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11. 发明授权

US07600547B2 Variable lamination rapid prototyping apparatus for producing large scale 3-dimensional object 失效
标题翻译：用于生产大型3维物体的可变层压快速成型设备
公开(公告)号：US07600547B2
公开(公告)日：2009-10-13
申请号：US11202639
申请日：2005-08-12
申请人： Dong Yol Yang , Hyo Chan Kim , Sang Ho Lee , Seung Kyo Park
发明人： Dong Yol Yang , Hyo Chan Kim , Sang Ho Lee , Seung Kyo Park
IPC分类号： B32B37/18 , B32B41/00
CPC分类号： B29C64/141 , B33Y30/00 , Y10T156/12 , Y10T156/1749
摘要： The variable lamination rapid prototyping apparatus of the present invention includes a first feeding means which longitudinally reciprocates a sheet, a second feeding means which is provided under the first feeding means and reciprocates in a direction transverse to the sheet, and a rotating means which is coupled to the second feeding means and rotates around an axis parallel to the transverse direction of the sheet. The apparatus further includes a translation means which is linked to the rotating means, a cutting means which is coupled to the translation means, and a stacking means which subsequently stacks a plurality of cut sheets, thus forming the 3-dimensional object. The apparatus further includes a control means which previously stores data about the object therein and controls the above-mentioned plurality of means based on the data. Because a hot wire is provided in a parallelogram link structure, superior cutting accuracy and the stability are ensured. Furthermore, because the link structure is adjustable in length, it is possible to easily cut a sheet regardless of the size of the sheet.
摘要翻译：本发明的可变层压快速成型装置包括一个纵向往复运动的第一进给装置，一个设置在第一进给装置下方并沿横向于该片材的方向往复运动的第二进给装置，到第二进给装置并围绕与片材的横向方向平行的轴线旋转。该装置还包括连接到旋转装置的平移装置，联接到平移装置的切割装置和随后堆叠多个切割片材的堆叠装置，从而形成3维物体。该装置还包括控制装置，其预先存储关于其中的对象的数据，并基于该数据控制上述多个装置。由于以平行四边形连杆结构设置热丝，因此确保了切割精度和稳定性。此外，由于连杆结构的长度可调节，所以可以容易地切割片材，而与片材的尺寸无关。

12. 发明申请

US20090190606A1 SYSTEM AND METHOD FOR POLLING IN ETHERNET PASSIVE OPTICAL NETWORK 有权
标题翻译：在以太网被动光网络中检测的系统和方法
公开(公告)号：US20090190606A1
公开(公告)日：2009-07-30
申请号：US12034568
申请日：2008-02-20
申请人： Sang Ho Lee , Min Young Chung , Tae-Jin Lee , Hyun Seung Choo
发明人： Sang Ho Lee , Min Young Chung , Tae-Jin Lee , Hyun Seung Choo
IPC分类号： H04L12/403
CPC分类号： H04Q11/0067 , H04J3/0682 , H04Q2011/0064 , H04Q2011/0088
摘要： Disclosed is a system and a method for polling in an Ether net Passive Optical Network (EPON). The system includes: multiple Optical Network Units (ONUs) for sharing optical channels of the EPON with one another and transmitting traffic; and an Optical Line Terminal (OLT) for discriminating a plurality of ONUs gaining access to the EPON among the multiple ONUs and then collecting routing information on the plurality of ONUs gaining access to the EPON, and for classifying the plurality of ONUs gaining access to the EPON into two or more ONU groups according to the collected routing information and then carrying out forming a polling cycle and allocating bandwidth on each ONU group. Therefore, a transmission idle period in a traffic channel is not only minimized, but an availability ratio of traffic channels can also be maximized.
摘要翻译：公开了一种在以太网无源光网络（EPON）中轮询的系统和方法。该系统包括：多个光网络单元（ONU），用于共享EPON的光信道并传输业务; 以及光线路终端（OLT），用于区分多个ONU中获得对EPON的访问的多个ONU，然后收集对获得对EPON的访问的多个ONU的路由信息，并且对多个ONU进行访问 EPON根据收集的路由信息分成两个或更多个ONU组，然后执行轮询周期并在每个ONU组上分配带宽。因此，业务信道中的传输空闲时段不仅最小化，而且业务信道的可用率也可以最大化。

