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11. 发明申请

US20070000897A1 MULTI-STEP ANNEAL OF THIN FILMS FOR FILM DENSIFICATION AND IMPROVED GAP-FILL 审中-公开
标题翻译：薄膜薄膜多层退化和改良胶圈
公开(公告)号：US20070000897A1
公开(公告)日：2007-01-04
申请号：US11423651
申请日：2006-06-12
申请人： Nitin Ingle , Zheng Yuan , Vikash Banthia , Xinyun Xia , Hali Forstner , Rong Pan
发明人： Nitin Ingle , Zheng Yuan , Vikash Banthia , Xinyun Xia , Hali Forstner , Rong Pan
IPC分类号： H01L21/324 , H05B3/00
CPC分类号： H01L21/324 , H01L21/02164 , H01L21/02271 , H01L21/02337 , H01L21/31612 , H01L21/31662 , H01L21/67115 , H01L21/76224 , H01L21/76283
摘要： A method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 200° C. to about 800° C. in a first atmosphere comprising an oxygen containing gas, and annealing the substrate at a second temperature of about 800° C. to about 1400° C. in a second atmosphere lacking oxygen. In addition, a method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 400° C. to about 800° C. in the presence of an oxygen containing gas, purging the oxygen containing gas away from the substrate, and raising the substrate to a second temperature from about 900° C. to about 1100° C. to further anneal the substrate in an atmosphere that lacks oxygen.
摘要翻译：一种退火包括含有电介质材料的沟槽的衬底的方法，所述方法包括在包含含氧气体的第一气氛中在大约200℃至大约800℃的第一温度下对衬底退火，以及退火衬底在约800℃至约1400℃的第二温度下在不含氧气的第二气氛中。另外，包括含有电介质材料的沟槽的衬底的退火方法，该方法包括在含氧气体存在下，在约400℃至约800℃的第一温度下退火衬底，含氧气体离开衬底，并将衬底升高至约900℃至约1100℃的第二温度，以在缺氧的气氛中进一步对衬底进行退火。

12. 发明申请

US20060030165A1 Multi-step anneal of thin films for film densification and improved gap-fill 有权
标题翻译：用于膜致密化和改善间隙填充的薄膜的多步退火
公开(公告)号：US20060030165A1
公开(公告)日：2006-02-09
申请号：US10990002
申请日：2004-11-16
申请人： Nitin Ingle , Zheng Yuan , Vikash Banthia , Xinyun Xia , Hali Forstner , Rong Pan
发明人： Nitin Ingle , Zheng Yuan , Vikash Banthia , Xinyun Xia , Hali Forstner , Rong Pan
IPC分类号： H01L21/324
CPC分类号： H01L21/324 , H01L21/02164 , H01L21/02271 , H01L21/02337 , H01L21/31612 , H01L21/31662 , H01L21/67115 , H01L21/76224 , H01L21/76283
摘要： A method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 200° C. to about 800° C. in a first atmosphere comprising an oxygen containing gas, and annealing the substrate at a second temperature of about 800° C. to about 1400° C. in a second atmosphere lacking oxygen. In addition, a method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 400° C. to about 800° C. in the presence of an oxygen containing gas, purging the oxygen containing gas away from the substrate, and raising the substrate to a second temperature from about 900° C. to about 1100° C. to further anneal the substrate in an atmosphere that lacks oxygen.
摘要翻译：一种退火包括含有电介质材料的沟槽的衬底的方法，所述方法包括在包含含氧气体的第一气氛中在大约200℃至大约800℃的第一温度下对衬底退火，以及退火衬底在约800℃至约1400℃的第二温度下在不含氧气的第二气氛中。另外，包括含有电介质材料的沟槽的衬底的退火方法，该方法包括在含氧气体存在下，在约400℃至约800℃的第一温度下退火衬底，含氧气体离开衬底，并将衬底升高至约900℃至约1100℃的第二温度，以在缺氧的气氛中进一步对衬底进行退火。

13. 发明申请

US20130297329A1 Method for Brokering Purchases of Procedural Services 审中-公开
标题翻译：中介程序服务采购方法
公开(公告)号：US20130297329A1
公开(公告)日：2013-11-07
申请号：US13672508
申请日：2012-11-08
申请人： Vikash Banthia , Vishal Banthia
发明人： Vikash Banthia , Vishal Banthia
IPC分类号： G06Q50/22
CPC分类号： G06Q30/0615 , G06Q10/1095 , G06Q30/08 , G06Q50/22
摘要： A method for brokering purchases of procedural services between a buyer and at least one professional service provider is a software-based system that negotiates transactions between potential clients and professional service providers by receiving, verifying, and negotiating appointment availabilities and appointment offers while providing privacy to both parties until a transaction is conducted. The system comprises the steps of receiving and indexing appointment openings from providers, receiving and indexing appointment offers from buyers, matching appointment opening with appointment offers, anonymizing appointment offers, and negotiating the exchange of personal information between both parties when a transaction is conducted, as well as provide ancillary product suggestions. The system provides functionality to match a submitted appointment offer anonymously with at least one professional service provider. Additionally, the system provides automated features that improve matching of the appointment opening and the appointment offer by user submitted parameters of system derived value optimums.
摘要翻译：买方和至少一个专业服务提供者间接购买程序服务的方法是一种基于软件的系统，通过接收，验证和协商潜在客户和专业服务提供商之间的交易，同时提供隐私权双方直到进行交易。该系统包括以下步骤：接收和索引提供者的约会开放，接收和索引来自买方的约会提议，匹配约会开放与约会提议，匿名约会提供，以及在进行交易时双方交流个人信息，作为以及提供配套产品建议。该系统提供了与至少一个专业服务提供商匿名提交的约会提供的功能。此外，该系统提供自动化功能，可改善用户提交的系统派生值最优参数的约会开放和约会提供的匹配。

