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11. 发明授权

US08556394B2 Ink supply 有权
标题翻译：墨水供应
公开(公告)号：US08556394B2
公开(公告)日：2013-10-15
申请号：US13192282
申请日：2011-07-27
申请人： Qiong Chen , Julita Oentojo , Yat Yuen Chan , Swei Jen Wong
发明人： Qiong Chen , Julita Oentojo , Yat Yuen Chan , Swei Jen Wong
IPC分类号： B41J2/175
CPC分类号： B41J2/17566 , B41J2002/17516
摘要： An ink supply containing an alkaline ink passivates a silicon diaphragm of a pressure sensor against etching from the alkaline ink using a silicon dioxide layer.
摘要翻译：含有碱性墨水的墨水源使用二氧化硅层使压力传感器的硅隔膜从碱性墨水中浸蚀。

12. 发明申请

US20060234163A1 Laser-assisted deposition 有权
标题翻译：激光辅助沉积
公开(公告)号：US20060234163A1
公开(公告)日：2006-10-19
申请号：US11105262
申请日：2005-04-13
申请人： Lei Zhu , Seng Khor , Qiong Chen , Cary Addington
发明人： Lei Zhu , Seng Khor , Qiong Chen , Cary Addington
IPC分类号： G03C5/00
CPC分类号： H01L21/76838 , C23C14/048 , H01L21/76873 , H05K3/046 , H05K2201/0108 , H05K2203/0528 , H05K2203/107
摘要： A method is provided for depositing a patterning material onto an optically transparent substrate by the use of a laser beam. A solid layer of a patterning material is placed adjacent to a receiving surface of the substrate. A laser beam is directed at an incident angle between 0 and 90° relative to the receiving surface. The laser beam is transmitted through the substrate and onto the solid layer to cause patterning material from the solid layer to deposit onto the receiving surface of the substrate.
摘要翻译：提供了一种通过使用激光束将图形材料沉积到光学透明基板上的方法。图案形成材料的固体层被放置成与基底的接收表面相邻。激光束相对于接收表面被引导在0和90度之间的入射角。激光束透射通过衬底并固定在固体层上，使得来自固体层的图案材料沉积到衬底的接收表面上。

13. 发明申请

US20050274933A1 Formulation for printing organometallic compounds to form conductive traces 审中-公开
标题翻译：印刷有机金属化合物以形成导电痕迹的配方
公开(公告)号：US20050274933A1
公开(公告)日：2005-12-15
申请号：US10869389
申请日：2004-06-15
申请人： Peng Chen , Qiong Chen
发明人： Peng Chen , Qiong Chen
IPC分类号： B41M5/26 , B41M5/28 , H05K3/10 , H05K3/12 , H05K3/18 , H01B1/00
CPC分类号： B41M5/26 , B41M5/28 , H05K3/105 , H05K3/125 , H05K3/1283 , H05K3/185 , H05K2203/013 , H05K2203/107 , H05K2203/121
摘要： A formulation able to be printed onto a substrate for use in forming a desired conductive trace layout on the substrate, the formulation including at least one organometallic compound dissolved in at least one organic solvent, whereby metal from the organometallic compound is deposited on the substrate when the organometallic compound is heated.
摘要翻译：一种能够印刷在基材上以用于在基材上形成所需导电迹线布局的制剂，所述制剂包含溶解在至少一种有机溶剂中的至少一种有机金属化合物，由此来自有机金属化合物的金属沉积在基材上，有机金属化合物被加热。

