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11. 发明申请

US20110298140A1 Component having a through-contact 有权
标题翻译：具有通过接触的部件
公开(公告)号：US20110298140A1
公开(公告)日：2011-12-08
申请号：US13134075
申请日：2011-05-26
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： H01L23/48 , H01L21/283
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/7682 , H01L21/76898 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/48 , H01L2224/0345 , H01L2224/04042 , H01L2224/0508 , H01L2224/05624 , H01L2224/05655 , H01L2224/05666 , H01L2224/06181 , H01L2224/48463 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/1461 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing a component having a through-contact includes: providing a substrate; forming an insulating layer on the substrate; structuring the insulating layer, the insulating layer being removed at least in a predetermined trenching area surrounding a selected substrate area; performing an etching process in which the structured insulating layer functions as a mask to remove substrate material in the trenching area and to create a trench structure surrounding the selected substrate area; and forming a metallic layer on the insulating layer, the metallic layer sealing the trench structure.
摘要翻译：一种具有贯通接触部件的制造方法包括：提供基板; 在所述基板上形成绝缘层; 构造绝缘层，绝缘层至少在围绕所选择的衬底区域的预定的沟槽区域中被去除; 执行蚀刻工艺，其中结构化绝缘层用作掩模以去除在沟槽区域中的衬底材料并且产生围绕所选择的衬底区域的沟槽结构; 以及在所述绝缘层上形成金属层，所述金属层密封所述沟槽结构。

12. 发明授权

US08952466B2 Flexible stop for an acceleration sensor 有权
标题翻译：灵活的加速度传感器停止
公开(公告)号：US08952466B2
公开(公告)日：2015-02-10
申请号：US13889814
申请日：2013-05-08
申请人： Johannes Classen , Jochen Reinmuth , Guenther-Nino-Carlo Ullrich
发明人： Johannes Classen , Jochen Reinmuth , Guenther-Nino-Carlo Ullrich
IPC分类号： B81B3/00 , G01P15/08
CPC分类号： B81B3/0018 , B81B3/0051 , B81B2201/0235 , G01P2015/0871
摘要： A micromechanical acceleration sensor includes a seismic mass and a substrate that has a reference electrode. The seismic mass is deflectable in a direction perpendicular to the reference electrode, and the seismic mass has a flexible stop in the deflection direction. The flexible stop of the seismic mass includes an elastic layer.
摘要翻译：微机械加速度传感器包括地震块和具有参考电极的基底。地震质量可以在垂直于参考电极的方向上偏转，并且地震质量在偏转方向上具有柔性停止。抗震块的柔性挡块包括弹性层。

13. 发明申请

US20150008542A1 Micromechanical component and manufacturing method for a micromechanical component 有权
公开(公告)号：US20150008542A1
公开(公告)日：2015-01-08
申请号：US14322106
申请日：2014-07-02
申请人： Arnd KAELBERER , Jochen Reinmuth , Johannes Classen
发明人： Arnd KAELBERER , Jochen Reinmuth , Johannes Classen
IPC分类号： B81B3/00 , B81C1/00 , G01L9/00
CPC分类号： B81B3/0037 , B81B3/0021 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2207/012 , B81B2207/095 , B81C1/00682 , G01L9/0072 , H04R19/04 , H04R31/00
摘要： A micromechanical component includes a substrate having a cavern structured into the same, an at least partially conductive diaphragm, which at least partially spans the cavern, and a counter electrode, which is situated on an outer side of the diaphragm oriented away from the substrate so that a clearance is present between the counter electrode and the at least partially conductive diaphragm, the at least partially conductive diaphragm being spanned onto or over at least one electrically insulating material which at least partially covers the functional top side of the substrate, and at least one pressure access being formed on the cavern so that the at least partially conductive diaphragm is bendable into the clearance when a gaseous medium flows from an outer surroundings of the micromechanical component into the cavern. Also described is a manufacturing method for a micromechanical component.

14. 发明授权

US08850891B2 Micromechanical component and manufacturing method for a micromechanical component 有权
标题翻译：微机械部件的微机械部件和制造方法
公开(公告)号：US08850891B2
公开(公告)日：2014-10-07
申请号：US13288750
申请日：2011-11-03
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： G01P15/125 , B81B3/00 , G01P15/18 , G01P15/08
CPC分类号： G01P15/125 , B81B3/0078 , B81B2201/0235 , G01P15/0802 , G01P15/18 , G01P2015/0831 , Y10T29/49826
摘要： A micromechanical component having a fixing point and a seismic weight, which is connected to the fixing point by at least one spring and is made at least partially out of a first material, the first material being a semiconductor material, the seismic weight being additionally made out of at least one second material, and the second material having a higher density than the first material. In addition, a manufacturing method for a micromechanical component is provided, having the steps of forming a seismic weight at least partially out of a first material, the first material being a semiconductor material, connecting the seismic weight to a fixing point of the micromechanical component, using at least one spring, and forming the seismic weight from the first material and at least one second material, which has a higher density than the first material.
摘要翻译：一种具有固定点和抗震重量的微机械部件，其通过至少一个弹簧连接到所述固定点并且至少部分地由第一材料制成，所述第一材料是半导体材料，所述地震重量另外制成并且所述第二材料具有比所述第一材料更高的密度。此外，提供了一种用于微机械部件的制造方法，具有至少部分地由第一材料形成地震重量的步骤，第一材料是半导体材料，将地震重量连接到微机械部件的固定点使用至少一个弹簧，并且从第一材料和至少一个具有比第一材料更高密度的第二材料形成地震重量。

