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11. 发明申请

US20070231553A1 REMOVABLE PROTECTIVE COVER 审中-公开
标题翻译：可拆卸防护罩
公开(公告)号：US20070231553A1
公开(公告)日：2007-10-04
申请号：US11688036
申请日：2007-03-19
申请人： Klaus Hartig , Leah M. Miller
发明人： Klaus Hartig , Leah M. Miller
IPC分类号： C09D5/00 , B32B17/06
CPC分类号： C03C17/009 , B32B17/06 , C03B40/00 , C03C17/007 , C03C17/008 , C03C17/34 , C03C17/42 , C03C2217/42 , C03C2217/44 , C03C2217/91 , C03C2218/154 , C03C2218/355 , C09D5/008 , Y10T428/24975 , Y10T428/30
摘要： A substrate bearing a removable cover is provided. The removable cover includes two or more removable films, wherein at least one film is removable by a different removing process than another film. For example, in some cases one film is an organic film removable by heat treatment and another film is an inorganic film durable to heat treatment but is soluble to a mild acid or a mild base.
摘要翻译：提供了具有可移除盖的基板。可移除的盖包括两个或更多个可移除的膜，其中至少一个膜可以通过与另一膜不同的去除工艺去除。例如，在一些情况下，一种膜是通过热处理可除去的有机膜，另一种膜是耐热处理但可溶于弱酸或温和碱的无机膜。

12. 发明授权

US07062742B2 Routing structure for transceiver core 失效
标题翻译：收发机核心的路由结构
公开(公告)号：US07062742B2
公开(公告)日：2006-06-13
申请号：US10420216
申请日：2003-04-22
申请人： Leah M. Miller
发明人： Leah M. Miller
IPC分类号： G06F17/50
CPC分类号： G06F17/5077 , H01L23/49838 , H01L23/50 , H01L27/118 , H01L2924/0002 , H01L2924/15173 , H05K1/0219 , H05K1/112 , H05K2201/09227 , H05K2201/10674 , H01L2924/00
摘要： A routing structure for a transceiver core, the routing structure including a transmitter block design and a receiver block design. The transmitter block design includes two dedicated transmitter power contacts, two common ground contacts, and two transmitter signal contacts in a transmitter differential pair. The two transmitter signal contacts are both adjacent each of the two dedicated transmitter power contacts and each of the two common ground contacts. The receiver block design includes two dedicated receiver power contacts, two common ground contacts, and two receiver signal contacts in a receiver differential pair. The two receiver signal contacts are both adjacent each of the two dedicated receiver power contacts and each of the two common ground contacts.
摘要翻译：用于收发机核心的路由结构，路由结构包括发射机块设计和接收机块设计。发射机模块设计包括发射机差分对中的两个专用发射机电源触点，两个公共接地触点和两个发射器信号触点。两个发射机信号触点都与两个专用发射机电源触点和两个公共接地触点中的每一个相邻。接收器块设计包括接收器差分对中的两个专用接收器电源触点，两个公共接地触点和两个接收器信号触点。两个接收器信号触点都与两个专用接收器功率触点中的每一个相邻，并且两个公共接地触点中的每一个接近。

13. 发明授权

US07993741B2 Preventing damage with separators 有权
标题翻译：用分离器防止损坏
公开(公告)号：US07993741B2
公开(公告)日：2011-08-09
申请号：US10313543
申请日：2002-12-06
申请人： Klaus Hartig , Leah M. Miller , Gary L. Pfaff
发明人： Klaus Hartig , Leah M. Miller , Gary L. Pfaff
IPC分类号： B32B5/16 , B32B17/06
CPC分类号： C03C17/006 , B65G49/069 , C03C17/32 , C03C2217/42 , Y10T428/24372 , Y10T428/24942 , Y10T428/25 , Y10T428/252 , Y10T428/253 , Y10T428/31645
摘要： Methods and apparatus for useful for protecting a substrate bearing a coating are provided. A separator in accordance with an exemplary embodiment of the present invention comprises a film carrying a plurality of particles Each particle preferably has a covered area adhered to the film and an exposed area that is larger than the covered area.
摘要翻译：提供了用于保护承载涂层的基材的方法和装置。根据本发明的示例性实施例的分离器包括承载多个颗粒的膜。每个颗粒优选具有粘附到膜的覆盖区域和大于被覆盖区域的暴露区域。

