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11. 发明申请

US20070252227A1 Optical apparatus and optical module using the same 有权
标题翻译：光学装置和使用其的光学模块
公开(公告)号：US20070252227A1
公开(公告)日：2007-11-01
申请号：US11698100
申请日：2007-01-26
申请人： Toshiyuki Fukuda , Yoshiki Takayama , Masanori Minamio , Tetsushi Nishio , Yutaka Harada
发明人： Toshiyuki Fukuda , Yoshiki Takayama , Masanori Minamio , Tetsushi Nishio , Yutaka Harada
IPC分类号： H01L31/0232
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/0232 , H01L33/483 , H01L33/58 , H01L33/62 , H01L2224/05026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/73204 , H01L2924/00014
摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.
摘要翻译：光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件，在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂。在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光学装置的电极和透明构件电连接并且还通过透明粘合剂粘合。

12. 发明申请

US20050110121A1 Lead frame, resin-encapsulated semiconductor device, and method of producing the same 有权
标题翻译：引线框架，树脂封装半导体器件及其制造方法
公开(公告)号：US20050110121A1
公开(公告)日：2005-05-26
申请号：US11018541
申请日：2004-12-21
申请人： Masanori Minamio , Haruto Nagata , Tetsushi Nishio
发明人： Masanori Minamio , Haruto Nagata , Tetsushi Nishio
IPC分类号： H01L23/12 , H01L21/50 , H01L21/56 , H01L23/28 , H01L23/48 , H01L23/495 , H01L23/50 , H01L25/10
CPC分类号： H01L23/4951 , H01L21/56 , H01L23/4952 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/16145 , H01L2224/16245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06586 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2924/00
摘要： A resin-encapsulated semiconductor device includes: a semiconductor chip on a surface of which a group of electrodes is disposed; a plurality of inner leads arranged along a periphery of the semiconductor chip; connecting members for connecting the electrodes of the semiconductor chip with the respective inner leads, an encapsulating resin for encapsulating surfaces of the semiconductor chip and the connecting members; and external electrodes exposed from the encapsulating resin. Each of the inner leads extends across the periphery of the semiconductor chip from an internal side to an external side of the periphery, and includes a protruded portion provided on a surface of the inner lead on an external side relative to the periphery of the semiconductor chip, the protruded portion being protruded in a thickness direction. Conductive bumps as the connecting members on the electrodes of the semiconductor chip are connected with internal portions of the respective inner leads, the internal portions being positioned inward relative to the protruded portions. The external electrodes are formed on surfaces of the protruded portions, and tip ends of the external electrodes are protruded relative to a back face of the semiconductor chip.
摘要翻译：树脂封装的半导体器件包括：在其表面上设置一组电极的半导体芯片; 沿着半导体芯片的周边布置的多个内引线; 用于将半导体芯片的电极与各个内部引线连接的连接构件，用于封装半导体芯片和连接构件的表面的封装树脂; 和从封装树脂露出的外部电极。每个内引线从外周的内侧延伸到半导体芯片的周边，并且包括设置在内引线的相对于半导体芯片周边的外侧的表面上的突出部突出部分沿厚度方向突出。作为半导体芯片的电极上的连接构件的导电凸块与内部引线的内部部分连接，内部部分相对于突出部分位于内侧。外部电极形成在突出部的表面上，外部电极的前端相对于半导体芯片的背面突出。

