专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US08279621B2 AC—LED system in single chip with three metal contacts 有权
标题翻译： AC-LED系统采用单芯片三金属触点
公开(公告)号：US08279621B2
公开(公告)日：2012-10-02
申请号：US13083142
申请日：2011-04-08
申请人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
发明人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
IPC分类号： G11C11/00
CPC分类号： H05B33/0803 , H05B33/0809 , H05B33/0821
摘要： A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.
摘要翻译：多个AC_LED单元耦合并设置在单个芯片上以在单芯片中形成AC_LED系统。或者，还公开了具有四个金属触点的单芯片中的AC LED系统。

12. 发明授权

US07775784B2 Light-emitting diode packaging apparatus, mold base and supporting member thereof 有权
标题翻译：发光二极管封装装置，模具基座及其支撑部件
公开(公告)号：US07775784B2
公开(公告)日：2010-08-17
申请号：US11802883
申请日：2007-05-25
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01L21/56
CPC分类号： B29C41/20 , B29L2011/0016
摘要： A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.
摘要翻译：公开了一种发光二极管封装装置，其用于具有插入其中的多个支撑件用于随后的模制和包装操作的支撑构件，包括用于支撑构件的多个支撑件的模座插入其中，以及控制器，用于插入到模具基座中并定位支撑构件。本发明的特征在于，在每个支撑件的至少一个电极销的周边处形成定位脚，并且还在模座的模具杯上形成相应的第一定位孔，用于支撑件的定位。本发明还提供了一种用于发光二极管封装装置的模具基座和支撑件。

13. 发明申请

US20080149951A1 Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：US20080149951A1
公开(公告)日：2008-06-26
申请号：US11643786
申请日：2006-12-22
申请人： Ming-Te Lin , Hsi-Hsuan Yen , Ming-Yao Lin , Wen-Yung Yeh , Chia-Chang Kuo , Sheng-Pan Huang
发明人： Ming-Te Lin , Hsi-Hsuan Yen , Ming-Yao Lin , Wen-Yung Yeh , Chia-Chang Kuo , Sheng-Pan Huang
IPC分类号： H01L33/00 , H01L29/205
CPC分类号： H01L25/167 , H01L25/0753 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/09701 , H01L2924/3011 , H01L2924/00014
摘要： A light emitting device including a carrying element having two electric conductors connectable to a power source, a light emitting element disposed on the carrying element and electrically connected to the two electric conductors, and at least one correction element electrically connected to the light emitting element, wherein the light emitting element is adapted to provide a light source upon connection of the two electric conductors with the power source, and the at least one correction element allows the light emitting element to have functions of temperature compensation, voltage correction, or surge absorption.
摘要翻译：一种发光器件，包括具有可连接到电源的两个电导体的携带元件，设置在所述承载元件上并电连接到所述两个电导体的发光元件以及电连接到所述发光元件的至少一个校正元件，其中所述发光元件适于在所述两个电导体与所述电源连接时提供光源，并且所述至少一个校正元件允许所述发光元件具有温度补偿，电压校正或浪涌吸收的功能。

14. 发明申请

US20070091641A1 Backlight structure 审中-公开
标题翻译：背光结构
公开(公告)号：US20070091641A1
公开(公告)日：2007-04-26
申请号：US11583944
申请日：2006-10-20
申请人： Ming-Te Lin , Sheng-Pan Huang , Shang-Ping Ying , Ya-Hui Chiang , Ming-Yao Lin
发明人： Ming-Te Lin , Sheng-Pan Huang , Shang-Ping Ying , Ya-Hui Chiang , Ming-Yao Lin
IPC分类号： F21V7/04
CPC分类号： G02F1/133605 , G02B6/0031 , G02B6/0046 , G02B6/0078 , G02F1/133603 , G02F1/133609
摘要： A backlight structure is disclosed, which is constituted of a series of backlight devices connecting with one another to form a large-scale backlight area, the backlight device at least being composed of an emitting portion and a light-guiding portion, wherein the emitting portion provides a light source, mixes the light of the light source and provides the mixed light into the light-guiding portion, which then guides the mixed light out. The emitting portion connects with the light-guiding portion to form a fault structure for connecting with another light-guiding portion, thereby forming a large-scale backlight structure by connecting a sequence of the light-guiding portions using the fault structures without size constraints.
摘要翻译：公开了一种背光结构，其由相互连接以形成大规模背光区域的一系列背光装置构成，所述背光装置至少由发光部分和导光部分组成，其中所述发光部分提供光源，混合光源的光，并将混合光提供到导光部分，然后引导混合光。发光部分与导光部分连接以形成用于与另一个导光部分连接的故障结构，从而通过使用故障结构连接一系列导光部分而没有尺寸限制来形成大规模的背光结构。