14. 发明授权

US07298036B2 Scaling of functional assignments in packages 有权
公开(公告)号：US07298036B2
公开(公告)日：2007-11-20
申请号：US11283340
申请日：2005-11-18
申请人： Leah M. Miller , Jeffrey A. Hall
发明人： Leah M. Miller , Jeffrey A. Hall
IPC分类号： H01L23/02
CPC分类号： H01L23/49816 , H01L23/49838 , H01L2224/16 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311
摘要： A family of package substrates adapted to receive a family of integrated circuits having different sizes and provide electrical connections between the integrated circuits and a circuit board. Each package substrate in the family includes a package substrate having a die side and a circuit board side. The package substrate has a size that is consistent for all of the package substrates in the family of package substrates. The die side has integrated circuit contacts disposed in a pattern designed to make electrical connections to a given integrated circuit in the family of integrated circuits for which the package substrate is designed, as defined by locations of contacts on the given integrated circuit. The circuit board side has circuit board contacts disposed in a pattern and with functional assignments that are consistent for all of the package substrates in the family of package substrates.

15. 发明授权

US06701270B1 Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the source 有权
标题翻译：用于电子电路中的可靠性测试漏电特性的方法和用于完成源的测试装置
公开(公告)号：US06701270B1
公开(公告)日：2004-03-02
申请号：US09957410
申请日：2001-09-20
申请人： Leah M. Miller , Anand Govind
发明人： Leah M. Miller , Anand Govind
IPC分类号： G06F1900
CPC分类号： G01R31/287 , G01R31/2879
摘要： The present invention provides a method for reliability testing leakage characteristics in an electronic circuit, and a testing device for accomplishing the same. In an advantageous embodiment, the method includes dividing conductors of an electronic circuit into at least first and second noninterleaved regions having at least two conductors each. The method further includes forming conductor nets by electrically connecting ones of the at least two conductors of the first region to ones of the at least two conductors of the second region then testing for electrical leakage in the conductor nets.
摘要翻译：本发明提供了一种用于电子电路中的可靠性测试漏电特性的方法及其实现方法。在有利的实施例中，该方法包括将电子电路的导体分成至少具有至少两个导体的非交织区域。该方法还包括通过将第一区域的至少两个导体中的一个导体与第二区域的至少两个导体中的一个导体电连接，然后测试导体网络中的漏电来形成导体网络。

16. 发明授权

US07051434B2 Designing a ball assignment for a ball grid array package 有权
标题翻译：设计球栅阵列包的球分配
公开(公告)号：US07051434B2
公开(公告)日：2006-05-30
申请号：US10452874
申请日：2003-06-02
申请人： Leah M. Miller , Farshad Ghahghahi
发明人： Leah M. Miller , Farshad Ghahghahi
IPC分类号： H01K3/10
CPC分类号： H01L23/49838 , H01L23/50 , H01L2924/0002 , H01L2924/15173 , H05K1/112 , H05K2201/09227 , H05K2201/10734 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method for designing a routing pattern for electrical contacts on a printed circuit board by arranging contacts in an array of rows and columns on the printed circuit board, connecting groups of n columns of contacts to n−1 columns of vias disposed interstitially between the contacts, thereby forming a vertical channel that does not extend completely through the contact array. Connecting the vias to traces, and routing the traces to an outside edge of the via array through the vertical channel. Connecting groups of n rows of the contacts to n−1 rows of vias disposed interstitially between the contacts, thereby forming a horizontal channel that does not extend completely through the contact array, and intersects with the vertical channel. Connecting the vias to traces, and routing the traces to the outside edge of the via array through the horizontal channel.
摘要翻译：一种用于通过在印刷电路板上布置行和列阵列中的触点来设计印刷电路板上的电接触的布线图案的方法，将n列触点的n列连接到在触点之间间隙设置的n-1列通孔从而形成不完全延伸穿过接触阵列的垂直通道。将通孔连接到走线，并通过垂直通道将走线路由到通孔阵列的外部边缘。将n行触点的n行连接到在接触件之间间隙布置的n-1行通孔，从而形成不完全延伸穿过接触阵列并与垂直通道相交的水平通道。将通孔连接到走线，并通过水平通道将走线布线到通孔阵列的外边缘。

