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    • 14. 发明授权
    • Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
    • 用于光纤通信设备的集成封装系统,提供与光纤的自动对准
    • US07380994B2
    • 2008-06-03
    • US10932539
    • 2004-09-01
    • Kirk S. GiboneyPaul K. RosenbergAlbert T. Yuen
    • Kirk S. GiboneyPaul K. RosenbergAlbert T. Yuen
    • G02B6/36
    • G02B6/4249G02B6/4201G02B6/4228G02B6/4269G02B6/428G02B6/4281G02B6/4283G02B6/4292
    • An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.
    • 一种集成的包装系统,包括一体的机械支撑件,印刷电路板和光通信装置。 机械支撑件包括第一支撑元件和第二支撑元件。 第一支撑元件与第二支撑元件成非零角度延伸。 印刷电路板包括分别与第一支撑元件和第二支撑元件接触的第一部分和第二部分。 光通信设备机械耦合到机械支撑件的第一支撑元件并且电连接到印刷电路板的第一部分。 综合包装系统优选地在光通信设备与光学元件和光纤之一或两者之间自动对准。 在这种情况下,第一支撑元件包括装置对准特征。 设备对准特征和光通信设备相对于彼此具有限定的位置关系。 或者,系统可以另外包括盖组件,其包括包括装置对准特征的盖。 所述盖在第一支撑元件处机械联接到装置对准特征和光通信装置相对于彼此具有预定位置关系的位置。
    • 15. 发明授权
    • Optical subassembly for use in fiber optic data transmission and reception
    • 用于光纤数据传输和接收的光学子组件
    • US06203212B1
    • 2001-03-20
    • US09138827
    • 1998-08-24
    • Paul K. RosenbergAlbert T. YuenKirk S. Giboney
    • Paul K. RosenbergAlbert T. YuenKirk S. Giboney
    • G02B636
    • G02B6/4201G02B6/4228G02B6/4246G02B6/4249G02B6/4255G02B6/4281G02B6/4283G02B6/4292
    • An optical subassembly and a method of fabricating the same utilize a subassembly body that is formed by molding the subassembly body onto a substrate. Preferably, the subassembly body is constructed of a plastic material that can be molded into a precise shape. The subassembly body and the substrate become an integral unit when the molded plastic material is polymerized. The optical subassembly includes the subassembly body, the substrate, an optical element, an optoelectronic device, and a transmitter or receiver integrated circuit (IC) chip. The optoelectronic device and the transmitter/receiver IC chip are affixed to the substrate. Preferably, the substrate is a flexible circuit having a number of electrical traces. The flexible circuit may be composed of a polymer material. The optoelectronic device is positioned on the substrate such that the optoelectronic device is located within an opening in the subassembly body. The opening may become an enclosed cavity when the optical element is attached to the subassembly body.
    • 光学子组件及其制造方法利用通过将子组件本体模制到衬底上而形成的子组件本体。 优选地,组件主体由可以模制成精确形状的塑料材料构成。 当模制的塑料材料聚合时,组件主体和基板成为整体单元。 光学子组件包括子组件本体,衬底,光学元件,光电子器件以及发射器或接收器集成电路(IC)芯片。 光电器件和发射器/接收器IC芯片固定在基板上。 优选地,衬底是具有多个电迹线的柔性电路。 柔性电路可以由聚合物材料构成。 光电子器件位于衬底上,使得光电器件位于组件主体的开口内。 当光学元件附接到子组件主体时,开口可以变成封闭空腔。
    • 17. 发明授权
    • N-drive or P-drive VCSEL array
    • N驱动或P驱动VCSEL阵列
    • US6069908A
    • 2000-05-30
    • US20724
    • 1998-02-09
    • Albert T. YuenMichael R. T. TanChun Lei
    • Albert T. YuenMichael R. T. TanChun Lei
    • H01S5/00H01S5/02H01S5/042H01S5/183H01S5/187H01S5/42H01S3/19
    • H01S5/183H01S5/423H01S5/0208H01S5/0422
    • A VCSEL that is adapted to the fabrication of an array of VCSELs. A VCSEL array according to the present invention includes first and second VCSELs for generating light of a predetermined wavelength. Each VCSEL includes a bottom reflector comprising an epitaxial layer of a semiconductor of a first conductivity type, a light generation region and a top reflector comprising a semiconductor of a second conductivity type. A bottom electrode is electrically connected to the bottom reflector, and a top electrode is electrically connected to the top reflector. The bottom electrode is grown on top of a buffer layer having an electrical conductivity less than a predetermined value and a crystalline structure that permits epitaxial growth of the bottom reflector on the buffer layer. The buffer layer may be grown on top of a substrate or be the substrate itself in the case in which a substrate having sufficiently low conductivity is utilized. The bottom reflector of each of the VCSELs is in contact with the top of the buffer layer. The first and second VCSELs are electrically isolated from one another by a trench extending into the buffer layer. The buffer layer is constructed from a material having resistivity that is sufficiently low to prevent cross-talk between the first and second VCSELs.