15. 发明申请

US20070080354A1 Power package and fabrication method thereof 审中-公开
标题翻译：电源封装及其制造方法
公开(公告)号：US20070080354A1
公开(公告)日：2007-04-12
申请号：US11544046
申请日：2006-10-06
申请人： Ming-Yao Lin , Ming-Te Lin , Sheng-Pan Huang , Chia-Chang Kuo , Chiu-Ling Chen
发明人： Ming-Yao Lin , Ming-Te Lin , Sheng-Pan Huang , Chia-Chang Kuo , Chiu-Ling Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L24/97 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48247 , H01L2924/12041 , H01L2224/48091 , H01L2924/00014
摘要： The present invention relates to a combined light emitting diode (LED) package structure and a fabricating method for fabricating the same. The combined LED package structure includes an LED chip, a conductive structure and an encapsulant. The encapsulant encapsulates the LED chip and a portion of the conductive structure. The conductive structure has a thick metal member and a thin metal member. The thick metal member is used for carrying the LED chip, provide heat absorbing and heat dissipating paths to the LED chip, the bottom and a portion of the lateral side thereof are exposed to the outside of the encapsulant to increase heat dissipating area. The thin metal member is electrically connected to the LED chip via at least two conductive leads which are extended to a region outside of the encapsulant to serve as outside electrodes of the LED package structure.
摘要翻译：本发明涉及一种组合发光二极管（LED）封装结构及其制造方法。组合的LED封装结构包括LED芯片，导电结构和密封剂。密封剂封装LED芯片和导电结构的一部分。导电结构具有厚金属构件和薄金属构件。厚金属构件用于承载LED芯片，为LED芯片提供吸热和散热路径，底部和其侧面的一部分暴露于密封剂的外部以增加散热面积。该薄金属构件经由至少两个导电引线电连接到LED芯片，该导电引线延伸到封装体外部的区域，以用作LED封装结构的外部电极。

16. 发明申请

US20070074061A1 Bus receiver and method of deskewing bus signals 有权
标题翻译：总线接收器和校正总线信号的校正方法
公开(公告)号：US20070074061A1
公开(公告)日：2007-03-29
申请号：US11513198
申请日：2006-08-31
申请人： Ming-Te Lin , Chi Chang
发明人： Ming-Te Lin , Chi Chang
IPC分类号： G06F1/00
CPC分类号： G06F13/4072
摘要： A bus receiver receives at least one first signal and a second signal both generated from a chip connected to a parallel bus. The bus receiver includes a receiving module and a deskewing module. The receiving module is electrically connected to the parallel bus and receives the first signal and the second signal transmitted through the parallel bus. The deskewing module is electrically connected to the receiving module and deskews the phase of the first signal and the phase of the second signal. The first signal and the second signal are in the same phase.
摘要翻译：总线接收器接收从连接到并行总线的芯片产生的至少一个第一信号和第二信号。总线接收器包括接收模块和偏移模块。接收模块电连接到并行总线，并接收通过并行总线传输的第一信号和第二信号。歪斜模块电连接到接收模块，并且对第一信号的相位和第二信号的相位进行歪斜。第一信号和第二信号处于相同的相位。

17. 发明申请

US20140333979A1 LASER SCANNING DEVICE AND CONTROL METHOD THEREOF 审中-公开
标题翻译：激光扫描装置及其控制方法
公开(公告)号：US20140333979A1
公开(公告)日：2014-11-13
申请号：US14259122
申请日：2014-04-22
申请人： Chi-Hsun Huang , Lei-Chih Chang , Chung-Lung Yang , Ming-Te Lin
发明人： Chi-Hsun Huang , Lei-Chih Chang , Chung-Lung Yang , Ming-Te Lin
IPC分类号： G02B26/10
CPC分类号： G02B26/105
摘要： A laser scanning device and a control method thereof are provided. The method includes: providing a control signal to an oscillating reflective mirror of the device; setting a frequency of the control signal gradually decreased from a maximal-setting-value of a resonant frequency of the mirror; judging whether a light detector receives a laser light reflected by the mirror according to an edge signal of the detector; judging whether a pulse width of the edge signal is equal to a predetermined pulse width when the detector receives the laser light: (1) increasing the frequency of the control signal when the pulse width of the edge signal is greater than the predetermined pulse width, (2) decreasing the frequency of the control signal when the pulse width of the edge signal is less than the predetermined pulse width. The time and labor for measuring the scanning frequency of the mirror may be saved.
摘要翻译：提供了一种激光扫描装置及其控制方法。该方法包括：向设备的振荡反射镜提供控制信号; 将所述控制信号的频率从所述反射镜的共振频率的最大设定值逐渐减小; 判断光检测器是否根据检测器的边缘信号接收由反射镜反射的激光; 当检测器接收到激光时，判断边缘信号的脉冲宽度是否等于预定脉冲宽度：（1）当边缘信号的脉冲宽度大于预定脉冲宽度时增加控制信号的频率，（2）当边缘信号的脉冲宽度小于预定脉冲宽度时，降低控制信号的频率。可以节省测量镜子扫描频率的时间和人力。