14. 发明申请

US20140304021A1 Method for Brokering Purchases of Procedural Services 审中-公开
标题翻译：中介程序服务采购方法
公开(公告)号：US20140304021A1
公开(公告)日：2014-10-09
申请号：US14227312
申请日：2014-03-27
申请人： Vikash Banthia , Vishal Banthia
发明人： Vikash Banthia , Vishal Banthia
IPC分类号： G06Q30/06 , G06Q10/10
CPC分类号： G06Q30/0615 , G06Q10/1095 , G06Q30/08 , G06Q50/22
摘要： A method for brokering purchases of procedural services between a buyer and at least one professional service provider is a software-based system that negotiates transactions between potential clients and professional service providers by receiving, verifying, and negotiating appointment availabilities and appointment offers while providing privacy to both parties until a transaction is conducted. The system comprises the steps of receiving and indexing appointment openings from providers, receiving and indexing appointment offers from buyers, matching appointment opening with appointment offers, anonymizing appointment offers, and negotiating the exchange of personal information between both parties when a transaction is conducted, as well as provide ancillary product suggestions. The system provides functionality to match a submitted appointment offer anonymously with at least one professional service provider. Additionally, the system provides automated features that improve matching of the appointment opening and the appointment offer by user submitted parameters of system derived value optimums.
摘要翻译：买方和至少一个专业服务提供者间接购买程序服务的方法是一种基于软件的系统，通过接收，验证和协商潜在客户和专业服务提供商之间的交易，同时提供隐私权双方直到进行交易。该系统包括以下步骤：接收和索引提供者的约会开放，接收和索引来自买方的约会提议，匹配约会开放与约会提议，匿名约会提供，以及在进行交易时双方交流个人信息，作为以及提供配套产品建议。该系统提供了与至少一个专业服务提供商匿名提交的约会提供的功能。此外，该系统提供自动化功能，可改善用户提交的系统派生值最优参数的约会开放和约会提供的匹配。

15. 发明授权

US06843882B2 Gas flow control in a wafer processing system having multiple chambers for performing same process 失效
标题翻译：在具有用于执行相同处理的多个室的晶片处理系统中的气体流量控制
公开(公告)号：US06843882B2
公开(公告)日：2005-01-18
申请号：US10263556
申请日：2002-10-02
申请人： Karthik Janakiraman , Victor Wang , Vikash Banthia , Teresa Winson , Nitin Ingle
发明人： Karthik Janakiraman , Victor Wang , Vikash Banthia , Teresa Winson , Nitin Ingle
IPC分类号： C23C16/44 , C23C16/455 , C23C16/52 , H01L21/00 , H01L21/677 , C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： H01L21/67754 , C23C16/4412 , C23C16/455 , C23C16/52 , H01L21/67017 , H01L21/67178 , H01L21/6719
摘要： A system for processing substrates comprises a plurality of process chambers. Each process chamber includes an inlet gas distribution member connected to an inlet gas line to distribute gas from the inlet gas line into the process chamber, and a gas outlet. The inlet gas distribution member has an inlet gas distribution member impedance to a gas flow through the inlet gas distribution member into the process chamber. The plurality of process chambers are substantially identical. A source gas delivery line is connected to the inlet gas lines of the plurality of process chambers to supply a gas flow to be divided into the inlet gas lines. A plurality of tunable upstream gas restrictors are each disposed in one of the inlet gas lines connected to the inlet gas distribution members of the process chambers and are configured to adjust a flow rate into the corresponding process chamber.
摘要翻译：用于处理衬底的系统包括多个处理室。每个处理室包括连接到入口气体管线以将气体从入口气体管线分配到处理室中的入口气体分配构件和气体出口。入口气体分配构件具有入口气体分配构件对通过入口气体分配构件的气体流入处理室的阻抗。多个处理室基本相同。源气体输送管线连接到多个处理室的入口气体管线，以供应待分成入口气体管线的气流。多个可调节的上游气体限制器分别设置在连接到处理室的入口气体分配构件的入口气体管线中的一个中，并且被配置为调节进入相应处理室的流量。

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