14. 发明申请

US20050236975A1 Method for patterning an organic light emitting diode device 有权
标题翻译：图案化有机发光二极管器件的方法
公开(公告)号：US20050236975A1
公开(公告)日：2005-10-27
申请号：US10830508
申请日：2004-04-22
申请人： Cary Addington , Qiong Chen
发明人： Cary Addington , Qiong Chen
IPC分类号： H05B33/10 , B23K26/00 , B23K26/36 , B23K26/40 , H01L27/32 , H01L51/40 , H01L51/50 , H05B33/14
CPC分类号： H01L51/0014 , Y10S430/146
摘要： A method for laser patterning of a passive matrix organic light emitting diode device having a multilayered structure comprising a substrate and at least one light emitting organic layer disposed between two electrode layers, the method comprising the step of: irradiating areas of the multilayered structure with a laser beam in a predetermined pattern thereby causing ablation of the multilayered structure in the irradiated areas; wherein, the electrode layers and the light emitting organic layer or layers are patterned substantially simultaneously during the same irradiation operation. Also described are a passive matrix organic light emitting diode device patterned by the method of the present invention and a display comprising the same.
摘要翻译：一种用于具有多层结构的无源矩阵有机发光二极管器件的激光图案化方法，所述多层结构包括衬底和设置在两个电极层之间的至少一个发光有机层，所述方法包括以下步骤：用激光束以预定图案形成，从而导致被照射区域中的多层结构的消融; 其中，在相同的照射操作期间，电极层和发光有机层基本上同时被图案化。还描述了通过本发明的方法图案化的无源矩阵有机发光二极管器件和包括其的显示器。

15. 外观设计

USD990780S1 Hair clipper unit assembly 有权
公开(公告)号：USD990780S1
公开(公告)日：2023-06-27
申请号：US29769219
申请日：2021-02-04
申请人： Qiong Chen
设计人： Qiong Chen
摘要： FIG. 1 is a perspective view of the clipper body of a hair clipper unit assembly, where the clipper body is in a first configuration of use;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is an enlarged view of portion 9 shown in FIG. 2;
FIG. 10 is an enlarged view of portion 10 shown in FIG. 7;
FIG. 11 is a perspective view of a first embodiment of the comb of the hair clipper unit assembly;
FIG. 12 is another perspective view thereof;
FIG. 13 is a front elevational view thereof;
FIG. 14 is a rear elevational view thereof;
FIG. 15 is a left side elevational view thereof;
FIG. 16 is a right side elevational view thereof;
FIG. 17 is a top plan view thereof;
FIG. 18 is a bottom plan view thereof;
FIG. 19 is a perspective view of a second embodiment of the comb of the hair clipper unit assembly;
FIG. 20 is another perspective view thereof;
FIG. 21 is a front elevational view thereof;
FIG. 22 is a rear elevational view thereof;
FIG. 23 is a left side elevational view thereof;
FIG. 24 is a right side elevational view thereof;
FIG. 25 is a top plan view thereof;
FIG. 26 is a bottom plan view thereof;
FIG. 27 is a perspective view of a third embodiment of the comb of the hair clipper unit assembly;
FIG. 28 is another perspective view thereof;
FIG. 29 is a front elevational view thereof;
FIG. 30 is a rear elevational view thereof;
FIG. 31 is a left side elevational view thereof;
FIG. 32 is a right side elevational view thereof;
FIG. 33 is a top plan view thereof;
FIG. 34 is a bottom plan view thereof;
FIG. 35 is a perspective view of a fourth embodiment of the comb of the hair clipper unit assembly;
FIG. 36 is another perspective view thereof;
FIG. 37 is a front elevational view thereof;
FIG. 38 is a rear elevational view thereof;
FIG. 39 is a left side elevational view thereof;
FIG. 40 is a right side elevational view thereof;
FIG. 41 is a top plan view thereof;
FIG. 42 is a bottom plan view thereof;
FIG. 43 is a perspective view of the hair clipper unit assembly, shown in use with the clipper body working with the first embodiment of the comb;
FIG. 44 is a perspective view of the hair clipper unit assembly, shown in use with the clipper body working with the second embodiment of the comb;
FIG. 45 is a perspective view of the hair clipper unit assembly, shown in use with the clipper body working with the third embodiment of the comb;
FIG. 46 is a perspective view of the hair clipper unit assembly, shown in use with the clipper body working with the fourth embodiment of the comb;
FIG. 47 is a perspective view of the clipper body of the hair clipper unit assembly where the clipper body is in a second configuration of use;
FIG. 48 is a perspective view of the clipper body of the hair clipper unit assembly where the clipper body is in a third configuration of use;
FIG. 49 is a perspective view of the clipper body of the hair clipper unit assembly where the clipper body is in a fourth configuration of use; and,
FIG. 50 is an exploded perspective view of FIG. 1.
The evenly spaced broken lines in the drawings depict portions of the hair clipper unit assembly that form no part of the claimed design.
The dash-dot-dash broken lines depict the boundary around the enlarged portions that form no part of the claimed design.
The clipper body and combs are shown separately for convenience of illustration.

