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11. 发明申请

US20100284124A1 CAPACITOR ASSEMBLY AND ASSOCIATED METHOD 有权
标题翻译：电容器组装及相关方法
公开(公告)号：US20100284124A1
公开(公告)日：2010-11-11
申请号：US12436392
申请日：2009-05-06
申请人： Rajesh V. Iyer
发明人： Rajesh V. Iyer
IPC分类号： H01G4/35
CPC分类号： H01G2/20 , A61N1/3754 , H01G2/106 , H01G4/236 , H01G4/35 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49004
摘要： A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member.
摘要翻译：一种电容器组件，用于组装滤波后的馈通。电容器包括固定地附接到其底部的绝缘构件，以抑制高电压电弧。存在于电容器的内径和外径上的端接材料不存在靠近底部的电容器的一部分，例如在绝缘构件上。

12. 发明申请

US20100179606A1 CAPACITOR FOR FILTERED FEEDTHROUGH WITH ANNULAR MEMBER 有权
标题翻译：电容器通过与会员进行过滤
公开(公告)号：US20100179606A1
公开(公告)日：2010-07-15
申请号：US12571051
申请日：2009-09-30
申请人： Rajesh V. Iyer
发明人： Rajesh V. Iyer
IPC分类号： A61N1/375 , H01G4/35 , H01R43/00
CPC分类号： A61N1/3754 , H01G4/35 , Y10T29/49002
摘要： A filtered feedthrough assembly includes a capacitor comprising a top portion, a bottom portion, an outer diameter portion and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion. A conductive annular member is placed onto the top portion around the at least one aperture. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material.
摘要翻译：滤波后的馈通组件包括一个包括顶部，底部，外径部分和内径部分的电容器。内径部分限定从顶部延伸到底部的至少一个孔。导电环形构件被放置在围绕所述至少一个孔的顶部上。馈通销延伸穿过每个孔，并且通过在导电材料的导电焊盘上施加焊料预制件而被焊接到电容器的内径部分。

13. 发明申请

US20100177458A1 CAPACITOR FOR FILTERED FEEDTHROUGH WITH CONDUCTIVE PAD 审中-公开
标题翻译：电容器通过导电垫片进行过滤
公开(公告)号：US20100177458A1
公开(公告)日：2010-07-15
申请号：US12351946
申请日：2009-01-12
申请人： Rajesh V. Iyer
发明人： Rajesh V. Iyer
IPC分类号： H01G4/35 , H01G7/00
CPC分类号： H01G4/35 , A61N1/3754 , Y10T29/43
摘要： A filtered feedthrough assembly includes a capacitor comprising a top portion, a bottom portion, an outer diameter portion and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion. An conductive pad of conductive material is applied to the top portion around the at least one aperture. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material.
摘要翻译：滤波后的馈通组件包括一个包括顶部，底部，外径部分和内径部分的电容器。内径部分限定从顶部延伸到底部的至少一个孔。导电材料的导电垫被施加到围绕所述至少一个孔的顶部。馈通销延伸穿过每个孔，并且通过在导电材料的导电焊盘上施加焊料预制件而被焊接到电容器的内径部分。

14. 发明授权

US08849404B2 Feedthrough assembly including a lead frame assembly 有权
标题翻译：馈通组件，包括引线框架组件
公开(公告)号：US08849404B2
公开(公告)日：2014-09-30
申请号：US13308144
申请日：2011-11-30
申请人： Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
发明人： Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
IPC分类号： A61N1/02 , H05K13/00 , A61N1/375 , H03H7/01
CPC分类号： A61N1/3754 , A61N1/3968 , H03H7/0138 , H03H2001/0042 , H05K13/00 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49165 , Y10T29/49171 , Y10T29/49208
摘要： A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a lead frame assembly. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. The lead frame assembly may include an electrically conductive lead electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway.
摘要翻译：馈通组件可以包括限定套圈开口的套圈，至少部分地设置在套圈开口内的馈通，至少部分地设置在套圈开口内的电容式滤波器阵列，以及引线框架组件。馈通可以包括至少一个馈通导电路径，并且电容滤波器阵列可以包括至少一个滤波器阵列导电路径。引线框架组件可以包括电连接至少一个馈通导电路径和至少一个滤波器阵列导电路径的导电引线。

