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11. 发明申请

US20070147982A1 Method of retaining a substrate during a substrate transferring process 有权
标题翻译：在衬底转移过程中保持衬底的方法
公开(公告)号：US20070147982A1
公开(公告)日：2007-06-28
申请号：US11398218
申请日：2006-04-05
申请人： Mike Rice , Jeffrey Hudgens , Charles Carlson , William Tyler Weaver , Robert Lowrance , Eric Englhardt , Dean Hruzek , Mario Silvetti , Michael Kuchar , Kirk Van Katwyk , Van Hoskins , Vinay Shah
发明人： Mike Rice , Jeffrey Hudgens , Charles Carlson , William Tyler Weaver , Robert Lowrance , Eric Englhardt , Dean Hruzek , Mario Silvetti , Michael Kuchar , Kirk Van Katwyk , Van Hoskins , Vinay Shah
IPC分类号： H01L21/677
CPC分类号： H01L21/67178 , H01L21/67173 , H01L21/67276 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68707
摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.
摘要翻译：一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的脚印。群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

12. 发明申请

US20070061031A1 Methods and apparatus for a band to band transfer module 有权
标题翻译：一种带对带传输模块的方法和装置
公开(公告)号：US20070061031A1
公开(公告)日：2007-03-15
申请号：US11521070
申请日：2006-09-13
申请人： Robert Lowrance , Eric Englhardt , Michael Rice , Vinay Shah , Sushant Koshti , Jeffrey Hudgens
发明人： Robert Lowrance , Eric Englhardt , Michael Rice , Vinay Shah , Sushant Koshti , Jeffrey Hudgens
IPC分类号： G06F19/00
CPC分类号： B65G47/52 , B65G29/00 , B65G47/28 , B65G2203/025 , H01L21/67706 , H01L21/67715 , Y10S414/135 , Y10S414/14
摘要： A band to band transfer module according to the present invention may be used with a substrate carrier transport system, or other systems, to transfer substrate carriers (e.g., small lot substrate carriers) from one conveyor to another conveyor or between two points on the same conveyor. The transfers (e.g., pick and place) of the substrate carriers may be made between conveyors traveling at different speeds. Numerous other aspects and features are disclosed.
摘要翻译：根据本发明的带带传输模块可以与衬底载体传输系统或其他系统一起使用，以将衬底载体（例如，小批量衬底载体）从一个传送器转移到另一个传送器或在相同的两个点之间输送带。可以在以不同速度行进的输送机之间形成基板载体的传送（例如拾取和放置）。公开了许多其他方面和特征。

13. 发明申请

US20060224276A1 METHOD FOR MONITORING THE POSITION OF A SEMICONDUCTOR PROCESSING ROBOT 审中-公开
标题翻译：用于监测半导体加工机器人的位置的方法
公开(公告)号：US20060224276A1
公开(公告)日：2006-10-05
申请号：US11424377
申请日：2006-06-15
申请人： Pyongwon Yim , Satish Sundar , Vinay Shah , Mario Silvetti , Douglas Kitajima , Venkatesh Babu , Visweswaren Sivaramakrishnan , Indrajit Lahiri , Surinder Bedi
发明人： Pyongwon Yim , Satish Sundar , Vinay Shah , Mario Silvetti , Douglas Kitajima , Venkatesh Babu , Visweswaren Sivaramakrishnan , Indrajit Lahiri , Surinder Bedi
IPC分类号： G06F19/00 , H01L21/306 , C23C16/00
CPC分类号： H01L21/67259 , H01L21/67766 , H01L21/681
摘要： A robotic positioning system that cooperates with a sensing system to correct robot motion is provided. The sensing system is decoupled from the sensors used conventionally to control the robot's motion, thereby providing repeatable detection of the robot's true position. In one embodiment, the positioning system includes a robot, a controller, a motor sensor and a decoupled sensor. The robot has at least one motor for manipulating a linkage controlling the displacement of a substrate support coupled thereto. The motor sensor is provides the controller with motor actuation information utilized to move the substrate support. The decoupled sensor provides information indicative of the true position the substrate support that may be utilized to correct the robot's motion.
摘要翻译：提供了与传感系统配合以校正机器人运动的机器人定位系统。感测系统与常规用于控制机器人运动的传感器解耦，从而提供机器人真实位置的可重复检测。在一个实施例中，定位系统包括机器人，控制器，马达传感器和去耦传感器。机器人具有至少一个用于操纵联动装置的电动机，控制联接到其上的衬底支架的位移。马达传感器为控制器提供用于移动基板支架的马达驱动信息。解耦传感器提供指示可用于校正机器人运动的基板支撑件的真实位置的信息。