17. 发明授权

US06858930B2 Multi chip module 有权
标题翻译：多芯片模块
公开(公告)号：US06858930B2
公开(公告)日：2005-02-22
申请号：US10638772
申请日：2003-08-11
申请人： Leah M. Miller , Kishor Desai
发明人： Leah M. Miller , Kishor Desai
IPC分类号： H01L23/36 , H01L25/16 , H01L23/10
CPC分类号： H01L23/36 , H01L25/165 , H01L2924/0002 , H01L2924/00
摘要： A multi chip package, which includes a package substrate having a first side and an opposing second side. The first side is for receiving package electrical connections. Integrated circuits are electrically connected and structurally connected by their first sides to the second side of the package substrate. Heat spreaders are disposed adjacent the second side of the integrated circuits, where one each of the heat spreaders is associated with one each of the integrated circuits. A single stiffener having a first side and an opposing second side covers all of the integrated circuits and heat spreaders, where the first side of the stiffener is disposed adjacent the second side of the heat spreaders.
摘要翻译：一种多芯片封装，其包括具有第一侧和相对的第二侧的封装基板。第一面是用于接收包装电气连接。集成电路通过其第一侧电连接并结构地连接到封装衬底的第二侧。散热器布置在集成电路的第二侧附近，其中每个散热器与每个集成电路相关联。具有第一侧和相对的第二侧的单个加强件覆盖所有集成电路和散热器，其中加强件的第一侧邻近散热器的第二侧设置。

18. 发明授权

US06680532B1 Multi chip module 失效
标题翻译：多芯片模块
公开(公告)号：US06680532B1
公开(公告)日：2004-01-20
申请号：US10265751
申请日：2002-10-07
申请人： Leah M. Miller , Kishor Desai
发明人： Leah M. Miller , Kishor Desai
IPC分类号： H01L2348
CPC分类号： H01L23/36 , H01L25/165 , H01L2924/0002 , H01L2924/00
摘要： A multi chip package, which includes a package substrate having a first side and an opposing second side. The first side is for receiving package electrical connections. Integrated circuits are electrically connected and structurally connected by their first sides to the second side of the package substrate. Heat spreaders are disposed adjacent the second side of the integrated circuits, where a single one of the heat spreaders is associated with a single one of the integrated circuits, but not all of the integrated circuits have an associated heat spreader. A single stiffener having a first side and an opposing second side covers all of the integrated circuits and heat spreaders, where the first side of the stiffener is disposed adjacent the second side of the heat spreaders.
摘要翻译：一种多芯片封装，其包括具有第一侧和相对的第二侧的封装基板。第一面是用于接收包装电气连接。集成电路通过其第一侧电连接并结构地连接到封装衬底的第二侧。散热器设置在集成电路的第二侧附近，其中单个散热器与单个集成电路相关联，但并非所有集成电路都具有相关联的散热器。具有第一侧和相对的第二侧的单个加强件覆盖所有集成电路和散热器，其中加强件的第一侧邻近散热器的第二侧设置。

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