15. 发明申请

US20140043739A1 Implantable Medical Devices and Related Connector Enclosure Assemblies Utilizing Conductors Electrically Coupled to Feedthrough Pins 有权
标题翻译：可植入医疗器械及相关连接器机壳组件利用导体电耦合穿通引脚
公开(公告)号：US20140043739A1
公开(公告)日：2014-02-13
申请号：US13981264
申请日：2012-01-20
申请人： Steven T. Deininger , Michael J. Baade , Rajesh V. Iyer
发明人： Steven T. Deininger , Michael J. Baade , Rajesh V. Iyer
IPC分类号： H05K7/02
CPC分类号： A61N1/3754 , A61N1/375 , H01G4/35 , H01R4/029 , H01R13/516 , H01R13/5224 , H01R24/58 , H01R43/26 , H01R2107/00 , H01R2201/12 , H05K7/02 , H05K7/1427 , Y10T29/4913 , Y10T29/49208
摘要： Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
摘要翻译：可植入医疗设备包括连接器外壳组件，其使用电耦合到馈通引脚的导体，所述引脚延伸到容纳电路的罐中。导体可以通过导电接合材料和制造期间的单一接合事件耦合到馈通引脚和滤波电容器内的电容器板。连接器外壳组件的基板还可以包括接地引脚。接地电容器板可能存在于接地引脚穿过的滤波电容器的接地孔，使得接地引脚，接地导体和接地电容器板可以耦合。可以为连接器外壳组件提供保护盖，以在组件连接到罐之前封闭旨在延伸到罐中的导体。导体可以附接到随后被去除的公共标签上。

16. 发明申请

US20130176658A1 FEEDTHROUGH ASSEMBLY INCLUDING ELECTRICAL GROUND THROUGH FEEDTHROUGH SUBSTRATE 有权
标题翻译：有意义的组装，包括通过基板的电接地
公开(公告)号：US20130176658A1
公开(公告)日：2013-07-11
申请号：US13346424
申请日：2012-01-09
申请人： Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
发明人： Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
IPC分类号： H01G4/35
CPC分类号： H01G4/35 , H01G2/04 , H01G4/232 , H01G4/236
摘要： A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.
摘要翻译：馈通组件可以包括限定套圈开口的套圈，至少部分地设置在套圈开口内的电容式过滤器阵列，以及至少部分地设置在套圈开口内的馈通。在一些示例中，电容滤波器阵列包括滤波器阵列接地导电路径。在一些示例中，馈通包括馈通地导电通孔。馈通地导电通孔可以电耦合到过滤器阵列接地导电通路，并且馈通地导电通孔可以电耦合到套圈。

17. 发明授权

US08478409B2 Filtering capacitor feedthrough assembly 有权
标题翻译：过滤电容器馈通组件
公开(公告)号：US08478409B2
公开(公告)日：2013-07-02
申请号：US13072204
申请日：2011-03-25
申请人： Rajesh V. Iyer , Richard P. Millis , Michael G. Marinkov , Micah A. Litow
发明人： Rajesh V. Iyer , Richard P. Millis , Michael G. Marinkov , Micah A. Litow
IPC分类号： A61N1/06
CPC分类号： H01G4/35 , A61N1/3754 , Y10S439/909
摘要： A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture defined by an inner capacitor surface. The capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture. An electrically conductive split ring sleeve is disposed within the aperture and between the terminal pin and the capacitor. The split ring sleeve includes a first end, a second end, a sleeve length therebetween. A longitudinal slit through the sleeve extends from the first end to the second end. The electrically conductive split ring sleeve mechanically securing and electrically coupling the terminal pin to the capacitor.
摘要翻译：公开了一种用于可植入有源医疗装置的滤波电容器馈通组件。滤波电容器馈通组件包括具有由内部电容器表面限定的孔的电容器。电容器电接地到可植入有源医疗装置的导电馈通套圈或壳体。端子销延伸到孔中。导电开口环套管设置在孔内并且在端子引脚和电容器之间。开口环套筒包括第一端，第二端，其间的套筒长度。穿过套筒的纵向狭缝从第一端延伸到第二端。导电分裂环套管将端子引脚机械地固定和电耦合到电容器。