13. 发明授权

US06864117B2 Method for producing solid-state imaging device 有权
标题翻译：固态成像装置的制造方法
公开(公告)号：US06864117B2
公开(公告)日：2005-03-08
申请号：US10669229
申请日：2003-09-24
申请人： Masanori Minamio , Hiroshi Horiki , Tetsushi Nishio
发明人： Masanori Minamio , Hiroshi Horiki , Tetsushi Nishio
IPC分类号： H01L27/14 , H01L23/00 , H01L23/08 , H01L27/146 , H01L31/02 , H01L31/0203 , H04N5/335 , H01L21/00
CPC分类号： H01L27/14601 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599
摘要： A method for producing a solid-state imaging device including a base of an insulation material having a frame form in planar shape with an aperture formed in an inner region thereof and having a substantially uniform thickness; a wiring provided on one surface of the base and extending toward the outside from the peripheral portion of the aperture; and an imaging element mounted on the surface of the base provided with the wiring so that a light-receptive region of the element faces the aperture. Cavities for resin-molding a plurality of the bases are formed and a tape member supporting thin metal plate leads for forming a plurality of sets of wirings corresponding to the respective bases is loaded between molds having pins for forming positioning holes of the base; and the thin metal plate leads are placed in the cavities. Then, a sealing resin is filled in the cavities and cured. A resin molded member, in which the thin metal plate leads are embedded, is taken out; and the tape member is removed from the resin molded member, and the resin molded member is divided into a plurality of pieces on which an imaging element is mounted. The base on which the imaging element is mounted can be formed to have a practically sufficient flatness.
摘要翻译：一种固体摄像装置的制造方法，其特征在于，包括：具有平面形状的框架形状的绝缘材料的基部，所述绝缘材料的底部形成在其内部区域中并且具有基本均匀的厚度; 设置在基座的一个表面上并从孔的周边部分朝向外部延伸的布线; 以及安装在设置有布线的基座的表面上的成像元件，使得元件的光接收区域面向孔。形成用于树脂成型多个基座的腔体，并且在具有用于形成基座的定位孔的销的模具之间装载用于形成与各个基座相对应的多组布线的用于形成多组布线的支撑薄金属板引线的带构件引线; 并且薄金属板引线被放置在空腔中。然后，将密封树脂填充到空腔中并固化。将金属板引线嵌入其中的树脂模制件被取出; 从树脂成型体除去带状部件，将树脂成形体分割成安装有摄像元件的多个片。安装成像元件的基座可以形成为具有实际上足够的平坦度。

14. 发明申请

US20110163328A1 OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：光学半导体器件
公开(公告)号：US20110163328A1
公开(公告)日：2011-07-07
申请号：US13048221
申请日：2011-03-15
申请人： Yoshiki TAKAYAMA , Masanori Minamio , Tetsushi Nishio
发明人： Yoshiki TAKAYAMA , Masanori Minamio , Tetsushi Nishio
IPC分类号： H01L33/48
CPC分类号： H01L31/0203 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.
摘要翻译：光学半导体器件包括：具有底部和侧壁部分的封装; 半导体芯片，其具有在其一个表面上形成并且具有与固定到封装的底部的一个表面相对的表面的光学元件; 固定到所述半导体芯片以便覆盖所述光学元件的透明构件; 以及填充封装和半导体芯片之间的空间的密封树脂。侧壁部分的上部具有向包装内部突出的突出部分。透明构件从由突出部形成的窗口部露出。

15. 发明授权

US07153042B2 Optic device 有权
公开(公告)号：US07153042B2
公开(公告)日：2006-12-26
申请号：US11152253
申请日：2005-06-15
申请人： Masanori Minamio , Tetsushi Nishio , Toshiyuki Fukuda
发明人： Masanori Minamio , Tetsushi Nishio , Toshiyuki Fukuda
IPC分类号： G02B6/36 , G02B6/42
CPC分类号： H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H01L2224/49433 , H01L2924/00014
摘要： An optic device includes a base, an optical chip mounted on the base, and a transparent plate. A cylinder mirror in which an imaging optical system is incorporated is fitted on the base of the optic device, wherein a pair of positioning pins are provided at the bottom of the cylinder mirror. First positioning holes for defining a mounting position of the cylinder mirror to the base and second positioning holes having a smaller diameter than that of the first positioning holes for defining a mounting position of the optical chip to the base are formed in the base of the optic device.