15. 发明申请

US20140117472A1 MICROMECHANICAL COMPONENT 有权
标题翻译：微生物组分
公开(公告)号：US20140117472A1
公开(公告)日：2014-05-01
申请号：US14061887
申请日：2013-10-24
申请人： Julian Gonska , Jochen Reinmuth , Kathrin Gutsche , Jens Frey , Heribert Weber
发明人： Julian Gonska , Jochen Reinmuth , Kathrin Gutsche , Jens Frey , Heribert Weber
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81C1/00285 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C2203/0118 , B81C2203/035
摘要： A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.
摘要翻译：微机械部件包括第一传感器所在的第一空间和第二传感器所在的第二空间，在第一和第二空间中存在不同的压力，两个空间中的一个通过第三空间延伸到第一格子结构位于组件的边缘区域中，并且基本上被气密地密封。

16. 发明授权

US08587095B2 Method for establishing and closing a trench of a semiconductor component 有权
标题翻译：用于建立和闭合半导体部件的沟槽的方法
公开(公告)号：US08587095B2
公开(公告)日：2013-11-19
申请号：US13004638
申请日：2011-01-11
申请人： Jochen Reinmuth , Eckhard Graf
发明人： Jochen Reinmuth , Eckhard Graf
IPC分类号： H01L23/552 , H01L21/764
CPC分类号： B81C1/00071 , B81B2207/07 , B81B2207/096 , H01L21/764 , H01L21/7682 , H01L21/76898 , H01L23/3178 , H01L23/481 , H01L23/4855 , H01L23/552 , H01L24/05 , H01L24/48 , H01L2224/0231 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02335 , H01L2224/024 , H01L2224/04042 , H01L2224/05548 , H01L2224/48463 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/3025 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for establishing and closing at least one trench of a semiconductor component, in particular a micromechanical or electrical semiconductor component, having the following steps: applying at least one metal layer over the trench to be formed; forming a lattice having lattice openings in the at least one metal layer over the trench to be formed; forming the trench below the metal lattice, and closing the lattice openings over the trench.
摘要翻译：一种用于建立和闭合半导体部件，特别是微机电或电半导体部件的至少一个沟槽的方法，具有以下步骤：在要形成的沟槽上施加至少一个金属层; 在要形成的沟槽上的所述至少一个金属层中形成具有格子孔的格子; 在金属晶格下面形成沟槽，并且关闭沟槽上方的格子孔。

17. 发明申请

US20130042681A1 METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE, AND MICROMECHANICAL STRUCTURE 有权
标题翻译：制造微观结构的方法和微观结构
公开(公告)号：US20130042681A1
公开(公告)日：2013-02-21
申请号：US13586226
申请日：2012-08-15
申请人： Johannes Classen , Jochen Reinmuth , Sebastian Guenther , Pia Bustian-Todorov
发明人： Johannes Classen , Jochen Reinmuth , Sebastian Guenther , Pia Bustian-Todorov
IPC分类号： H05K13/00 , G01P3/44
CPC分类号： G01C19/5783 , B81B2201/025 , B81C1/00182 , G01P15/0802 , G01P2015/0882
摘要： A method for manufacturing a micromechanical structure, and a micromechanical structure. The micromechanical structure encompasses a first micromechanical functional layer, made of a first material, that comprises a buried conduit having a first end and a second end; a micromechanical sensor structure having a cap in a second micromechanical functional layer that is disposed above the first micromechanical functional layer; an edge region in the second micromechanical functional layer, such that the edge region surrounds the sensor structure and defines an inner side containing the sensor structure and an outer side facing away from the sensor structure; such that the first end is located on the outer side and the second end on the inner side.
摘要翻译：微机械结构的制造方法和微机械结构。微机械结构包括由第一材料制成的第一微机械功能层，其包括具有第一端和第二端的埋管; 微机械传感器结构，其具有位于第一微机械功能层上方的第二微机械功能层中的盖; 所述第二微机械功能层中的边缘区域使得所述边缘区域围绕所述传感器结构并限定包含所述传感器结构的内侧和远离所述传感器结构的外侧; 使得第一端位于内侧的外侧和第二端。

