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    • 12. 发明授权
    • High resolution optical scanner
    • 高分辨率光学扫描仪
    • US5224088A
    • 1993-06-29
    • US833215
    • 1992-02-10
    • Yossef Atiya
    • Yossef Atiya
    • G11B7/003G11B7/0033G11B7/08G11B7/12
    • G11B7/003G11B7/0033G11B7/08G11B7/12
    • A simple high resolution optical scanner consists of high numerical aperture lens mounted at the end of a flexible cantilever. The lens scans along a curved line as the cantilever bends. In order for the optical path to track the lens position, a mirror is mounted on the cantilever at a point located about 20% of the cantilever length, measured from the fixed mounting point. As the cantilever bends, the angle at this point is half of the angle at the cantilever end. Since the mirror doubles this angle when reflecting the input beam, the input beam will track, and stay parallel to, the lens at the end of the cantilever. This type of scanner is particularly suited to operate in a resonant mode, since the cantilever shape has low inherent damping.
    • 一个简单的高分辨率光学扫描仪由安装在柔性悬臂端部的高数值孔径透镜组成。 当悬臂弯曲时,透镜沿曲线扫描。 为了使光路跟踪透镜位置,在从固定安装点测量的位于悬臂长度的约20%的点处,将反射镜安装在悬臂上。 当悬臂弯曲时,此时的角度为悬臂端的角度的一半。 由于镜子在反射输入光束时加倍了这个角度,所以输入光束会在悬臂的末端跟踪和平行于透镜。 这种类型的扫描器特别适合于以共振模式操作,因为悬臂形状具有低的固有阻尼。
    • 13. 发明授权
    • Method and apparatus for registration control in production by imaging
    • 通过成像进行生产中注册控制的方法和装置
    • US06493064B2
    • 2002-12-10
    • US09793916
    • 2001-02-28
    • Oz CabiriEffraim MikletzkiYossef Atiya
    • Oz CabiriEffraim MikletzkiYossef Atiya
    • G03B2742
    • H05K3/4679G03F7/70383G03F9/00H05K1/0269H05K3/0008H05K3/0082H05K3/4644H05K2201/09918
    • A method and apparatus for imaging an overlying conductive pattern over an underlying conductive pattern on a substrate, by determining deviations between the actual locations and the nominal locations of predetermined reference targets in the underlying conductive pattern on the substrate; and utilizing the determined deviations for modifying the scanning control data used for imaging the image data of the overlying conductive pattern in order to reduce misregistration thereof with respect to the underlying conductive pattern. Preferably, the reference targets are predetermined connection sites in the underlying conductive pattern to be precisely located with respect to connection sites in the overlying conductive pattern. The reference features may be assigned different weights according to their registration importance, and the deviations may be determined according to a threshold which varies with the weight assigned to the respective reference feature.
    • 通过确定基板上的下面的导电图案中的实际位置和预定参考目标的标称位置之间的偏差来对衬底上的下面的导电图案上的覆盖导电图案进行成像的方法和装置; 并且利用所确定的偏差来修改用于对上覆导电图案的图像数据进行成像的扫描控制数据,以便减少相对于下面的导电图案的不对准。 优选地,参考目标是下层导电图案中相对于上覆导电图案中的连接位置精确定位的预定连接部位。 参考特征可以根据其注册重要性被分配不同的权重,并且可以根据随分配给相应参考特征的权重而变化的阈值来确定偏差。
    • 14. 发明授权
    • Nonlinear image distortion correction in printed circuit board
manufacturing
    • US6165658A
    • 2000-12-26
    • US347775
    • 1999-07-06
    • Itzhak TaffYossef Atiya
    • Itzhak TaffYossef Atiya
    • G03F7/20H05K1/02H05K3/46G03F9/00
    • H05K3/4638G03F7/2051H05K1/0269H05K2203/166
    • The present invention relates to a process for the fabrication of multilayer articles having electrical connections between conductor patterns on at least two layers of the multilayer article. The process comprises at least the steps of:a) using an initial set of image data describing a first article or layer having a conductor pattern thereon, forming the first article or layer having a pattern of conductive material thereon; b) taking data of an image of the pattern of conductive material on the first article or layer; c) determining from the image of the pattern of conductive material on the first article or layer the relative location of sites within the pattern of conductive material on said first article or layer that are to be connected to sites on a pattern of conductive material on at least a second layer having conductor patterns thereon; and thereafter performing steps selected from the group consisting of:I) modifying the initial set of image data for the first article or layer to make corrections for each conductive site within the pattern of conductive material and producing a corrected set of image data;II) modifying an initial set of data for at least a second layer having sites within a pattern of conductive material that are to be connected to sites on the first article or layer, said modifying be based upon a comparison of the initial set of image data for the second layer and image data taken in step b) of said first article or layer, and producing a corrected set of image data for the second layer;III) modifying an initial set of data for a second layer having sites within a pattern of conductive material that are to be connected to sites on another layer, the modifying be based upon a comparison of the initial set of image data for the second layer and image data taken of a manufactured second layer, and modifying the initial set of image data for the first article or layer to make corrections for each conductive site within the pattern of conductive material, thereby producing a corrected set of data for at least the first article or layer and the second layer; andIV) modifying an initial set of data for a number of layers, each layer having sites within a pattern of conductive material that are to be connected to sites on another layer, the modifying being based upon a comparison of initial sets of image data for each of the number of layers and image data taken of a manufactured layer for each of the number of layers, and modifying the initial set of image data for each of the number of layers to make corrections for each conductive site within a pattern of conductive material within each of the number of layers, thereby producing a corrected set of image data for each of the number of layers; and then manufacturing at least one layer having conductive sites therein using a corrected set of data for manufacturing the at least one layer.