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11. 发明授权

US4975825A Stacked power converter 失效
标题翻译：堆叠式电源转换器
公开(公告)号：US4975825A
公开(公告)日：1990-12-04
申请号：US466067
申请日：1990-01-16
申请人： John Huss , Richard J. Hoppe , Lawrence E. Crowe , Thomas Sutrina , Eric D. Lakin
发明人： John Huss , Richard J. Hoppe , Lawrence E. Crowe , Thomas Sutrina , Eric D. Lakin
IPC分类号： H01L25/11 , H02K11/04 , H02M7/00 , H05K1/02 , H05K1/14
CPC分类号： H02M7/003 , H01L25/112 , H02K11/046 , H05K1/144 , H01L2924/0002 , H05K1/0201 , H05K1/0263
摘要： A power converter comprises a plurality of modular circuit boards assembled in a stacked relationship. The circuit boards include heat exchangers which are interconnected and cooling fluid is provided thereto to remove heat generated by high power devices.
摘要翻译：功率转换器包括以堆叠关系组装的多个模块化电路板。电路板包括互连的热交换器，并且向其提供冷却流体以去除由高功率器件产生的热量。

12. 发明授权

US4956696A Compression loaded semiconductor device 失效
标题翻译：压缩负载半导体器件
公开(公告)号：US4956696A
公开(公告)日：1990-09-11
申请号：US397831
申请日：1989-08-24
申请人： Richard J. Hoppe , Steven E. Jackson , William K. Anderson
发明人： Richard J. Hoppe , Steven E. Jackson , William K. Anderson
IPC分类号： H01L23/051 , H01L23/48
CPC分类号： H01L23/051 , H01L24/72 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01082 , H01L2924/1305
摘要： A compression loaded semiconductor device package (40) in accordance with the invention includes a cylindrical semiconductor device (54) having a first region (66) on a first face, a control region (68) on the first face having a central portion (70) and a plurality of projections (72) extending radially from the central portion with the radial projections being symmetrically disposed around the periphery of the first face and a second region (74) on a second face with the second face being opposed to the first face; an electrically conductive contract (48) having an external control terminal (88), an annulus (84) electrically connected to the external control terminal, a plurality of projections (82) electrically connected to the annulus, projecting radially inward and a center (80) electrically connected to the radially inward projections and to the control region; and first and second annular insulators (112 and 114) each insulator having a plurality of faces, the upper cover being bonded to a first face (116) of the first insulator, a second face of the first insulator being bonded to a first attachment ring (122) with the first attachment ring being bonded to the annulus, the lower cover being bonded to a first face (116) of the second insulator, a second face (118) of the second insulator being bonded to a second attachment ring (124) with the second attachment ring being bonded to the annulus, the bonds (120) defining a sealed chamber containing the semiconductor device.
摘要翻译：根据本发明的压缩负载半导体器件封装（40）包括：圆柱形半导体器件（54），其在第一面上具有第一区域（66）;第一面上的控制区域（68）具有中心部分（70））和从中心部分径向延伸的多个突起（72），其中径向突起围绕第一面的周边对称设置，第二区域（74）位于第二面上，第二面与第一面相对 ; 具有外部控制端子（88）的导电性接合件（48），与外部控制端子电连接的环形部分（84），与环形部分电连接的多个突起（82），径向向内突出并且具有中心）电连接到径向向内的突起和控制区域; 以及第一和第二环形绝缘体（112和114），每个绝缘体具有多个面，所述上盖接合到所述第一绝缘体的第一面（116），所述第一绝缘体的第二面接合到第一附接环（122），其中所述第一连接环接合到所述环形空间，所述下盖接合到所述第二绝缘体的第一面（116），所述第二绝缘体的第二面（118）被接合到第二附接环（124）），其中所述第二附接环接合到所述环形空间，所述接合（120）限定包含所述半导体器件的密封室。

