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    • 11. 发明授权
    • NAND flash memory device having dummy memory cells and methods of operating same
    • 具有虚拟存储单元的NAND闪存器件及其操作方法
    • US07881114B2
    • 2011-02-01
    • US12340250
    • 2008-12-19
    • Ki-Tae ParkJung-Dal ChoiJong-Sun SelYoo-Cheol Shin
    • Ki-Tae ParkJung-Dal ChoiJong-Sun SelYoo-Cheol Shin
    • G11C16/04G11C16/06G11C16/10
    • G11C16/0483G11C16/107G11C16/12G11C16/3445
    • A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.
    • NAND闪速存储器件包括控制电路,其被配置为在编程操作期间将第一字线电压施加到多个串联存储器单元中的未选择的电压,第二字线电压大于第一字线电压 到多个存储单元中的一个选择的一个,以及比第一字线电压低的第三字线电压到与多个存储单元串联连接的虚拟存储单元。 在其他实施例中,控制电路被配置为在与每个擦除操作之间的每个擦除操作之前和/或之后对与其串联的多个存储器单元进行编程。 在其他实施例中,控制电路被配置为在擦除与其串联连接的多个存储器单元时,放弃擦除伪存储器单元。
    • 13. 发明授权
    • Memory cell array structures in NAND flash memory devices
    • NAND闪存器件中的存储单元阵列结构
    • US07470948B2
    • 2008-12-30
    • US11617233
    • 2006-12-28
    • Ki-Tae ParkJung-Dal Choi
    • Ki-Tae ParkJung-Dal Choi
    • H01L29/76
    • H01L27/115H01L27/11521H01L27/11524
    • A NAND-type non-volatile semiconductor memory device includes a gate insulating layer on an active region of a semiconductor substrate, first and second select gate structures on the active region, and a memory gate structure therebetween. The first and second select gate structures respectively include a plurality of select gate patterns, and the memory gate structure includes a plurality of storage gate patterns. The gate insulating layer includes a plurality of openings therein exposing portions of the active region between ones of the plurality of select gate patterns of the first and second select gate structures. The device may further include impurity regions in portions of the active region between the gate patterns, and halo regions adjacent ones of the impurity regions in the portions of the active region exposed by the openings in the gate insulating layer. Related fabrication methods are also discussed.
    • NAND型非易失性半导体存储器件包括在半导体衬底的有源区上的栅极绝缘层,有源区上的第一和第二选择栅极结构以及它们之间的存储栅结构。 第一和第二选择栅极结构分别包括多个选择栅极图案,并且存储器栅极结构包括多个存储栅极图案。 栅极绝缘层包括多个开口,其中将有源区域的部分暴露在第一和第二选择栅极结构的多个选择栅极图案之间。 该器件还可以包括位于栅极图案之间的有源区域的部分中的杂质区域和与栅极绝缘层中的开口暴露的有源区域的部分中的杂质区域相邻的晕圈区域。 还讨论了相关的制造方法。
    • 14. 发明授权
    • Charge trap-type 3-level non-volatile semiconductor memory device and method of driving the same
    • 电荷陷阱型3级非易失性半导体存储器件及其驱动方法
    • US07342827B2
    • 2008-03-11
    • US11341341
    • 2006-01-26
    • Ki-Tae ParkJung-Dal Choi
    • Ki-Tae ParkJung-Dal Choi
    • G11C11/34
    • G11C11/5671
    • Disclosed herein is a charge trap-type 3-level non-volatile semiconductor memory device and method of driving the same. The charge trap-type 3-level non-volatile semiconductor memory device includes a memory array including a plurality of memory elements, each capable of storing data in at least two charge trap regions depending on the direction of current flow, and a page buffer driven to map three data bits to threshold voltage groups of the two charge trap regions. The charge trap-type non-volatile semiconductor memory device has charge trap regions each storing 1.5 bits of data. That is, a single memory element has charge trap regions for storing 3 bits of data, thereby improving device integration while maintaining a high operating speed during programming and reading operations.
