会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明授权
    • Microfluid driving device
    • 微流体驱动装置
    • US06743636B2
    • 2004-06-01
    • US09863332
    • 2001-05-24
    • Chen-Kuei ChungWei-Jieh ChangChieh-Ling HsiaoKuo-Yao Weng
    • Chen-Kuei ChungWei-Jieh ChangChieh-Ling HsiaoKuo-Yao Weng
    • B01L302
    • F04F5/54B01F13/0059B01F15/0248B01F15/0284B01L3/50273B01L2400/0463B01L2400/0487F04B19/006Y10T436/15Y10T436/25Y10T436/2575
    • A microfluid driving device is provided. The microfluid driving device of this invention comprises microfluid driving platform prepared in a chip, which platform comprises at least two miniature Venturi pumps, at least one microchannel and optionally micro mixers or micro reactors in said microchannel; an external pneumatic flow supply and control module that provides selectively different air flows; and an interface device connecting said microfluid driving platform and said external pneumatic flow supply and control module. The air flows supplied by said the pneumatic flow supply and control module are supplied under selected flow rates and frequencies to said at least two Venturi pumps through said interface device, such that the microfluid inside said microchannel may be driven forward or backward or halt and the transportation, mixing and reaction of the microfluid may be accomplished.
    • 提供微流体驱动装置。 本发明的微流体驱动装置包括在芯片中制备的微流体驱动平台,该平台包括至少两个微型文丘里泵,所述微通道中的至少一个微通道和任选的微混合器或微反应器; 提供选择性地不同气流的外部气流供应和控制模块; 以及连接所述微流体驱动平台和所述外部气动流量供给和控制模块的接口装置。 由所述气流供应和控制模块供应的空气流通过所述接口装置以选定的流量和频率供应到所述至少两个文丘里泵,使得所述微通道内的微流体可以向前或向后或向后或停止, 可以实现微流体的运输,混合和反应。
    • 12. 发明授权
    • Thermolysis reaction actuating pump
    • 热解反应致动泵
    • US06599098B2
    • 2003-07-29
    • US10039371
    • 2001-12-31
    • Kuo-Yao WengChing-Yi Wu
    • Kuo-Yao WengChing-Yi Wu
    • F04B1924
    • F04B19/006F04B19/24
    • A thermolysis reaction actuating pump system including a first set of walls defining a channel having a cross-sectional area less than one millimeter squared, and wherein a liquid is received in the channel. A second set of walls defining a reaction chamber and a thermolytic body carried in the reaction chamber. The first set and second set of walls are constructed and arranged to allow the flow of gas from the reaction chamber into the channel. A heater is positioned to provide heat to the thermolytic body and disassociate the thermolytic body to produce gas to pump the liquid through the channel.
    • 一种热解反应致动泵系统,包括限定具有小于1毫米平方的横截面面积的通道的第一组壁,并且其中在所述通道中接收液体。 限定反应室的第二组壁和承载在反应室中的热解体。 第一组和第二组壁被构造和布置成允许气体从反应室流入通道。 定位加热器以向热解体提供热量,并使热解体解离,产生气体以将液体泵送通过通道。
    • 14. 发明授权
    • Fluidic device
    • 流体装置
    • US07794665B2
    • 2010-09-14
    • US11612882
    • 2006-12-19
    • Kuo-Yao Weng
    • Kuo-Yao Weng
    • G05D9/00
    • B01L3/502715B01L3/50273B01L3/502738B01L2300/0816B01L2400/0406B01L2400/046B01L2400/0683
    • A fluidic device includes a first material defining a first region, a second material defining a second region that is separated from the first region, and a connector coupled between the first region and the second region. The connector includes a brittle material and has an open end and a closed end, the open end being disposed in the second region, the closed end being disposed in the first region. The first region is closed off from the second region by the closed end of the connector. The connector is configured such that when the closed end of the connector is broken, the connector defines a passage from the first region to the second region.
    • 流体装置包括限定第一区域的第一材料,限定与第一区域分离的第二区域的第二材料和连接在第一区域和第二区域之间的连接器。 连接器包括脆性材料,并且具有开口端和封闭端,开口端设置在第二区域中,封闭端设置在第一区域中。 第一区域通过连接器的封闭端从第二区域封闭。 连接器构造成使得当连接器的封闭端断开时,连接器限定从第一区域到第二区域的通道。
    • 18. 发明授权
    • Process for wafer peripheral edge defect reduction
    • 晶圆周边缺陷削减工艺
    • US5879577A
    • 1999-03-09
    • US782710
    • 1997-01-13
    • Kuo-Yao WengYeh-Jye Wann
    • Kuo-Yao WengYeh-Jye Wann
    • H01L21/311H01L21/302
    • H01L21/31144H01L21/31111H01L21/31133
    • A method is described for selectively etching photoresist on a semiconductor substrate having one or more layers of a spin on glass, including an edge bead that was formed when the glass was originally applied. First the wafer is coated with a layer of unexposed, undeveloped negative photoresist. Then, while spinning the wafer, a vertical jet of photoresist EBR solvent is directed to a point just inside the edge so that photoresist gets removed from an annular area extending inwards from the perimeter. The edge bead is then removed using a liquid etchant and integrated circuit processing can now proceed, making use of the unexposed, undeveloped layer of photoresist in the usual way; that is, exposing it through a mask and then developing and baking it before using it as an etch mask. The method is general and may be used in other situations where selective removal of photoresist along the periphery is required and where the remaining resist is to be used for other purposes.
    • 描述了一种用于在具有一层或多层旋涂玻璃上的半导体衬底上选择性蚀刻光致抗蚀剂的方法,包括当最初施加玻璃时形成的边缘珠。 首先,晶片被涂覆有未曝光的未显影的负光致抗蚀剂层。 然后,当旋转晶片时,将光致抗蚀剂EBR溶剂的垂直射流引导到刚好在边缘内部的点,使得光致抗蚀剂从从周边向内延伸的环形区域移除。 然后使用液体蚀刻剂去除边缘珠,现在可以以通常的方式利用未曝光的未开发的光致抗蚀剂层进行集成电路处理; 也就是说,通过掩模曝光,然后在将其用作蚀刻掩模之前将其显影和烘烤。 该方法是通用的,并且可以用于沿着周边选择性去除光致抗蚀剂并且其余抗蚀剂用于其它目的的其它情况。