13. 发明授权

US07350395B2 Apparatus for generating road surface reaction force in a test apparatus for steer-by-wire system 失效
标题翻译：用于线控转向系统的试验装置中产生路面反作用力的装置
公开(公告)号：US07350395B2
公开(公告)日：2008-04-01
申请号：US11311106
申请日：2005-12-19
申请人： Sang Ho Lee
发明人： Sang Ho Lee
IPC分类号： G01M17/06
CPC分类号： G01M17/06
摘要： An apparatus for generating a road surface reaction force in a test apparatus for a steer-by-wire system includes a steering actuation unit, and actuators arranged in parallel to tie rods of the steering actuation unit. In accordance with this arrangement, there is an advantage of a reduced installation space. Also, it is possible to transmit the force of each actuator to the associated tie rod without loss, and thus, to accurately implement the generation of a road surface reaction force.
摘要翻译：在用于线控转向系统的测试装置中产生路面反作用力的装置包括转向致动单元和与转向致动单元的拉杆平行布置的致动器。根据这种安排，具有减小的安装空间的优点。此外，可以不损失地将每个致动器的力传递到相关联的拉杆，从而准确地实现路面反作用力的产生。

14. 发明授权

US07293215B2 Radio packet data transmission control system and method 失效
标题翻译：无线分组数据传输控制系统及方法
公开(公告)号：US07293215B2
公开(公告)日：2007-11-06
申请号：US10653156
申请日：2003-09-03
申请人： Sang Ho Lee
发明人： Sang Ho Lee
IPC分类号： H04L1/18
CPC分类号： H04L69/16 , H04L1/0061 , H04L1/08 , H04L1/187 , H04L1/1874 , H04L1/1887 , H04L1/203 , H04L69/163 , H04L69/32 , H04W80/06 , H04W80/10
摘要： A system and method for controlling transmission of a radio packet data are disclosed. A time point when a congestion controlling mechanism, causing a TCP performance degradation with the mobile station and the PDSN, is previously detected, and when the mechanism is operated, it is quickly returned. Thus, in spite of a bit error (data loss) existing due to the characteristics of the radio data service, a reliable data service can be guaranteed.
摘要翻译：公开了一种用于控制无线电分组数据传输的系统和方法。预先检测到伴随移动台和PDSN造成TCP性能下降的拥塞控制机制的时间点，并且当该机制被操作时，其迅速返回。因此，尽管由于无线电数据服务的特性而存在一个位错误（数据丢失），可以保证可靠的数据服务。

15. 发明申请

US20070015314A1 Adhesive/Spacer Island Structure for Multiple Die Package 有权
标题翻译：多模封装的粘合/间隔岛结构
公开(公告)号：US20070015314A1
公开(公告)日：2007-01-18
申请号：US11530841
申请日：2006-09-11
申请人： Sang Ho Lee , Jong Ju , Hyeog Kwon
发明人： Sang Ho Lee , Jong Ju , Hyeog Kwon
IPC分类号： H01L21/00
CPC分类号： H01L24/48 , H01L24/45 , H01L24/73 , H01L24/743 , H01L24/83 , H01L25/0657 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/83192 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01079 , H01L2924/0665 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： An adhesive/spacer structure (52, 52A, 60) is used to adhere first and second die (14, 18) to one another at a chosen separation in a multiple-die semiconductor chip package (56). The first and second die define a die bonding region (38) therebetween. The adhesive/spacer structure may comprise a plurality of spaced-apart adhesive/spacer islands (52, 52A) securing the first and second die to one another at a chosen separation (53). The adhesive/spacer structure may also secure the first and second die to one another to occupy about 1-50% of the die bonding region.
摘要翻译：粘合/间隔结构（52,52A，60）用于在多芯片半导体芯片封装（56）中以选定的间隔将第一和第二裸片（14,18）彼此粘合。第一和第二模具在它们之间限定了芯片接合区域（38）。粘合剂/间隔物结构可以包括多个间隔开的粘合剂/隔离物岛（52,52A），其以选定的间隔（53）将第一和第二管芯彼此固定。粘合剂/间隔件结构还可以将第一和第二管芯彼此固定，以占据管芯接合区域的约1-50％。