16. 发明申请

US20060237129A1 Laser welding system 有权
标题翻译：激光焊接系统
公开(公告)号：US20060237129A1
公开(公告)日：2006-10-26
申请号：US11111645
申请日：2005-04-21
申请人： Qiong Chen , Muay Neo , Marjan Amesbury
发明人： Qiong Chen , Muay Neo , Marjan Amesbury
IPC分类号： B29C65/00 , B23K26/20
CPC分类号： B29C65/1667 , B23K26/0604 , B23K26/066 , B23K26/0738 , B23K26/244 , B23K2103/42 , B23K2103/50 , B29C65/1616 , B29C65/1635 , B29C65/1654 , B29C65/1674 , B29C65/1696 , B29C66/003 , B29C66/112 , B29C66/114 , B29C66/5346 , B29C66/71 , B29C66/73921 , B29C66/81 , B29C66/8122 , B29C66/81267 , B29C66/81815 , B29C66/9131 , B29C66/91421 , B29C66/9161 , B29C66/919 , B29C66/9192 , B29C66/929 , B29C66/934 , B29C66/939 , B29C66/949 , B29C66/9592 , B29C66/961 , B29K2023/12 , B29K2055/02 , B29K2067/00 , B29K2071/12 , B29K2105/0079 , B29K2869/00 , B29K2909/08 , B29K2067/003
摘要： A laser welding system includes a free-spacing beam delivery laser head having a linear array of at least two laser diodes, each of the diodes generating a laser beam of a predetermined wavelength and spectral width. The laser beams are adapted to weld a workpiece having a first component and at least one other component to be welded to the first component, the first component substantially transmissive to the wavelength, the other component substantially absorptive of the wavelength. A lens is spaced from the linear array, and directs the laser beams to at least one other lens spaced from the lens. The other lens shapes the laser beams to a predetermined width and length, and focuses the laser beams to substantially the same location, thereby forming a continuous line of laser energy being in a plane containing the workpiece, and being substantially orthogonal to the workpiece translation direction.
摘要翻译：激光焊接系统包括具有至少两个激光二极管的线性阵列的自由间隔光束传递激光头，每个二极管产生预定波长和光谱宽度的激光束。激光束适于将具有第一部件和待焊接的至少一个其它部件的工件焊接到第一部件上，第一部件对波长基本上透射，另一个部件基本上吸收波长。透镜与线性阵列间隔开，并且将激光束引导到与透镜间隔开的至少一个其它透镜。另一个透镜将激光束成形为预定的宽度和长度，并且将激光束聚焦到基本上相同的位置，从而在包含工件的平面中形成连续的激光能量线，并且基本上垂直于工件平移方向。

17. 发明申请

US20050276911A1 Printing of organometallic compounds to form conductive traces 审中-公开
标题翻译：印刷有机金属化合物以形成导电痕迹
公开(公告)号：US20050276911A1
公开(公告)日：2005-12-15
申请号：US10869639
申请日：2004-06-15
申请人： Qiong Chen , Jamie Neo , Peng Chen , Hui Tan , Venkataramanan Balasubramaniam
发明人： Qiong Chen , Jamie Neo , Peng Chen , Hui Tan , Venkataramanan Balasubramaniam
IPC分类号： B41M5/26 , B41M5/28 , H05K3/10 , H05K3/12 , H05K3/18 , B32B3/00 , B05D5/12 , H01L21/00
CPC分类号： H05K3/125 , H05K3/105 , H05K3/185 , H05K2203/013 , H05K2203/107 , H05K2203/121 , Y10T428/24917
摘要： A method of forming a desired conductive trace layout on a substrate, comprising the steps of: printing an organometallic compound onto the substrate in the desired conductive trace layout using a printer, the organometallic compound substantially transparent to electromagnetic radiation which is at least in part absorbed by the substrate; heating the substrate near or at an interface area of the organometallic compound and the substrate using the electromagnetic radiation; and, depositing at least part of the conductive trace on the substrate near or at the heated interface area as a result of the heating step.
摘要翻译：一种在衬底上形成期望的导电迹线布局的方法，包括以下步骤：使用打印机将所述有机金属化合物印刷到所需的导电迹线布局中，所述有机金属化合物基本上对电磁辐射是透明的，所述有机金属化合物至少部分被吸收通过底物; 使用电磁辐射在有机金属化合物和基板的界面区域附近加热基板; 并且作为加热步骤的结果，在加热的界面区域附近或在加热的界面区域上沉积至少部分导电迹线。