18. 发明申请

US20130058003A1 FEEDTHROUGH ASSEMBLY INCLUDING A CAPACITIVE FILTER ARRAY 有权
标题翻译：包括电容滤波器阵列在内的组装
公开(公告)号：US20130058003A1
公开(公告)日：2013-03-07
申请号：US13308136
申请日：2011-11-30
申请人： Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
发明人： Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
IPC分类号： H01G4/35 , H01G7/00
CPC分类号： A61N1/3754 , A61N1/3968 , H03H7/0138 , H03H2001/0042 , H05K13/00 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49165 , Y10T29/49171 , Y10T29/49208
摘要： A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.
摘要翻译：馈通组件可以包括限定套圈开口的套圈，至少部分地设置在套圈开口内的馈通，以及至少部分地设置在套圈开口内的电容式过滤器阵列。馈通可以包括至少一个馈通导电路径，并且电容滤波器阵列可以包括至少一个滤波器阵列导电路径。在一些示例中，馈通组件包括电连接至少一个馈通导电路径和至少一个滤波器阵列导电路径的厚膜导电糊。在一些示例中，电容馈通阵列包括周边导电触点和电耦合至少一个滤波器阵列导电路径和周边导电触点的电容滤波器。在这些示例中的一些示例中，馈通组件包括电连接周边导电触点和套圈的厚膜导电膏。

19. 发明授权

US07748093B2 Filtered feedthrough assembly and method of manufacture 有权
标题翻译：过滤馈通组件及其制造方法
公开(公告)号：US07748093B2
公开(公告)日：2010-07-06
申请号：US11872452
申请日：2007-10-15
申请人： Rajesh V. Iyer , Susan A. Tettemer , John P. Tardiff , Shawn D. Knowles
发明人： Rajesh V. Iyer , Susan A. Tettemer , John P. Tardiff , Shawn D. Knowles
IPC分类号： H01G7/00
CPC分类号： H01G4/242 , H01G2/106 , H01G4/35 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49004 , Y10T29/49078 , Y10T29/4913 , Y10T29/49165 , Y10T29/49171 , Y10T29/49176
摘要： A filtered feedthrough assembly having at least one terminal pin therethrough is provided. The feedthrough assembly comprises a ferrule having a cavity therethrough for receiving the terminal pin, and insulating structure having an upper surface. The insulating structure is disposed within the cavity and around the terminal pin for electrically isolating the pin from the ferrule. A capacitor is disposed around the pin and electrically coupled thereto. The capacitor has a lower surface that is disposed proximate the upper surface, and at least one washer is disposed between the upper surface and the lower surface. To attach the capacitor to the insulating structure, a body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the at least one washer.
摘要翻译：提供了具有穿过其中的至少一个端子销的经滤波的馈通组件。馈通组件包括具有穿过其的用于接收端子销的空腔的套圈以及具有上表面的绝缘结构。绝缘结构设置在空腔内并且围绕端子销以将引脚与套圈电隔离。电容器设置在销周围并与其电耦合。电容器具有靠近上表面设置的下表面，并且至少一个垫圈设置在上表面和下表面之间。为了将电容器附接到绝缘结构，环氧树脂体通过套圈，绝缘结构，电容器和至少一个垫圈基本上限制在上表面和下表面之间。

20. 发明授权

US07590450B2 Filtered electrical interconnect assembly 有权
标题翻译：过滤电气互连组件
公开(公告)号：US07590450B2
公开(公告)日：2009-09-15
申请号：US11343174
申请日：2006-01-30
申请人： Rajesh V. Iyer , Shawn D. Knowles
发明人： Rajesh V. Iyer , Shawn D. Knowles
IPC分类号： A61N1/00
CPC分类号： A61N1/3754
摘要： An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.
摘要翻译：用于可植入医疗装置的电子模块组件包括具有用于接受馈通导体的开口的非导电块。该块具有相对的第一和第二端以及相对的第一和第二侧。接合焊盘位于块的第一端上，用于电连接到馈通导体，并且接合焊盘延伸到块的第一侧以在其中提供电连接区域。

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