18. 发明授权

US08347721B2 Acceleration sensor 有权
标题翻译：加速度传感器
公开(公告)号：US08347721B2
公开(公告)日：2013-01-08
申请号：US12783307
申请日：2010-05-19
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： G01P15/125 , G01P15/00
CPC分类号： G01P15/125 , G01P2015/0831
摘要： A micromechanical acceleration sensor includes a substrate with a substrate surface arranged in one plane, a first counter-electrode arranged on the substrate surface, a second counter-electrode arranged on the substrate surface, and a rocking mass arranged above the first counter-electrode and the second counter-electrode. The rocking mass is in this case connected to the substrate via a torsion spring which permits tilting of the rocking mass about an axis of rotation. Further provided are a first compensation counter-electrode arranged on the substrate surface and a second compensation counter-electrode arranged on the substrate surface. In addition, a first compensation electrode is arranged above the first compensation counter-electrode and a second compensation electrode is arranged above the second compensation counter-electrode.
摘要翻译：微机械加速度传感器包括：基板表面布置在一个平面中的基板，布置在基板表面上的第一对置电极，布置在基板表面上的第二对置电极和布置在第一对置电极上方的摆动块; 第二个对电极。在这种情况下，摇摆质量块通过扭转弹簧连接到基板，该扭簧允许摇摆块围绕旋转轴线倾斜。还提供了布置在基板表面上的第一补偿对置电极和布置在基板表面上的第二补偿对置电极。另外，第一补偿电极配置在第一补偿对置电极的上方，第二补偿电极配置在第二补偿对置电极的上方。

19. 发明授权

US08334534B2 Sensor and method for the manufacture thereof 有权
标题翻译：传感器及其制造方法
公开(公告)号：US08334534B2
公开(公告)日：2012-12-18
申请号：US12590585
申请日：2009-11-10
申请人： Jochen Reinmuth , Neil Davies , Simon Armbruster , Ando Feyh
发明人： Jochen Reinmuth , Neil Davies , Simon Armbruster , Ando Feyh
IPC分类号： H01L31/101
CPC分类号： G01J5/20 , G01J5/08 , G01J5/0853 , H01L27/14649
摘要： A sensor includes at least one micro-patterned diode pixel that has a diode implemented in, on, or under a diaphragm, and the diaphragm in turn being implemented above a cavity. The diode is contacted via supply leads that are implemented at least in part in, on, or under the diaphragm, and the diode is implemented in a polycrystalline semiconductor layer. The diode is implemented by way of two low-doped diode regions or at least one low-doped diode region. At least parts of the supply leads are implemented by way of highly doped supply lead regions of the shared polycrystalline semiconductor layer.
摘要翻译：传感器包括至少一个微图案化的二极管像素，其具有在隔膜内，上或下面实现的二极管，并且隔膜依次在空腔上方实现。二极管通过至少部分地在隔膜中，上或下面实现的电源引线接触，并且二极管实现在多晶半导体层中。二极管通过两个低掺杂二极管区域或至少一个低掺杂二极管区域实现。供电线的至少一部分通过共享多晶半导体层的高掺杂电源引线区实现。

20. 发明申请

US20120167681A1 MICROMECHANICAL COMPONENT AND MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT 有权
标题翻译：微生物组分的微生物组分和制备方法
公开(公告)号：US20120167681A1
公开(公告)日：2012-07-05
申请号：US13288750
申请日：2011-11-03
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： G01C19/56 , B23P11/00
CPC分类号： G01P15/125 , B81B3/0078 , B81B2201/0235 , G01P15/0802 , G01P15/18 , G01P2015/0831 , Y10T29/49826
摘要： A micromechanical component having a fixing point and a seismic weight, which is connected to the fixing point by at least one spring and is made at least partially out of a first material, the first material being a semiconductor material, the seismic weight being additionally made out of at least one second material, and the second material having a higher density than the first material. In addition, a manufacturing method for a micromechanical component is provided, having the steps of forming a seismic weight at least partially out of a first material, the first material being a semiconductor material, connecting the seismic weight to a fixing point of the micromechanical component, using at least one spring, and forming the seismic weight from the first material and at least one second material, which has a higher density than the first material.
摘要翻译：一种具有固定点和抗震重量的微机械部件，其通过至少一个弹簧连接到所述固定点并且至少部分地由第一材料制成，所述第一材料是半导体材料，所述地震重量另外制成并且所述第二材料具有比所述第一材料更高的密度。此外，提供了一种用于微机械部件的制造方法，其具有至少部分地由第一材料形成地震重量的步骤，第一材料是半导体材料，将地震重量连接到微机械部件的固定点使用至少一个弹簧，并且从第一材料和至少一个具有比第一材料更高密度的第二材料形成地震重量。

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