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11. 发明授权

US11004699B2 Electronic device and method for manufacturing the same 有权
公开(公告)号：US11004699B2
公开(公告)日：2021-05-11
申请号：US16336923
申请日：2017-09-19
申请人： OMRON Corporation
发明人： Wakahiro Kawai , Tetsuya Katsuragawa
IPC分类号： H01L21/00 , H01L21/56 , H01L23/538 , H01L23/00 , H05K1/14 , H01L23/31
摘要： An electronic device comprises: an electronic component; a resin molded body in which the electronic component is embedded and fixed; and a bendable bend portion continuous with the resin molded body. For example, the bend portion is molded integrally with the resin molded body. Thus, electronic device can be reduced in size and thickness.

12. 发明授权

US10631415B2 Electronic device and manufacturing method thereof 有权
公开(公告)号：US10631415B2
公开(公告)日：2020-04-21
申请号：US16613113
申请日：2018-02-16
申请人： OMRON Corporation
发明人： Wakahiro Kawai
IPC分类号： H05K3/32 , H05K1/18 , B29C45/14 , B29L31/34
CPC分类号： H05K3/32 , B29C45/14336 , H05K1/18 , B29L2031/3425 , H05K2201/10356 , H05K2203/1316 , H05K2203/1469
摘要： This electronic device is provided with: a resin molding; and a conductive cable including an electric wire. One end portion of the conductive cable is embedded in the resin molding. The surface of the resin molding exposes an end surface on the side of the one end portion of the conductive cable and includes a surface which is continuous to the end surface. The electronic device is further provided with wirings formed on the end surface and the surface so as to be connected to the electric wire in the end surface.

13. 发明授权

US10618206B2 Resin-molded electronic device with disconnect prevention 有权
公开(公告)号：US10618206B2
公开(公告)日：2020-04-14
申请号：US16464704
申请日：2017-11-16
申请人： OMRON Corporation
发明人： Wakahiro Kawai
IPC分类号： B29C45/14 , H01C1/034 , H01C1/14 , H01C17/00 , H01G2/10 , H01G13/00 , H01L21/56 , H01L23/31 , H01L23/00 , B29L31/34
CPC分类号： B29C45/14 , H01C1/034 , H01C1/14 , H01C17/006 , H01G2/103 , H01G13/003 , H01L21/565 , H01L21/568 , H01L23/3185 , H01L24/05 , B29C2045/1486 , B29L2031/34
摘要： An electronic device includes an electronic component having electrodes, a resin molded body embedding the electronic component such that the electrodes are exposed, a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and wires formed on the resin molded body and the resin member and respectively connected to the electrodes. A thermal expansion coefficient of the resin member is lower than a thermal expansion coefficient of the resin molded body and is higher than a thermal expansion coefficient of the electrodes.

14. 发明授权

US10334733B2 Circuit structure 有权
公开(公告)号：US10334733B2
公开(公告)日：2019-06-25
申请号：US15562921
申请日：2016-03-22
申请人： OMRON CORPORATION
发明人： Wakahiro Kawai
IPC分类号： H05K1/18 , H01L23/12 , H05K5/00 , H05K3/00 , H05K3/12 , H01L21/56 , H01L23/00
摘要： Provided is a circuit structure in which the occurrence of wiring line breakage due to deformation of a resin molded body is suppressed. A circuit structure (1) includes an electronic component (3) having an electrode (31, 32), a resin molded body (2) in which the electronic component (3) is embedded, and a wiring line (41, 42) connected to the electrode (31, 32). A groove (21) is formed around the electronic component (3) in the resin molded body (2), and the wiring line (41, 42) is provided so as to extend into the groove (21).

15. 发明授权

US10890813B2 Electronic device having a first electronic component and a second electronic component connected by wiring, and manufacturing method therefor 有权
公开(公告)号：US10890813B2
公开(公告)日：2021-01-12
申请号：US15750837
申请日：2016-11-08
申请人： OMRON Corporation
发明人： Wakahiro Kawai , Takafumi Bessho
IPC分类号： G02F1/1345 , H01L21/56 , H01L23/00 , H05K1/18 , H01L23/552 , H05K1/09 , H05K3/12 , H05K3/32 , H05K3/28 , G02F1/1333
摘要： Provided are an electronic device and a manufacturing method therefor such that, when connecting a first electronic component configured to have a step difference near an external connection terminal to a second electronic component via wiring, the size increase of a manufacturing device can be avoided, wiring can be carried out at a low-cost, and the reliability of the wiring connections can be improved. An LCD (10) and an IC (20) are embedded and exposed in a resin molding (30) in such a manner that a connection electrode (13a) of the LCD (10) and an electrode of the IC (20) are positioned on the same plane.

16. 发明授权

US10879145B2 Electronic device and method of manufacture therefor 有权
公开(公告)号：US10879145B2
公开(公告)日：2020-12-29
申请号：US16334036
申请日：2017-09-19
申请人： OMRON Corporation
发明人： Wakahiro Kawai
IPC分类号： H01L23/48 , H01L23/31 , H01L21/48 , H01L21/56 , H01L23/498 , H05K1/02 , H05K3/00 , H01B5/14 , H01B13/00 , H05K7/20 , H01L23/29
CPC分类号： H01L23/3135 , H01B5/14 , H01B13/00 , H01L21/4867 , H01L21/565 , H01L23/49838 , H05K1/02 , H05K3/00 , H05K7/20 , H01L23/293 , H01L23/49866
摘要： An electronic device includes electronic components, a molded resin element wherein the electronic components are embedded and secured, and a heat transfer layer; the heat transfer layer has a higher thermal conductivity than the molded resin element. The heat transfer layer is in contact with portions of the electronic components other than an electrode pad and a terminal. This prevents increases in the cost of manufacturing the electronic device and the allows the electronic device to be thinner.