16. 发明授权

US07146106B2 Optic semiconductor module and manufacturing method 有权
标题翻译：光学半导体模块及制造方法
公开(公告)号：US07146106B2
公开(公告)日：2006-12-05
申请号：US10227051
申请日：2002-08-23
申请人： Jun Young Yang , Sang Ho Lee , Chul Woo Park
发明人： Jun Young Yang , Sang Ho Lee , Chul Woo Park
IPC分类号： H04B17/00
CPC分类号： G02B6/4239 , G02B6/423 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01S5/02248 , H01S5/02284 , H01L2924/00014
摘要： An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main board. The package portion includes a base, a laser diode and a photo detector electrically coupled to the board metal patterns of the main board and bonded to the base. An optical fiber is inserted into the aperture of the main board and disposed adjacent the package portion. The position and tilt of the optical fiber may be adjusted to achieve optimum optical coupling between the optical fiber and the laser diode and the optical fiber and the photo detector. The optical fiber is stably attached to the main board by an adhesive.
摘要翻译：光学半导体封装包括基本上平板状的主板。主板包括穿过其中的孔和形成在孔周边的多个板金属图案。封装部分耦合到主板。封装部分包括基极，激光二极管和光电检测器，电耦合到主板的板金属图案并结合到基板。将光纤插入到主板的孔中并邻近封装部分设置。可以调节光纤的位置和倾斜度，以实现光纤和激光二极管以及光纤和光电检测器之间的最佳光耦合。光纤通过粘合剂稳定地附着在主板上。

17. 发明授权

US06995459B2 Semiconductor package with increased number of input and output pins 有权
标题翻译：半导体封装具有输入和输出引脚数量的增加
公开(公告)号：US06995459B2
公开(公告)日：2006-02-07
申请号：US11063299
申请日：2005-02-22
申请人： Choon Heung Lee , Donald C. Foster , Jeoung Kyu Choi , Wan Jong Kim , Kyong Hoon Youn , Sang Ho Lee , Sun Goo Lee
发明人： Choon Heung Lee , Donald C. Foster , Jeoung Kyu Choi , Wan Jong Kim , Kyong Hoon Youn , Sang Ho Lee , Sun Goo Lee
IPC分类号： H01L23/495
CPC分类号： H01L24/49 , H01L23/3107 , H01L23/49503 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2221/68377 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49109 , H01L2224/4911 , H01L2224/73265 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least two slots formed therein and extending along respective ones of a pair of the peripheral edge segments thereof. The semiconductor package further comprises a plurality of first leads which are segregated into at least two sets disposed within respective ones of the slots included in the die paddle. In addition to the first leads, the semiconductor package includes a plurality of second leads which are also segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the die paddle in spaced relation thereto. Electrically connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of each of the first and second leads. At least portions of the die paddle, the first and second leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the first leads being exposed in a common exterior surface of the package body.
摘要翻译：根据本发明，提供了一种半导体封装，其包括限定多个外围边缘段的大致平坦的管芯片，并且包括形成在其中的至少两个槽，并沿其一对周边边缘段中的相应的一个延伸。半导体封装还包括多个第一引线，它们分离成设置在包括在管芯焊盘中的各个槽中的至少两个组。除了第一引线之外，半导体封装还包括多个第二引线，它们也分隔成至少两组，其间隔开的关系相对于管芯焊盘的至少两个周边边缘段的相应延伸。电连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到第一和第二引线中的每一个的至少一些。裸片，第一和第二引线和半导体管芯的至少一部分被封装主体封装，裸片焊盘的底表面和第一引线暴露在封装体的公共外表面中。

