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11. 发明申请

US20070005325A1 Circuit simulation using precision-space concept 审中-公开
标题翻译：电路仿真采用精密空间概念
公开(公告)号：US20070005325A1
公开(公告)日：2007-01-04
申请号：US11174124
申请日：2005-06-30
申请人： Jian Gong , Changhong Dai
发明人： Jian Gong , Changhong Dai
IPC分类号： G06F17/50
CPC分类号： G06F17/504
摘要： An arrangement is provided for using a precision space (“p-space”) to represent s-parameters when analyzing/simulating a circuit/network. The p-space is one dimensional with a value range corresponding to the value range of s-parameters. The p-space is divided into multiple slots where the number of slots may depend on the permissible precision of s-parameter values. A mapping relationship between s-parameters and p-space slots may be obtained by partitioning an s-parameter matrix. Based on the mapping relationship, p-space representations of original s-parameters may be generated through a forward projection process from s-parameters in a two-dimensional matrix to the one-dimensional p-space. During the simulation process, a p-space representation may be projected back to original s-parameters in a matrix based on the mapping relationship.
摘要翻译：提供了一种在分析/模拟电路/网络时使用精密空间（“p空间”）表示s参数的布置。 p空间是与s参数的值范围对应的值范围的一维。 p空间被分成多个槽，其中槽数可以取决于s参数值的允许精度。可以通过划分s参数矩阵来获得s参数和p空间时隙之间的映射关系。基于映射关系，可以通过从二维矩阵中的s参数到一维p空间的前向投影处理来生成原始s参数的p空间表示。在仿真过程中，可以基于映射关系将p空间表示投影回矩阵中的原始s参数。

12. 发明申请

US20070005324A1 Method and apparatus for simulating circuits using s-parameters 审中-公开
标题翻译：使用s参数模拟电路的方法和装置
公开(公告)号：US20070005324A1
公开(公告)日：2007-01-04
申请号：US11174071
申请日：2005-06-30
申请人： Jian Gong , Changhong Dai
发明人： Jian Gong , Changhong Dai
IPC分类号： G06F17/50
CPC分类号： G06F17/5036
摘要： An arrangement is provided for using s-parameters to obtain characteristics of a device under test (“DUT”) between a number of selected observation locations. The DUT may be represented by a network of models such as lumped device models and transmission line models. S-parameters between the selected nodes may be measured based on the DUT representation at a plurality of frequency points. The measured s-parameters may be converted into their precision space (“p-space”) representations, which may then be submitted to a simulator to obtain the DUT characteristics at the selected observation nodes.
摘要翻译：提供了一种用于使用s参数来获得多个所选观察位置之间的待测设备（“DUT”）的特性的装置。 DUT可以由诸如集总装置模型和传输线模型的模型网络来表示。可以基于多个频点处的DUT表示来测量所选节点之间的S参数。测量的s参数可以转换成它们的精确空间（“p空间”）表示，然后可以将其提交给模拟器以在所选择的观测节点处获得DUT特性。

13. 发明申请

US20060224373A1 Electromagnetic solutions for full-chip analysis 有权
公开(公告)号：US20060224373A1
公开(公告)日：2006-10-05
申请号：US11098538
申请日：2005-04-05
申请人： Dan Jiao , Changhong Dai
发明人： Dan Jiao , Changhong Dai
IPC分类号： G06F17/50
CPC分类号： G06F7/60 , G06F17/5018 , G06F2217/16
摘要： A modeling method is provided that includes receiving a computational model of a structure and slicing the computational model into a plurality of circuit prints. The plurality of slices may include essential circuit prints and backfill circuit prints. Various unknowns may be eliminated between essential circuit prints of the computational model. The unknowns to be eliminated may include volume unknowns and backfill circuit-print unknowns. The numerical system formed by circuit-print unknowns may be divided into a plurality of blocks. The blocks may be solved in turn. One block may be solved by projecting the contributions from other blocks to this block. The solution of the one block may be translated to other blocks to solve unknowns therein. The computational model may then be solved to determine electromagnetic and circuit characteristics of the structure.

14. 发明授权

US09688575B2 Low pressure air or vacuum glass edge-sealed with bar frame and groove 有权
公开(公告)号：US09688575B2
公开(公告)日：2017-06-27
申请号：US14383702
申请日：2013-03-21
申请人： Changhong Dai
发明人： Changhong Dai
IPC分类号： E06B3/66 , C03C27/10 , E06B3/663
CPC分类号： C03C27/10 , C03C3/091 , C03C8/24 , C03C27/06 , E06B3/6612 , E06B3/66304 , E06B2003/66338 , Y02A30/25 , Y02B80/24
摘要： A low pressure air or vacuum glass and manufacturing method thereof, the low pressure air or vacuum glass comprising upper glass and lower glass; the upper glass and the lower glass are flat glass or convex glass; the peripheries of the upper glass and the lower glass are provided with an edge sealing bar frame and/or an edge sealing groove, and are welded together via a low temperature glass solder, thus forming a closed low pressure air layer or vacuum layer therebetween. The low pressure or vacuum glass is of simple manufacturing process, low cost, high production efficiency, reliable sealing connection, and good sealing effect.

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