17. 发明授权

US10607967B2 Light emitting device, backlight device, and manufacturing method of light emitting device 有权
公开(公告)号：US10607967B2
公开(公告)日：2020-03-31
申请号：US15750843
申请日：2016-11-25
申请人： OMRON Corporation
发明人： Wakahiro Kawai , Kazuyuki Otake
IPC分类号： H01L33/54 , H01L25/075 , F21V8/00 , H01L33/00 , H01L33/36 , H01L33/62 , H01L33/48 , H01L33/56 , H01L51/52 , H01L51/56
摘要： In order to be more compact and thin, this light emitting device includes LED elements embedded in a resin molded body such that light emitting units are exposed on a lateral surface of the resin molded body and positive electrodes and negative electrodes are exposed on a back surface which is perpendicular to the lateral surface of the resin molded body.

18. 发明授权

US10070517B2 Three-dimensional circuit structure 有权
公开(公告)号：US10070517B2
公开(公告)日：2018-09-04
申请号：US15554274
申请日：2016-02-09
申请人： OMRON CORPORATION
发明人： Wakahiro Kawai
IPC分类号： H05K1/18 , H05K1/02
摘要： An electronic component (11) is embedded in an end portion of a surface (P1) and an end portion of a surface (P2) adjacent to each other in a three-dimensional base (2). The portion of an electrode (21) exposed from the surface (P1) and an electrode (101) of a packaged IC (41) are connected to each other via a wiring line (201). The portion of the electrode (21) exposed from the surface (P2) and an electrode (25) of an electronic component (15) are connected to each other via a wiring line (202). Accordingly, it is possible to realize a three-dimensional circuit structure requiring no wiring line spanning over or along an end portion thereof.

19. 发明授权

US09922932B2 Resin structure having electronic component embedded therein, and method for manufacturing said structure 有权
公开(公告)号：US09922932B2
公开(公告)日：2018-03-20
申请号：US15128450
申请日：2015-03-26
申请人： OMRON CORPORATION
发明人： Wakahiro Kawai
IPC分类号： H05K1/18 , H01L23/538 , B29C45/14 , H01L23/00 , H01L21/56 , B29L31/34 , B29K705/10
CPC分类号： H01L23/5389 , B29C45/14 , B29C45/14819 , B29K2705/10 , B29L2031/3481 , H01L21/4867 , H01L21/565 , H01L21/568 , H01L23/31 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/48 , H01L24/96 , H01L2224/04105 , H01L2224/05554 , H01L2224/24137 , H01L2224/24195 , H01L2224/451 , H01L2224/48101 , H01L2224/48137 , H01L2224/48195 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/184 , H05K3/00 , H05K3/28 , H05K5/00 , H01L2224/05599 , H01L2224/85399
摘要： In a resin structure including a resin molded body and a plurality of electronic components embedded in the resin molded body, (i) the resin molded body has a plurality of exposed surfaces on which electrodes of the plurality of electronic components are exposed, (ii) the resin molded body has a recess formed therein, and (iii) the recess has a bottom surface which is at least one of the plurality of exposed surfaces.

20. 发明申请

US20150301520A1 CONTROL DEVICE, CONTROL SYSTEM, CONTROL METHOD, PROGRAM, AND RECORDING MEDIUM 审中-公开
标题翻译：控制装置，控制系统，控制方法，程序和记录介质
公开(公告)号：US20150301520A1
公开(公告)日：2015-10-22
申请号：US14423869
申请日：2013-08-21
申请人： OMRON Corporation
发明人： Wakahiro Kawai
IPC分类号： G05B19/418
CPC分类号： G05B19/418 , G05B19/41865 , G05B2219/32021 , G05B2219/32057 , Y02P70/161 , Y02P80/114 , Y02P90/20 , Y02P90/205
摘要： A hub device (H) provided in a control-target device group includes: an operational information obtaining section (113) which obtains operational information indicative of an operational status of each of associated device groups each of which is a device group associated with the control-target device group; a storing section (115) in which first control setting information is stored, the first control setting information specifying, for each combination of operational statuses of the associated device groups, contents of control carried out with respect to the control-target device group; and an operation control section (114) which controls operation of the control-target device group in accordance with (i) the operational information on the each of the associated device groups and (ii) the first control setting information. This makes it possible to effectively reduce energy consumed by a plant constituted by a plurality of device groups.
摘要翻译：提供在控制目标设备组中的集线器设备（H）包括：操作信息获取部分（113），其获取指示每个相关联的设备组的操作状态的操作信息，每个相关联的设备组是与控制相关联的设备组目标设备组其中存储有第一控制设置信息的存储部分（115），所述第一控制设置信息针对相关设备组的操作状态的每个组合指定相对于所述控制对象设备组执行的控制的内容; 以及根据（i）关于每个相关联的设备组的操作信息和（ii）第一控制设置信息来控制控制对象设备组的操作的操作控制部分（114）。这使得可以有效地减少由多个装置组构成的设备所消耗的能量。

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