18. 发明授权

US06927483B1 Semiconductor package exhibiting efficient lead placement 有权
标题翻译：半导体封装显示出有效的铅放置
公开(公告)号：US06927483B1
公开(公告)日：2005-08-09
申请号：US10383504
申请日：2003-03-07
申请人： Sun Goo Lee , Choon Heung Lee , Sang Ho Lee
发明人： Sun Goo Lee , Choon Heung Lee , Sang Ho Lee
IPC分类号： H01L23/04 , H01L23/31 , H01L23/48 , H01L23/495 , H01L23/52 , H01L29/40
CPC分类号： H01L24/49 , H01L23/3107 , H01L23/4951 , H01L23/49541 , H01L23/49548 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/16245 , H01L2224/29007 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48471 , H01L2224/4945 , H01L2224/73265 , H01L2224/85191 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/48227
摘要： A semiconductor package exhibiting efficient placement of semiconductor leads in a micro lead frame design is provided. An integrated circuit die is bonded to the top surfaces of leads, thereby allowing the leads to partially reside under the die. As a result, surface area on the bottom surface of the semiconductor package is recaptured. The die can be further bonded a die paddle if so desired. One or more channels can be cut into the bottom surface of the package in order to separate first and second leads. Such channels allow separate leads to be fabricated from a single lead member which is subsequently cut.
摘要翻译：提供了一种在微引线框架设计中显示出半导体引线的有效放置的半导体封装。集成电路管芯结合到引线的顶表面，从而允许引线部分地位于管芯下方。结果，重新获得半导体封装的底表面上的表面积。如果需要，模具可以进一步粘合模片。可以将一个或多个通道切割到包装的底表面中，以分离第一和第二引线。这样的通道允许单独的引线由随后切割的单个引线构件制造。

19. 发明授权

US06876068B1 Semiconductor package with increased number of input and output pins 有权
标题翻译：半导体封装具有输入和输出引脚数量的增加
公开(公告)号：US06876068B1
公开(公告)日：2005-04-05
申请号：US10447012
申请日：2003-05-28
申请人： Choon Heung Lee , Donald C. Foster , Jeoung Kyu Choi , Wan Jong Kim , Kyong Hoon Youn , Sang Ho Lee , Sun Goo Lee
发明人： Choon Heung Lee , Donald C. Foster , Jeoung Kyu Choi , Wan Jong Kim , Kyong Hoon Youn , Sang Ho Lee , Sun Goo Lee
IPC分类号： H01L23/31 , H01L23/495
CPC分类号： H01L24/49 , H01L23/3107 , H01L23/49503 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2221/68377 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49109 , H01L2224/4911 , H01L2224/73265 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least two slots formed therein and extending along respective ones of a pair of the peripheral edge segments thereof. The semiconductor package further comprises a plurality of first leads which are segregated into at least two sets disposed within respective ones of the slots included in the die paddle. In addition to the first leads, the semiconductor package includes a plurality of second leads which are also segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the die paddle in spaced relation thereto. Electrically connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of each of the first and second leads. At least portions of the die paddle, the first and second leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the first leads being exposed in a common exterior surface of the package body.
摘要翻译：根据本发明，提供了一种半导体封装，其包括限定多个外围边缘段的大致平坦的管芯片，并且包括形成在其中的至少两个槽，并沿其一对周边边缘段中的相应的一个延伸。半导体封装还包括多个第一引线，它们分离成设置在包括在管芯焊盘中的各个槽中的至少两个组。除了第一引线之外，半导体封装还包括多个第二引线，它们也分隔成至少两组，其间隔开的关系相对于管芯焊盘的至少两个周边边缘段的相应延伸。电连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到第一和第二引线中的每一个的至少一些。裸片，第一和第二引线和半导体管芯的至少一部分被封装主体封装，裸片焊盘的底表面和第一引线暴露在封装体的公共外表面中。

20. 发明授权

US06812985B1 Liquid crystal display device 有权
标题翻译：液晶显示装置
公开(公告)号：US06812985B1
公开(公告)日：2004-11-02
申请号：US09536629
申请日：2000-03-28
申请人： Young Jin Oh , Kyoung Nam Lim , Dong Hyo Gu , Sang Ho Lee , Min Cheol Shin
发明人： Young Jin Oh , Kyoung Nam Lim , Dong Hyo Gu , Sang Ho Lee , Min Cheol Shin
IPC分类号： G02F113
CPC分类号： G02F1/134363 , G02F2001/136218
摘要： A liquid crystal display device includes a first substrate including a plurality of data bus lines, a plurality of gate bus lines, and a plurality of thin film transistors at cross points of the plurality gate bus lines and the plurality of gate bus lines; a second substrate including a color filter layer; at least one shielding layer for shielding an outer induced electric field; and a liquid crystal layer sandwiched between the first substrate and the second substrate.
摘要翻译：液晶显示装置包括在多个栅极总线和多个栅极总线的交叉点处包括多个数据总线，多个栅极总线和多个薄膜晶体管的第一基板; 包括滤色器层的第二基板; 用于屏蔽外部感应电场的至少一个屏蔽层; 以及夹在第一基板和第二基板之间的液晶层。

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