16. 发明授权

US07132315B2 Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same 有权
公开(公告)号：US07132315B2
公开(公告)日：2006-11-07
申请号：US11154541
申请日：2005-06-17
申请人： Masanori Minamio , Hiroshi Horiki , Tetsushi Nishio
发明人： Masanori Minamio , Hiroshi Horiki , Tetsushi Nishio
IPC分类号： H01L21/50 , H01L23/495
CPC分类号： H01L21/568 , H01L21/565 , H01L23/3107 , H01L23/49548 , H01L24/48 , H01L2224/05599 , H01L2224/32014 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： An inventive leadframe includes an outer frame, a die pad, and a plurality of leads each having land portions and connections. The land portions each have an upper surface serving as a bonding pad to be connected with a metal wiring, and a lowermost part serving as an external terminal. The connections are each devoid of its lower part so as to be thinner than the land portion, and are provided between the outer frame and the land portions, between the land portions associated with each other in each lead, and between the land portions and the die pad. Furthermore, the inventive leadframe is provided with no member that functions as a suspension lead for connecting the outer frame and the die pad to each other during plastic encapsulation.

17. 发明申请

US20050236701A1 Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same 有权
标题翻译：引线框，塑料封装的半导体器件及其制造方法
公开(公告)号：US20050236701A1
公开(公告)日：2005-10-27
申请号：US11154541
申请日：2005-06-17
申请人： Masanori Minamio , Hiroshi Horiki , Tetsushi Nishio
发明人： Masanori Minamio , Hiroshi Horiki , Tetsushi Nishio
IPC分类号： H01L21/56 , H01L21/68 , H01L23/31 , H01L23/495
CPC分类号： H01L21/568 , H01L21/565 , H01L23/3107 , H01L23/49548 , H01L24/48 , H01L2224/05599 , H01L2224/32014 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： An inventive leadframe includes an outer frame, a die pad, and a plurality of leads each having land portions and connections. The land portions each have an upper surface serving as a bonding pad to be connected with a metal wiring, and a lowermost part serving as an external terminal. The connections are each devoid of its lower part so as to be thinner than the land portion, and are provided between the outer frame and the land portions, between the land portions associated with each other in each lead, and between the land portions and the die pad. Furthermore, the inventive leadframe is provided with no member that functions as a suspension lead for connecting the outer frame and the die pad to each other during plastic encapsulation.
摘要翻译：本发明的引线框架包括外框架，芯片焊盘和多个引线，每个引线具有焊盘部分和连接。接地部分各自具有用作与金属布线连接的接合焊盘的上表面和用作外部端子的最下部分。这些连接部分的下部部分都不比陆部部分薄，并且设置在外框架和陆部之间，在每个引线中彼此相关联的陆部部分之间以及陆地部分和陆地部分之间芯片垫此外，本发明的引线框架没有提供用作在塑料封装期间将外框架和管芯焊盘彼此连接的悬挂引线的构件。

18. 发明授权

US07528884B2 Optical device 有权
标题翻译：光学装置
公开(公告)号：US07528884B2
公开(公告)日：2009-05-05
申请号：US10975016
申请日：2004-10-28
申请人： Masanori Minamio , Tetsushi Nishio
发明人： Masanori Minamio , Tetsushi Nishio
IPC分类号： H04N5/225
CPC分类号： H01L31/0203 , H01L25/167 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An optical device includes a base of ring shape, and an optical chip and a transparent plate both attached to the base. The upper surface of the base is formed with a tapered recess inclined downwardly from its flat portion toward the opening. A gap between the tapered recess and the transparent plate is formed with an adhesive layer. Even if a gap between the transparent plate and the flat portion of the base is narrowed, the adhesive layer with a great thickness present between the tapered recess and the lower surface of the transparent plate maintains the mechanical adhesion strength between the base and the transparent plate. A raised ring and a recessed ring prevent adhesive from entering a positioning hole and the opening.
摘要翻译：光学装置包括环形基座，以及光学芯片和透明板，两者均安装在基座上。底座的上表面形成有从其平坦部分朝向开口向下倾斜的锥形凹槽。锥形凹部和透明板之间的间隙形成有粘合剂层。即使透明板与基体的平坦部之间的间隙变窄，存在于锥形凹部与透明板的下表面之间的厚度较大的粘合剂层保持基部与透明板之间的机械粘合强度。凸环和凹环防止粘合剂进入定位孔和开口。