18. 发明申请

US20050053446A1 Captive screw with receiving space 审中-公开
标题翻译：带收容空间的螺丝
公开(公告)号：US20050053446A1
公开(公告)日：2005-03-10
申请号：US10925289
申请日：2004-08-23
申请人： Chin-Fa Huang , Peng Yang , Qiong Chen
发明人： Chin-Fa Huang , Peng Yang , Qiong Chen
IPC分类号： F16B5/02 , F16B35/06 , H05K7/14 , F16B21/18
CPC分类号： H05K7/1417 , F16B5/0208 , F16B35/06
摘要： A captive screw (80) is provided for attaching two sheets together. The captive screw includes a screw (40) and a cap (50). The screw includes a head (41), a threaded shank (43), and a flange (42) located between the head and the shank. The cap includes a cavity (51) and a skirt portion (53). The shank forms a plurality of ribs (52) on an underside thereof. The flange forms a plurality of vertical ridges (44) therearound. The cap and the screw are combined, with the head and the flange tightly fitted in the cavity. The shank extends out of the skirt portion, with cylindrical space defined therebetween. A rod portion of a complementary engaging rivet can then be received in the space.
摘要翻译：提供固定螺钉（80）用于将两个片材连接在一起。固定螺钉包括螺钉（40）和盖（50）。螺钉包括头部（41），螺纹柄部（43）和位于头部和柄部之间的凸缘（42）。盖包括空腔（51）和裙部（53）。柄部在其下侧形成多个肋（52）。凸缘在其周围形成多个垂直脊（44）。盖和螺钉组合在一起，头部和凸缘紧密地嵌入腔体中。柄部延伸出裙部，其间限定有圆柱形空间。然后可以在该空间中容纳互补接合铆钉的杆部分。

19. 发明授权

US06576867B1 Method and apparatus for removal of mold flash 有权
标题翻译：去除模具闪光的方法和装置
公开(公告)号：US06576867B1
公开(公告)日：2003-06-10
申请号：US09857724
申请日：2002-02-12
申请人： Yong Feng Lu , Yak Hui Sim , Qiong Chen , Long Chen Lai , Bin Othman Rustam
发明人： Yong Feng Lu , Yak Hui Sim , Qiong Chen , Long Chen Lai , Bin Othman Rustam
IPC分类号： B23K2636
CPC分类号： H01L21/67092 , B08B7/0042 , H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for the removal of mold flash from an IC device using a non-thermal laser ablation method. Ablation is achieved under conditions in which the mold flash is converted to plasma under short laser pulses which do not give sufficient time or energy for significant thermal processes to occur. As a result, the heat sink underneath the mold flash is prevented from heating up due to lack of heat transfer, thereby protecting the heat sink from heat damages. According to one feature of the invention, a mask is provided to protect the molded packaging of the IC device from the laser beam. The mask has at least one hole which corresponds to the heat sink of the device wherethrough the laser beam can pass. According to another feature of the invention, a large beam diameter is provided to increase the efficiency of the deflashing process.
摘要翻译：一种使用非热激光烧蚀方法从IC器件去除模具闪光的方法和装置。在短激光脉冲下将模具闪光转换成等离子体的条件下实现消融，这对于显着的热处理没有给出足够的时间或能量。结果，由于缺少热传递，防止模具闪光下面的散热器被加热，从而保护散热器免受热损坏。根据本发明的一个特征，提供一种掩模以保护IC器件的模制封装免受激光束的影响。掩模具有至少一个孔，其对应于通过激光束可以通过的装置的散热器。根据本发明的另一个特征，提供了大的光束直径以提高去屑过程的效率。

20. 外观设计

USD993777S1 Cosmetics bottle 有权
公开(公告)号：USD993777S1
公开(公告)日：2023-08-01
申请号：US29853940
申请日：2022-09-20
申请人： Qiong Chen
设计人： Qiong Chen
摘要： FIG. 1 is a perspective view of the cosmetics bottle showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a perspective view of the cosmetics bottle in an open configuration.
The broken lines shown are for the purpose of illustrating parts of the article forming no part of the claimed design.

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