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    • 13. 发明授权
    • Liquid metal, latching relay with face contact
    • 液态金属,带接触面的闭锁继电器
    • US06762378B1
    • 2004-07-13
    • US10413195
    • 2003-04-14
    • Marvin Glenn Wong
    • Marvin Glenn Wong
    • H01H2900
    • H01H57/00H01H1/0036H01H1/08H01H2001/0042H01H2029/008H01H2057/006
    • An electrical relay using conducting liquid in the switching mechanism. Two electrical contacts are held a small distance apart. The facing surfaces of the contacts each support a droplet of a conducting liquid, such as a liquid metal. A piezoelectric actuator is energized to reduce the gap between the electrical contacts, causing the two liquid metal droplets to coalesce and form an electrical circuit. The piezoelectric actuator is then de-energized and the electrical contacts return to their starting positions. The liquid metal droplets remain coalesced because of surface tension. The electrical circuit is broken by energizing a piezoelectric actuator to increase the gap between the electrical contacts and break the surface tension bond between the liquid metal droplets. The droplets remain separated when the piezoelectric actuator is de-energized because there is insufficient liquid metal to bridge the gap between the contacts. The relay is amenable to manufacture by micro-machining techniques.
    • 在开关机构中使用导电液体的继电器。 两个电触头间隔一小段距离。 触头的相对表面各自支撑导电液体的液滴,例如液体金属。 激励压电致动器以减小电触头之间的间隙,导致两个液体金属液滴聚结并形成电路。 然后,压电致动器被断电,并且电触头返回到它们的起始位置。 由于表面张力,液态金属液滴保持聚结。 通过激励压电致动器以增加电触点之间的间隙并破坏液态金属液滴之间的表面张力接合来断开电路。 当压电致动器断电时,液滴保持分离,因为液体金属不足以桥接接触件之间的间隙。 继电器适用于通过微加工技术制造。
    • 14. 发明授权
    • Fluid-based switches and methods for producing the same
    • 流体开关及其制造方法
    • US06759611B1
    • 2004-07-06
    • US10462472
    • 2003-06-16
    • Marvin Glenn WongPaul Carson
    • Marvin Glenn WongPaul Carson
    • H01H2900
    • H01H29/28H01H2029/008
    • Fluid-based switches and methods for producing the same are disclosed. In one embodiment, a method for producing a switch comprises depositing a first alignment pad on a first substrate, depositing a second alignment pad on a second substrate, depositing solder on at least one of the alignment pads, depositing a switching fluid on the first substrate, and mating the first substrate to the second substrate by aligning the alignment pads and heating the solder, the substrates defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.
    • 公开了基于流体的开关及其制造方法。 在一个实施例中,一种用于产生开关的方法包括在第一衬底上沉积第一对准焊盘,在第二衬底上沉积第二对准焊盘,在至少一个对准焊盘上沉积焊料,在第一衬底上沉积开关流体 并且通过对准所述对准焊盘并加热所述焊料来将所述第一衬底与所述第二衬底配合,所述衬底在其间限定保持所述开关流体的空腔,所述空腔的尺寸设计成允许所述开关流体在第一和第二状态之间移动。
    • 15. 发明授权
    • Multi-layer assembly of stacked LIMMS devices with liquid metal vias
    • 具有液态金属通孔的堆叠LIMMS器件的多层组装
    • US06759610B1
    • 2004-07-06
    • US10455031
    • 2003-06-05
    • Lewis R. DoveMarvin Glenn Wong
    • Lewis R. DoveMarvin Glenn Wong
    • H01H2900
    • H01H29/28H01H2029/008
    • The number of LIMMS devices in an assembly is increased by stacking multiple layers of LIMMS devices on top of one another, and interconnecting those device layers at an array of solder pads using solder balls. Each device layer uses vias to bring the needed conductors to the array of solder pads. All signals for the entire multi-layer assembly can be routed through the bottom LIMMS device layer to pass, through another array of solder pads onto a “mother substrate” of ceramic or other material that carries the multi-layer assembly. Alternatively, signals may enter or leave the upper LIMMS device layer by way of a flexible printed circuit harness. Vias may pass, either directly or by “dog legs” on interior surfaces, completely through the bottom LIMMS device layer, and through other device layers as needed. Opposing vias formed in the pair of substrates in a device layer have interior non-contacting pads that are bridged by a small ball of liquid metal held in place by a hole in a dielectric layer. Using patterned layers of dielectric to form bridging holes, cavities, channels and interconnecting passages for the LIMMS devices of both layers facilitates these needed vias and traces. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141A/D thick film compositions from DuPont.
    • 组装中LIMMS器件的数量通过将多层LIMMS器件堆叠在一起而增加,并且使用焊球将焊盘阵列上的那些器件层互连在一起。 每个器件层使用通孔将所需的导体带到焊盘阵列上。 用于整个多层组件的所有信号可以通过底部LIMMS器件层通过另一个焊盘阵列传递到陶瓷或承载多层组件的其它材料的“母体衬底”上。 或者,信号可以通过柔性印刷电路线束进入或离开上LIMMS设备层。 通孔可以直接或通过内表面上的“狗腿”完全通过底部LIMMS设备层,并根据需要通过其他设备层。 在器件层中的一对衬底中形成的相反的通孔具有内部非接触焊盘,其通过由电介质层中的孔保持就位的液体金属的小球桥接。 使用图案化的电介质层形成桥接孔,用于两层的LIMMS器件的空腔,通道和互连通道便于这些所需的通孔和迹线。 可以作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。
    • 18. 发明授权
    • Method and structure for a pusher-mode piezoelectrically actuated liquid metal switch
    • 推进式压电式液态金属开关的方法和结构
    • US07012354B2
    • 2006-03-14
    • US10413098
    • 2003-04-14
    • Marvin Glenn Wong
    • Marvin Glenn Wong
    • H01L41/08H01H29/02H01H57/00
    • H01H57/00H01H29/28H01H2029/008H01H2057/006
    • A method and structure for an electrical switch. According to the structure of the present invention, a liquid-filled chamber is housed within a solid material. A plurality of switch contacts within the liquid-filled chamber are coupled to the solid material, while a plurality of piezoelectric elements are coupled to a plurality of membranes. The plurality of membranes are coupled to the liquid-filled chamber. The plurality of switch contacts are coupled to a plurality of liquid metal globules. According to the method, a piezoelectric element is actuated, causing a membrane element to be deflected. The deflection of the membrane element increases pressure of actuator liquid and the increase in pressure of the actuator liquid breaks a liquid metal connection between a first contact and a second contact of the electrical switch.
    • 一种电气开关的方法和结构。 根据本发明的结构,将液体填充室容纳在固体材料内。 在液体填充室内的多个开关触点耦合到固体材料,而多个压电元件耦合到多个膜。 多个膜耦合到充满液体的腔室。 多个开关触点耦合到多个液态金属球。 根据该方法,致动压电元件,导致膜元件偏转。 膜元件的偏转增加致动器液体的压力,并且致动器液体的压力的增加破坏了电气开关的第一触点和第二触点之间的液态金属连接。