , Shih-Chang Lee , Wei-Chang Tai
发明人： Gwo-Liang Weng , Shih-Chang Lee , Wei-Chang Tai
IPC分类号： H01L21/00
CPC分类号： H01L21/561 , H01L21/565 , H01L23/3121 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/16225 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01082 , H01L2924/181 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/0665 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for balancing molding flow during the assembly of semiconductor packages with defective carrying units includes providing a chip carrier, which includes a number of good carrying units and at least a defective carrying unit. Then, a number of chips are attached to the good carrying units of the chip carrier, and a chip-imitative glue is formed on the defective carrying unit of the chip carrier. Next, a molding compound is formed on the chip carrier via molding to seal the chips and the chip-imitative glue, thereby improving the balance of molding flow.
摘要翻译：在具有有缺陷的携带单元的半导体封装的组装期间，用于平衡模制流动的方法包括提供包括多个良好的承载单元和至少一个有缺陷的承载单元的芯片载体。然后，将多个芯片附着到芯片载体的良好承载单元，并且在芯片载体的有缺陷的承载单元上形成芯片模拟胶。接下来，通过模制在芯片载体上形成模塑料以密封芯片和芯片模塑胶，从而改善模制流程的平衡。

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