    • 本文公开了一种电荷陷阱型3级非易失性半导体存储器件及其驱动方法。 电荷陷阱型3级非易失性半导体存储器件包括存储器阵列,该存储器阵列包括多个存储器元件,每个存储元件能够根据电流的方向存储至少两个电荷陷阱区域中的数据,以及驱动了页缓冲器 将三个数据位映射到两个电荷陷阱区域的阈值电压组。 电荷陷阱型非易失性半导体存储器件具有每个存储1.5位数据的电荷陷阱区。 也就是说,单个存储元件具有用于存储3位数据的电荷陷阱区域,从而在编程和读取操作期间保持高操作速度的同时提高器件集成度。
    • 16. 发明申请
    • Charge trap-type 3-level non-volatile semiconductor memory device and method of driving the same
    • 电荷陷阱型3级非易失性半导体存储器件及其驱动方法
    • US20070030756A1
    • 2007-02-08
    • US11341341
    • 2006-01-26
    • Ki-Tae ParkJung-Dal Choi
    • Ki-Tae ParkJung-Dal Choi
    • G11C7/10
    • G11C11/5671
    • Disclosed herein is a charge trap-type 3-level non-volatile semiconductor memory device and method of driving the same. The charge trap-type 3-level non-volatile semiconductor memory device includes a memory array including a plurality of memory elements, each capable of storing data in at least two charge trap regions depending on the direction of current flow, and a page buffer driven to map three data bits to threshold voltage groups of the two charge trap regions. The charge trap-type non-volatile semiconductor memory device has charge trap regions each storing 1.5 bits of data. That is, a single memory element has charge trap regions for storing 3 bits of data, thereby improving device integration while maintaining a high operating speed during programming and reading operations.
    • 本文公开了一种电荷陷阱型3级非易失性半导体存储器件及其驱动方法。 电荷陷阱型3级非易失性半导体存储器件包括存储器阵列,该存储器阵列包括多个存储器元件,每个存储元件能够根据电流的方向存储至少两个电荷陷阱区域中的数据,以及驱动了页缓冲器 将三个数据位映射到两个电荷陷阱区域的阈值电压组。 电荷陷阱型非易失性半导体存储器件具有每个存储1.5位数据的电荷陷阱区。 也就是说,单个存储元件具有用于存储3位数据的电荷陷阱区域,从而在编程和读取操作期间保持高操作速度的同时提高器件集成度。
    • 17. 发明授权
    • NAND flash memory device having dummy memory cells and methods of operating same
    • 具有虚拟存储单元的NAND闪存器件及其操作方法
    • US08228738B2
    • 2012-07-24
    • US12977419
    • 2010-12-23
    • Ki-Tae ParkJung-Dal ChoiJong-Sun SelYoo-Cheol Shin
    • Ki-Tae ParkJung-Dal ChoiJong-Sun SelYoo-Cheol Shin
    • G11C16/04G11C16/06G11C16/10
    • G11C16/0483G11C16/107G11C16/12G11C16/3445
    • A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith.
    • NAND闪速存储器件包括控制电路,其被配置为在编程操作期间将第一字线电压施加到多个串联存储器单元中的未选择的电压,第二字线电压大于第一字线电压 到多个存储单元中的一个选择的一个,以及比第一字线电压低的第三字线电压到与多个存储单元串联连接的虚拟存储单元。 在其他实施例中,控制电路被配置为在与每个擦除操作之间的每个擦除操作之前和/或之后对与其串联的多个存储器单元进行编程。 在其他实施例中,控制电路被配置为在擦除与其串联连接的多个存储器单元时,放弃擦除伪存储器单元。
    • 19. 发明授权
    • Semiconductor memory device with memory cells on multiple layers
    • 具有多层存储单元的半导体存储器件
    • US07812390B2
    • 2010-10-12
    • US11777293
    • 2007-07-13
    • Ki-Tae ParkJung-Dal ChoiJae-Sung Sim
    • Ki-Tae ParkJung-Dal ChoiJae-Sung Sim
    • H01L25/065H01L27/115
    • H01L27/11551G11C11/5621G11C16/0483G11C2211/5641H01L27/0688H01L27/105H01L27/11526H01L27/11529
    • A semiconductor memory device includes a first substrate having at least one string including a first select transistor, a second select transistor, and first memory cells connected in series between the first and second select transistors of the first substrate. The semiconductor memory device further includes a second substrate having at least one string including a first select transistor, a second select transistor, and second memory cells connected in series between the first and second select transistors of the second substrate. The number of the first memory cells of the at least one string of the first substrate is different from a number of the second memory cells of the at least one string of the second substrate. For example, the number of second memory cells may be less than the number of first memory cells.
    • 半导体存储器件包括具有包括第一选择晶体管,第二选择晶体管和串联连接在第一衬底的第一和第二选择晶体管之间的第一存储单元的至少一个串的第一衬底。 半导体存储器件还包括具有至少一个串的第二衬底,该至少一个串包括串联连接在第二衬底的第一和第二选择晶体管之间的第一选择晶体管,第二选择晶体管和第二存储单元。 第一衬底的至少一个串的第一存储器单元的数量与第二衬底的至少一个串的第二存储单元的数量不同。 例如,第二存储器单元的数量可以小于第一存储器单元的数量。