14. 发明授权

US4951929A Refractory assembly including inner and outer refractory members with interference shrink fit therebetween and method of formation thereof 失效
$Refractory assembly including inner and outer refractory members with interference shrink fit therebetween and method of formation thereof$
标题翻译：包括具有干涉的内部和外部耐火构件的耐火构件及其形成方法
公开(公告)号：US4951929A
公开(公告)日：1990-08-28
申请号：US334861
申请日：1989-04-06
申请人： Hans-Georg Schwarz , Vinay Shah , Bernhard Schiefer
发明人： Hans-Georg Schwarz , Vinay Shah , Bernhard Schiefer
IPC分类号： C04B37/00 , B22D41/30 , B22D41/52
CPC分类号： B22D41/30 , B22D41/52 , Y10T428/1317
摘要： A refractory assembly includes a refractory outer member having therein an opening defined by an inner surface and a refractory inner member having an outer surface. The dimension of the outer surface of the inner member is greater than the dimension of the inner surface of the outer member by an amount of from 0.05 to 0.15 mm. The outer member is heated to at least 1000.degree. C. to thereby increase the dimension of the inner surface. The inner member then is inserted into the opening in the outer member, and the outer member then is cooled to room temperature. As a result, the inner surface of the outer member shrinks against the outer surface of the inner member to thereby form an interference shrink fit joint between the members.
摘要翻译：耐火组件包括耐火外部构件，其中具有由内表面限定的开口和具有外表面的耐火内部构件。内部构件的外表面的尺寸大于外部构件的内表面的尺寸为0.05至0.15mm的量。将外部构件加热至至少1000℃，从而增加内表面的尺寸。然后将内部构件插入外部构件中的开口中，然后将外部构件冷却至室温。结果，外部构件的内表面收缩到内部构件的外表面，从而在构件之间形成干涉收缩配合接头。

15. 发明申请

US20100280654A1 SUBSTRATE PROCESSING SEQUENCE IN A CARTESIAN ROBOT CLUSTER TOOL 有权
标题翻译：卡特彼勒机器人工具中的基板处理序列
公开(公告)号：US20100280654A1
公开(公告)日：2010-11-04
申请号：US12840143
申请日：2010-07-20
申请人： Mike Rice , Jeffrey Hudgens , Charles Carlson , William Tyler Weaver , Robert Lowrance , Eric Englhardt , Dean C. Hruzek , Dave Silvetti , Michael Kuchar , Kirk Van Katwyk , Van Hoskins , Vinay Shah
发明人： Mike Rice , Jeffrey Hudgens , Charles Carlson , William Tyler Weaver , Robert Lowrance , Eric Englhardt , Dean C. Hruzek , Dave Silvetti , Michael Kuchar , Kirk Van Katwyk , Van Hoskins , Vinay Shah
IPC分类号： H01L21/677 , H01L21/68
CPC分类号： B25J11/008 , B25J18/00 , G03F7/70991 , H01L21/67173 , H01L21/67178 , H01L21/67225 , H01L21/67742 , H01L21/67745 , Y10S414/135
摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.
摘要翻译：提供了一种使用多室处理系统或集群工具处理衬底的方法和装置。在本发明的一个实施例中，提供了机器人组件。所述机器人组件包括可在第一方向上移动的第一运动组件和第二运动组件，所述第二运动组件联接到所述第一运动组件，并且可相对于所述第一运动组件在大致正交于所述第一运动组件的第二方向上移动第一个方向机器人组件还包括设置在第一运动组件或第二运动组件中的一个中的壳体，壳体内的致动器，以及设置在外壳中的风扇组件，其适于产生外壳内的压力小于外壳外部压力。

16. 发明授权

US07778721B2 Small lot size lithography bays 有权
标题翻译：小批量尺寸光刻托架
公开(公告)号：US07778721B2
公开(公告)日：2010-08-17
申请号：US11148956
申请日：2005-06-09
申请人： Eric Andrew Englhardt , Vinay Shah
发明人： Eric Andrew Englhardt , Vinay Shah
IPC分类号： G06F19/00
CPC分类号： H01L21/67727 , H01L21/67276 , Y10S414/14
摘要： In a first aspect, a small lot size lithography bay is provided. The small lot size lithography bay includes (1) a plurality of lithography tools; and (2) a small lot size transport system adapted to transport small lot size substrate carriers to the lithography tools. Each small lot size substrate carrier is adapted to hold fewer than 13 substrates. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了小批量尺寸的光刻托架。小尺寸光刻托架包括（1）多个光刻工具; 和（2）适用于将小批量尺寸基板载体运送到光刻工具的小批量输送系统。每个小批量尺寸的衬底载体适于容纳少于13个衬底。提供了许多其他方面。