18. 发明授权

US08847239B2 AC LED device and method for fabricating the same 有权
标题翻译：交流LED装置及其制造方法
公开(公告)号：US08847239B2
公开(公告)日：2014-09-30
申请号：US12499073
申请日：2009-07-07
申请人： Ming-Te Lin
发明人： Ming-Te Lin
IPC分类号： H01L27/15 , H05B33/08 , F21K99/00 , H01L25/075
CPC分类号： H05B33/0821 , F21K9/00 , H01L25/0753 , H01L2224/48091 , H01L2224/48137 , Y02B20/342 , Y02B20/348 , H01L2924/00014
摘要： An LED device includes a substrate including a first and second light emitting modules, and first and second opposite sides. The first light emitting module includes a first conductive electrode located adjacent to the first side, a second conductive electrode located adjacent to the second side, and a first plurality of light emitting micro diodes electrically connected in the form of a plurality of serially connected bridge rectifiers between the first conductive electrode and the second conductive electrode. The second light emitting module includes a third conductive electrode located adjacent to the first side, a fourth conductive electrode adjacent to the second side, and a second plurality of light emitting micro diodes electrically connected in the form of a plurality of serially connected bridge rectifiers between the third conductive electrode and the fourth conductive electrode. The first, second, third, and fourth conductive electrodes are physically separated from each other.
摘要翻译： LED装置包括具有第一和第二发光模块以及第一和第二相对侧的基板。第一发光模块包括位于第一侧附近的第一导电电极，位于第二侧附近的第二导电电极和以多个串联连接的桥式整流器形式电连接的第一多个发光微型二极管在第一导电电极和第二导电电极之间。第二发光模块包括位于第一侧附近的第三导电电极，与第二侧相邻的第四导电电极和以多个串联连接的桥式整流器的形式电连接的第二多个发光微型二极管，第三导电电极和第四导电电极。第一，第二，第三和第四导电电极在物理上彼此分离。

19. 发明授权

US08591067B2 Light source device 有权
标题翻译：光源装置
公开(公告)号：US08591067B2
公开(公告)日：2013-11-26
申请号：US12944698
申请日：2010-11-11
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Po-Cheng Yang
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Po-Cheng Yang
IPC分类号： F21V29/00 , B60Q1/06
CPC分类号： F21V29/83 , F21K9/23 , F21V3/00 , F21V29/506 , F21V29/673 , F21W2121/00 , F21Y2115/10
摘要： A light source device having a good heat dissipation capability is disclosed, in which heat generated by a light emitting device is conducted to a base fabricated by a porous material through a heat conducting mask or a heat conducting pipe. Due to a large area contact between the heat conducting mask or the heat conducting pipe and the base, the heat can be evenly conducted to the base, so that the base can absorb the heat and dissipate the heat to external, so as to improve a heat dissipation efficiency. Moreover, in the light source device of the disclosure, heat exchange of the light emitting device can be directly carried on through air convection, so that the heat generated by the light emitting device can be taken away from the light source device through heat exchange of cool air.
摘要翻译：公开了一种具有良好的散热能力的光源装置，其中由发光装置产生的热量通过导热掩模或导热管被传导到由多孔材料制成的基底。由于导热罩或导热管与基座之间的大面积接触，热量可以均匀地传导到基座，使得基座可以吸收热量并将热量散发到外部，从而改善散热效率。此外，在本公开的光源装置中，可以通过空气对流直接进行发光装置的热交换，使得由发光装置产生的热量可以通过热交换器冷空气。

20. 发明授权

US08503500B2 Alternating current light emitting device 有权
标题翻译：交流发光装置
公开(公告)号：US08503500B2
公开(公告)日：2013-08-06
申请号：US12021072
申请日：2008-01-28
申请人： Ming-Te Lin , Hsi-Hsuan Yen , Wen-Yung Yeh , Ming-Yao Lin , Sheng-Pan Huang
发明人： Ming-Te Lin , Hsi-Hsuan Yen , Wen-Yung Yeh , Ming-Yao Lin , Sheng-Pan Huang
IPC分类号： H01S3/14
CPC分类号： H01L25/0753 , F21K9/00 , H01L27/156 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device and the fabrication method includes forming one or more light emitting modules on a substrate. The light emitting module receives an alternating current input and has at least two micro diodes. Each micro diode has at least two active layers and is electrically connected by a conductive structure so as to allow the active layers of the micro diodes to alternately emit light during positive and negative cycles of the alternating-current input.
摘要翻译：发光器件和制造方法包括在衬底上形成一个或多个发光模块。发光模块接收交流电输入并具有至少两个微型二极管。每个微二极管具有至少两个有源层并且通过导电结构电连接，以便允许微二极管的有源层在交流输入的正周期和负周期期间交替地发光。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式