    • 适用于制造VCSEL阵列的VCSEL。 根据本发明的VCSEL阵列包括用于产生预定波长的光的第一和第二VCSEL。 每个VCSEL包括底部反射器,其包括第一导电类型的半导体的外延层,发光区域和包括第二导电类型的半导体的顶部反射器。 底部电极电连接到底部反射器,并且顶部电极电连接到顶部反射器。 底部电极生长在具有小于预定值的电导率的缓冲层的顶部上,并且允许底部反射器在缓冲层上外延生长的晶体结构。 在使用具有足够低的导电性的基板的情况下,可以在衬底的顶部生长缓冲层或者作为衬底本身。 每个VCSEL的底部反射器与缓冲层的顶部接触。 第一和第二VCSEL通过延伸到缓冲层中的沟槽彼此电隔离。 缓冲层由具有足够低的电阻率的材料构成,以防止第一和第二VCSEL之间的串扰。
    • 19. 发明授权
    • Connector housing for fiber-optic module
    • 光纤模块连接器外壳
    • US06682228B2
    • 2004-01-27
    • US10080171
    • 2002-02-19
    • Lakshman RathnamAlbert T. Yuen
    • Lakshman RathnamAlbert T. Yuen
    • G02B638
    • G02B6/3869G02B6/3821G02B6/3825G02B6/389G02B6/3897
    • A connector housing for a connector to an optical device includes: a body with a bottom wall, a first side wall with a first lip, a second side wall with a second lip, where optical fibers may reside within the bottom, first side, and second side walls, where the first and second lips engage the optical fibers when residing within the bottom, first, and second side walls, where the first and second lips assist in preventing the optical fibers from being removed from the body; a spring coupled to the body and the optical fibers; and a sleeve coupled to the body, including a locking feature for locking the body to the optical device. The connector housing is compact in size, allowing larger numbers of fiber-optic modules to reside on a printed circuit board, increasing its density for optical devices. A connector with the connector housing is also more cost effective to manufacture.
    • 用于连接器到光学装置的连接器壳体包括:具有底壁的本体,具有第一唇缘的第一侧壁,具有第二唇缘的第二侧壁,其中光纤可以位于底部,第一侧和 第二侧壁,其中当居住在底部,第一和第二侧壁内时,第一和第二唇部接合光纤,其中第一和第二唇部协助防止光纤从身体移除; 耦合到身体和光纤的弹簧; 以及联接到所述主体的套筒,包括用于将所述主体锁定到所述光学装置的锁定特征。 连接器外壳尺寸紧凑,允许更多数量的光纤模块驻留在印刷电路板上,从而增加其光学器件的密度。 具有连接器壳体的连接器也是制造成本更高的成本。
    • 20. 发明授权
    • Modular fiber-optic transceiver
    • 模块化光纤收发器
    • US06583902B1
    • 2003-06-24
    • US09459421
    • 1999-12-09
    • Albert T. Yuen
    • Albert T. Yuen
    • H04B1000
    • H04B10/40G02B6/4246G02B6/4257G02B6/426G02B6/4269G02B6/4277G02B6/4278G02B6/4292
    • A modular fiber-optic transceiver has an optoelectronic subassembly stack assembled in the beam direction and parallel to the plane of the mounting site. The subassembly is formed in various combinations of individually designed building modules for aligning, focusing, optoelectronic processing and eventual cooling. The subassembly is electrically conductive connected to a transceiver board and kept in perpendicular orientation to it by a snap fitting housing. The housing holds the cable plug of the fiber cable in position and transmits thereby the peripheral imposed mechanical load directly onto the mounting site. The modular building concept supports various techniques for fiber optic data transmission.
    • 模块化光纤收发器具有沿光束方向组装并且平行于安装位置的平面的光电子组件堆叠。 子组件形成为用于对准,聚焦,光电子处理和最终冷却的单独设计的建筑模块的各种组合。 子组件导电连接到收发器板并通过卡扣配合壳体保持与其垂直取向。 壳体将光纤电缆的电缆插头保持就位,从而将周边施加的机械负载直接传输到安装位置。 模块化建筑概念支持光纤数据传输的各种技术。