17. 发明申请

US20070158183A1 METHODS AND APPARATUS FOR PURGING A SUBSTRATE CARRIER 有权
标题翻译：用于采集基板载体的方法和装置
公开(公告)号：US20070158183A1
公开(公告)日：2007-07-12
申请号：US11622300
申请日：2007-01-11
申请人： Vinay Shah , Eric Englhardt , Jeffrey Hudgens , Martin Elliott
发明人： Vinay Shah , Eric Englhardt , Jeffrey Hudgens , Martin Elliott
IPC分类号： C23C14/00
CPC分类号： H01L21/67393 , H01L21/67017 , H01L21/67353 , Y10S414/135 , Y10S414/137 , Y10T137/0318 , Y10T137/0396
摘要： In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了一种衬底载体，其包括适于可密封的壳体并容纳至少一个衬底。衬底载体包括通向壳体的第一端口，并且适于在衬底载体关闭的同时允许气体流入外壳。提供了许多其他方面。

18. 发明申请

US20070147976A1 SUBSTRATE PROCESSING SEQUENCE IN A CARTESIAN ROBOT CLUSTER TOOL 有权
标题翻译：卡特彼勒机器人工具中的基板处理序列
公开(公告)号：US20070147976A1
公开(公告)日：2007-06-28
申请号：US11553820
申请日：2006-10-27
申请人： Mike Rice , Jeffrey Hudgens , Charles Carlson , William Tyler Weaver , Robert Lowrance , Eric Englhardt , Dean C. Hruzek , Dave Silvetti , Michael Kuchar , Kirk Van Katwyk , Van Hoskins , Vinay Shah
发明人： Mike Rice , Jeffrey Hudgens , Charles Carlson , William Tyler Weaver , Robert Lowrance , Eric Englhardt , Dean C. Hruzek , Dave Silvetti , Michael Kuchar , Kirk Van Katwyk , Van Hoskins , Vinay Shah
IPC分类号： H01L21/677
CPC分类号： B25J11/008 , B25J18/00 , G03F7/70991 , H01L21/67173 , H01L21/67178 , H01L21/67225 , H01L21/67742 , H01L21/67745 , Y10S414/135
摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.
摘要翻译：一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的脚印。群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

19. 发明授权

US07221993B2 Systems and methods for transferring small lot size substrate carriers between processing tools 有权
标题翻译：在处理工具之间传送小批量衬底载体的系统和方法
公开(公告)号：US07221993B2
公开(公告)日：2007-05-22
申请号：US10764620
申请日：2004-01-26
申请人： Michael R. Rice , Eric A. Englhardt , Vinay Shah , Martin R. Elliott , Robert B. Lowrance , Jeffrey C. Hudgens
发明人： Michael R. Rice , Eric A. Englhardt , Vinay Shah , Martin R. Elliott , Robert B. Lowrance , Jeffrey C. Hudgens
IPC分类号： G06F19/00
CPC分类号： H01L21/67727 , H01L21/67276 , H01L21/67769 , H01L21/67778 , Y02P80/40 , Y02P90/86
摘要： In a first aspect, a method of managing work in progress within a small lot size semiconductor device manufacturing facility is provided. The first method includes providing a small lot size semiconductor device manufacturing facility having (1) a plurality of processing tools; and (2) a high speed transport system adapted to transport small lot size substrate carriers among the processing tools. The method further includes maintaining a predetermined work in progress level within the small lot size semiconductor device manufacturing facility by (1) increasing an average cycle time of low priority substrates within the small lot size semiconductor device manufacturing facility; and (2) decreasing an average cycle time of high priority substrates within the small lot size semiconductor device manufacturing facility so as to approximately maintain the predetermined work in progress level within the small lot size semiconductor device manufacturing facility. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了一种在小批量半导体器件制造设施内管理正在进行的工作的方法。第一种方法包括提供具有（1）多个处理工具的小批量半导体器件制造设备; 和（2）适于在处理工具之间运输小批量衬底载体的高速运输系统。该方法还包括：（1）增加小批量半导体器件制造设备内的低优先级衬底的平均周期时间，使小批量半导体器件制造设备内的预定工作保持在进行中; 和（2）减小小批量半导体器件制造设备内的高优先级衬底的平均周期时间，以便在小批量半导体器件制造设备内大致维持预定工作进行中的水平。提供了许多其他方面。

20. 发明申请

US20050273191A1 Small lot size lithography bays 有权
标题翻译：小批量尺寸光刻托架
公开(公告)号：US20050273191A1
公开(公告)日：2005-12-08
申请号：US11148956
申请日：2005-06-09
申请人： Eric Englhardt , Vinay Shah
发明人： Eric Englhardt , Vinay Shah
IPC分类号： G06F19/00 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67727 , H01L21/67276 , Y10S414/14
摘要： In a first aspect, a small lot size lithography bay is provided. The small lot size lithography bay includes (1) a plurality of lithography tools; and (2) a small lot size transport system adapted to transport small lot size substrate carriers to the lithography tools. Each small lot size substrate carrier is adapted to hold fewer than 13 substrates. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了小批量尺寸的光刻托架。小尺寸光刻托架包括（1）多个光刻工具; 和（2）适用于将小批量尺寸基板载体运送到光刻工具的小批量输送系统。每个小批量尺寸的衬底载体适于容纳少于13个衬底。提供了许多其他方面。

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