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    • 14. 发明授权
    • Light emitting diode package
    • 发光二极管封装
    • US08373180B2
    • 2013-02-12
    • US12443314
    • 2007-09-21
    • Hwa Ja KimNam Young KimMyung Hee LeeKyoung Bo HanTae Kwang KimJi Seop So
    • Hwa Ja KimNam Young KimMyung Hee LeeKyoung Bo HanTae Kwang KimJi Seop So
    • H01L33/00
    • H01L33/486H01L33/54H01L2224/48091H01L2224/48247H01L2924/00014
    • A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.
    • 公开了一种用于从发光二极管芯片发射的朝向侧面发射光的侧视型发光二极管封装。 侧视型发光二极管封装包括具有用于在发光方向上曝光发光二极管芯片的开口部分的封装体; 以及覆盖所述发光二极管芯片的透光性树脂,其中,所述开口部的内壁的至少一部分形成有用于将所述开口部分分割成上部和下部的台阶突起,并且所述开口的下部 在台阶突起下面的部分填充有可透光树脂。 因此,可以容易地形成具有凸透镜形状的透光性树脂,从而可以提高其发光效率。