19. 发明申请

US20070007633A1 Lead frame, resin-encapsulated semiconductor device, and method of producing the same 审中-公开
标题翻译：引线框架，树脂封装半导体器件及其制造方法
公开(公告)号：US20070007633A1
公开(公告)日：2007-01-11
申请号：US11522078
申请日：2006-09-15
申请人： Masanori Minamio , Haruto Nagata , Tetsushi Nishio
发明人： Masanori Minamio , Haruto Nagata , Tetsushi Nishio
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L21/56 , H01L23/4952 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/16145 , H01L2224/16245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06586 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2924/00
摘要： A resin-encapsulated semiconductor device includes: a semiconductor chip on a surface of which a group of electrodes is disposed; a plurality of inner leads arranged along a periphery of the semiconductor chip; connecting members for connecting the electrodes of the semiconductor chip with the respective inner leads, an encapsulating resin for encapsulating surfaces of the semiconductor chip and the connecting members; and external electrodes exposed from the encapsulating resin. Each of the inner leads extends across the periphery of the semiconductor chip from an internal side to an external side of the periphery, and includes a protruded portion provided on a surface of the inner lead on an external side relative to the periphery of the semiconductor chip, the protruded portion being protruded in a thickness direction. Conductive bumps as the connecting members on the electrodes of the semiconductor chip are connected with internal portions of the respective inner leads, the internal portions being positioned inward relative to the protruded portions. The external electrodes are formed on surfaces of the protruded portions, and tip ends of the external electrodes are protruded relative to a back face of the semiconductor chip.
摘要翻译：树脂封装的半导体器件包括：在其表面上设置一组电极的半导体芯片; 沿着半导体芯片的周边布置的多个内引线; 用于将半导体芯片的电极与各个内部引线连接的连接构件，用于封装半导体芯片和连接构件的表面的封装树脂; 和从封装树脂露出的外部电极。每个内引线从外周的内侧延伸到半导体芯片的周边，并且包括设置在内引线的相对于半导体芯片周边的外侧的表面上的突出部突出部分沿厚度方向突出。作为半导体芯片的电极上的连接构件的导电凸块与内部引线的内部部分连接，内部部分相对于突出部分位于内侧。外部电极形成在突出部的表面上，外部电极的前端相对于半导体芯片的背面突出。

20. 发明申请

US20060121184A1 Photocurable-resin application method and bonding method 审中-公开
标题翻译：光固树脂施用方法和粘合方法
公开(公告)号：US20060121184A1
公开(公告)日：2006-06-08
申请号：US11269748
申请日：2005-11-09
申请人： Masanori Minamio , Tetsushi Nishio , Toshiyuki Fukuda
发明人： Masanori Minamio , Tetsushi Nishio , Toshiyuki Fukuda
IPC分类号： B05D5/06
CPC分类号： H01L27/14618 , B05D1/286 , B05D3/067 , H01L23/10 , H01L27/14623 , H01L2224/48091 , H01L2924/16195 , H01L2924/00014
摘要： An adhesive sheet is attached to a package substrate having a through hole so that an ultraviolet (UV) curable resin layer of the adhesive sheet faces the package substrate. Light is then radiated to the UV curable resin layer through the through hole in order to cure the exposed part of the UV curable resin layer. The cured part of the UV curable resin layer is removed together with a base film of the adhesive sheet. A glass plate is then attached to the UV curable resin remaining on the package substrate. Light is then radiated to bond the glass plate to the package substrate.
摘要翻译：将粘合片附着到具有通孔的封装基板上，使得粘合片的紫外线（UV）固化树脂层面向封装基板。然后通过通孔将光照射到UV固化树脂层，以固化UV可固化树脂层的暴露部分。 UV固化树脂层的固化部分与粘合片的基膜一起除去。然后将玻璃板连接到残留在封装基板上的UV固化树脂。然后照射光以将玻璃板粘合到封装衬底。

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