13. 发明授权

US4947287A Capacitor cooling arrangement 失效
标题翻译：电容冷却装置
公开(公告)号：US4947287A
公开(公告)日：1990-08-07
申请号：US277945
申请日：1988-11-30
申请人： Richard J. Hoppe
发明人： Richard J. Hoppe
IPC分类号： H01G4/12 , H01C20060101 , H01G2/08 , H01G4/10 , H05K7/20
CPC分类号： H01G2/08 , H01G4/12 , H01G4/30
摘要： A cooling arrangement is provided for capacitor chips (10) or a capacitor assembly (40). A metal foil (18,18',18",18'") is affixed to a chip (10) with electrical insulation therebetween. The foil (18,18',18",18'") has a free end extending beyond the capacitor periphery and transversely of the capacitor stack (13) and can be provided with an L-shaped end (21) or a tube heat exchanger (23) or a fin plate heat exchanger (24). An assembly (40) of capacitors (30 to 38) can be arranged between legs of U-shaped metal heat exchange members (25,26,27) which conduct heat from the capacitors (30 to 38) through the legs and to a coolplate (28) having a tube (29) for passage of coolant.
摘要翻译：为电容器芯片（10）或电容器组件（40）提供冷却装置。金属箔（18,18'，18“，18”'）固定到芯片（10）上，其间具有电绝缘。箔片（18,18'，18“，18”）具有延伸超过电容器外围并横向于电容器叠层（13）的自由端，并且可以设置有L形端部（21）或管式热交换器（23）或散热片热交换器（24）。电容器（30至38）的组件（40）可以布置在U形金属热交换构件（25,26,27）的腿之间，U形金属热交换构件（25,26,27）从电容器（30至38）穿过支腿传导热量，（28）具有用于冷却剂通过的管（29）。

14. 发明授权

US4928138A Power supply with integral filter and cooling device 失效
标题翻译：电源带集成过滤器和冷却装置
公开(公告)号：US4928138A
公开(公告)日：1990-05-22
申请号：US374136
申请日：1989-06-30
申请人： Derek N. Walton , Richard J. Hoppe
发明人： Derek N. Walton , Richard J. Hoppe
IPC分类号： H01F27/08 , H01F27/22 , H02M1/12
CPC分类号： H01F27/085 , H01F27/22 , H02M1/12
摘要： A power supply in accordance with the present invention includes a chassis (26) associated with the power supply; a voltage source (12) providing an output voltage varying at a fundamental frequency and having a noise component changing as a function of time at a frequency above the fundamental frequency; a filter (41) including an inductance (44) in series with the voltage source for attenuating the noise component and outputting the fundamental frequency; and a cooling apparatus (42) thermally and capacitively coupled to the inductor for conducting heat from the inductor and shunting the noise component to the chassis.
摘要翻译：根据本发明的电源包括与电源相关联的底盘（26）; 电压源（12），其提供在基频处变化的输出电压，并且具有以基频以上的频率作为时间的函数变化的噪声分量; 滤波器（41），包括与电压源串联的电感（44），用于衰减噪声分量并输出基频; 以及冷却装置（42），其热和电容耦合到所述电感器以传导来自所述电感器的热量并将所述噪声部件分流到所述底盘。

15. 发明授权

US4581695A Rectifier assembly 失效
标题翻译：整流器总成
公开(公告)号：US4581695A
公开(公告)日：1986-04-08
申请号：US682271
申请日：1984-12-12
申请人： Richard J. Hoppe
发明人： Richard J. Hoppe
IPC分类号： H02K19/36 , H02K11/04 , H02M1/00 , H02K11/00
CPC分类号： H02K11/042
摘要： Resistance to centrifugally acting forces in an axially and radially compact rectifier assembly particularly suited for mounting in a rotary component of a dynamoelectric machine is achieved in a full wave, three phase rectifier assembly. The assembly includes first and second blocks 18, 20, each having three radially outwardly facing diode receiving surfaces 22, 24, 26. Six diode wafers 28 are located on the surfaces and are sandwiched thereagainst by six electrically conductive load shoes 40. Three phase conductors 54 are interposed between the load shoes 40 and a shrink fitted cylindrical housing 10 and electrically connect aligned load shoes 40 associated with each of the blocks 18 and 20.
摘要翻译：在全波三相整流器组件中实现了在轴向和径向紧凑的整流器组件中对离心作用力的抵抗力，特别适用于安装在电动机的旋转部件中。该组件包括第一和第二块18,20，每个具有三个径向向外的二极管接收表面22,24,26。六个二极管晶片28位于表面上并由六个导电负载靴40夹在其上。三相导体 54夹在负载靴40和收缩配合圆柱形壳体10之间，并且电连接与块18和20中的每一个相关联的对准的负载靴40。

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