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    • 11. 发明授权
    • Photosensitive polyimide precursor and process for producing the same
    • 感光聚酰亚胺前体及其制备方法
    • US4670535A
    • 1987-06-02
    • US875044
    • 1986-06-17
    • Akitoshi SugioTakao KawakiKatsushige Hayashi
    • Akitoshi SugioTakao KawakiKatsushige Hayashi
    • C08G73/00C08F290/00C08F299/02C08G73/10C08G73/12G03F7/038C08G16/00
    • C08G73/1082G03F7/0387
    • The photosensitive polyimide precursor of the invention has a recurring unit represented by the following general formula [I]: ##STR1## (R.sub.1 represents a tetravalent aromatic hydrocarbon residue; R.sub.2 and R.sub.3 each represent a divalent aromatic or aliphatic hydrocarbon residue; and R.sub.4 represents a divalent aromatic hydrocarbon residue represented by ##STR2## wherein R.sub.5, R.sub.6, R.sub.7, R.sub.8, R.sub.9, R.sub.10, R.sub.11 and R.sub.12, identical or different, each represent hydrogen atom, a halogen group or an alkyl group). The photosensitive polyimide precursor of the invention has a viscosity of 50 centipoises or above as measured at 23.degree. C. in the state of a 10% (by weight) solution in N,N-dimethylacetamide. Its photosensitivity is as high as about 20-100 times that of prior products. After heat cyclization, it exhibits a heat resistance of 400.degree. C. or above.The photosensitive polyimide precursor of the invention can be produced by subjecting a tetracarboxylic acid dianhydride and a diamino compound to a polycondensation reaction in an organic polar solvent.
    • 本发明的光敏聚酰亚胺前体具有由以下通式[I]表示的重复单元:(R 1表示四价芳烃残基; R 2和R 3各自表示二价芳族或脂族烃 R4代表由下式表示的二价芳烃残基:其中R5,R6,R7,R8,R9,R10,R11和R12相同或不同,分别代表氢原子,卤素基团或烷基)。 本发明的光敏聚酰亚胺前体在23℃下的粘度为10厘泊(N,N-二甲基乙酰胺)溶液的状态下的粘度为50厘泊或更高。 其光敏度高达现有产品的约20-100倍。 热环化后,其耐热性为400℃以上。 本发明的感光性聚酰亚胺前体可以通过在有机极性溶剂中使四羧酸二酐和二氨基化合物进行缩聚反应来制造。